JPS6255572A - Semiconductor inspecting device - Google Patents

Abstract

PURPOSE:To enable the management of the holding state of a basic function handily, by providing a function of executing a correlation test and an electric checking to a test socket among these as inspector combining a tester and a test handler. CONSTITUTION:An IC to be measured is made to flow from a supply section 1 for ICs being measured of a test handler 11 to a test head section 2 of a test handler 11 to test, classified by a sorting section 3 and runs to an accepted ICs storage section and a defective ICs storage section 5. Then, an IC passage/ distribution part 12 lets the IC pass from the supply section 1 according to a command from a controller to be set at a test socket section 13, where it is tested and sent to the sorting section 3. Or it let a reference sample IC from a reference sample setting section 7 pass to be set at the test socket 13, where it is tested and returned to the original position via the same route. This enables automatic checking not only to a tester 6 but also to test head section 2, thereby allowing the constant management of a basic function.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor testing device, and is particularly used in an automatic testing device combined with a test handler (semiconductor transport device).

[Technical background of the invention and its problems]

Conventionally, in the testing process of a semiconductor manufacturing factory, a tester electrically measures an IC (integrated circuit) as a semiconductor product, a test head section transfers the IC to be measured,
A test is performed after inserting the product into a test socket, and a test handler that classifies the product into good and defective products based on the classification signal from the tester is combined to efficiently perform automatic inspection. That is, as shown in FIG. 3, for example, ICs are sequentially supplied from the IC to be measured supply section 1 to the test head section 2, and after being inserted into the test socket in the test head section 2, the tester 6 performs the measurement. 3 indicates the classification section, test good products,
After classifying the defective products, they are sorted into a good IC storage section 4 or a defective RC storage section 5.

By the way, the basic function of the test process is to correctly sort the ICs to be inspected into non-defective and defective products.To do this, the tester, which is the inspection device, must operate normally, and the IC to be inspected and the tester must be electrically connected. It is necessary that it is set correctly. In order to maintain this basic function stably,
It is common for inspection equipment to have the following management items.

(A) Management items for normal operation of the tester - Provide a self-diagnosis function in the tester and check the test function.

■Check whether the tester maintains the same level of measurement accuracy as the standard tester by periodically running multiple standard samples measured by the standard tester and comparing the measurement results (correlation test ).

(B) Management of whether the test socket, IC under test, and tester are electrically connected ■ Manage the test socket by the number of times it is used and replace it.

The above management items are set and managed by the user who uses the inspection equipment to measure the IC. If the management items are not set, the inspection function will not be maintained stably, and good products may be defective. If the product is sorted as a good product and the yield υ is lowered, or vice versa, there will be a problem of contamination with defective products, which can occur at critical times. In addition, if you try to maintain the inspection equipment stably by establishing the above-mentioned control items, in order to periodically perform the correlation test in (A) above, it is necessary to prepare a standard measurement sample and manage it somewhere. The work required to set and run the standard sample on the test handler is different from the normal routine testing process work and involves a lot of troublesome work.

In order to maintain the basic functions of the inspection equipment stably in this way, separate work must be added for each control item, and as the frequency of checks and checks increases, the inspection ability (caggage tee) as a tester will also increase. There was a downside that caused it to go down. Also above)
Currently, as shown in (2), direct electrical connection between the test socket and the IC under test is not managed. Furthermore, one of the major causes of failures in current testing equipment is incomplete electrical contact between the test socket and the IC under test, either due to deterioration of the test socket or the mechanical transfer adjustment section of test node 2. However, statistical data shows that there are many cases in which good products are measured as defective, and this has become a bottleneck in maintaining the stability of inspection equipment.

[Purpose of the invention]

The present invention provides electrical checks for correlation tests and test tests among the above-mentioned management items, not as separate tasks, but as a function of an inspection device that combines a tester and a test handler, so that they are automatically and periodically carried out. By doing so, it is intended to provide a semiconductor inspection device that can easily manage whether basic functions are stably maintained.

[Summary of the invention]

As a mechanical mechanism of the test handler, the present invention has a function that can set and reset a standard sample IC in the test socket in the test head section through a separate route, automatically inserts the standard sandal IC directly into the test socket, and correlates the tester. Che.

In addition, a contact check to determine whether the IC under test and the socket are stably electrically connected is directly performed using a real mechanical mechanism and a real socket.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a configuration diagram of the same embodiment, but since the configurations of the tester 6 and test node 211 correspond to those in Figure 3, corresponding parts are given the same reference numerals. The explanation will be omitted, and the main features will be explained. The feature of this embodiment is that in addition to the configuration shown in FIG. 3 described in the conventional example, a standard sample setting section 7 is added. That is, ICs to be measured as normal products flow from a supply section 1 to a test head section 2 where a test socket is provided, are tested, and then flow to a sorting section 3. In addition to this flow, standard sample 7
The standard sample IC is inserted into the test socket of the test head section 2, tested, and then returned to the standard sample set section 7 as a function.

Figure 2 shows the standard sample setting section 7 and test head section 2.
This figure shows the flow of the IC. Reference numeral 12 designates an IC passage section for passing either a normal IC to be measured from the IC to be measured supply section 1 or a standard sample IC, and 13 a test socket. The above-mentioned IC passage section 12 is usually the IC to be measured.
Pass the IC from the supply section 1 and set it in the test socket section 13 to perform a test, and send it to the sorting section 3, or pass the standard sample IC from the standard sample setting section 7 through the section 12 and place it in the test socket. It is used when setting it in the standard sample setting section 13 for testing and returning it to the standard sample setting section 7 via the same route. Control for this purpose is assumed to be performed by commands from a control device (not shown).

In addition to the normal test flow as described above, it is necessary to provide a function to perform standard sample tests by synchronized operation of the tester and test handler periodically or at any time. The basic functions of a semiconductor inspection device can be constantly managed by automatically performing the above checks.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to periodically check the standard sample, check the basic functions of the inspection device, and ensure that the inspection device operates stably and correctly. By providing a separate route to the section (standard sample set section), standard samples can be taken out with simple operations and correlation tests (calibrations) can be performed at any time.
can be done. In addition, as an inspection device, it can check not only the tester but also the test socket part, so it can be used to check whether the product is defective, the tester is out of order, the test socket, etc. is defective, or the cause is defective in the do part. It is possible to clearly distinguish between the two.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention, FIG. 2 is a more detailed configuration diagram of the same configuration, and FIG. 3 is a configuration diagram of a conventional device. 1... IC supply part to be measured, 2... Test head part,
3... Classification section, 6... Tester, 7... Standard sample set section, 11... Test driver, 12...
The IC passing section is section 13...Test socket section ◎Applicant's agent Patent attorney Takehiko Suzue Figure 3

Claims (2)

[Claims] (1) In a semiconductor testing device equipped with a semiconductor transport device that transports a semiconductor product to be tested to a measurement position of a semiconductor testing device that measures the electrical characteristics of a semiconductor product, a holding section that holds a specific semiconductor product, and a means for positioning the semiconductor product from the holding section to the measurement position and transferring the specific semiconductor product from the measurement position to the holding section;
1. A semiconductor testing device, characterized in that it is provided separately from a transport means for a normal semiconductor product to be tested, so that the specific semiconductor product can be taken out from the holding section and tested. (2) The semiconductor testing device according to claim 1, wherein the holding section is a standard sample setting section for the semiconductor product, and the measurement position is a test head section.