JPS6255346U - - Google Patents
Info
- Publication number
- JPS6255346U JPS6255346U JP14716485U JP14716485U JPS6255346U JP S6255346 U JPS6255346 U JP S6255346U JP 14716485 U JP14716485 U JP 14716485U JP 14716485 U JP14716485 U JP 14716485U JP S6255346 U JPS6255346 U JP S6255346U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- pattern
- soldered
- dissipation mechanism
- another
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716485U JPS6255346U (de) | 1985-09-25 | 1985-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14716485U JPS6255346U (de) | 1985-09-25 | 1985-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255346U true JPS6255346U (de) | 1987-04-06 |
Family
ID=31060278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14716485U Pending JPS6255346U (de) | 1985-09-25 | 1985-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255346U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687303A (zh) * | 2012-09-11 | 2014-03-26 | Ls产电株式会社 | 功率半导体器件和pcb 的联接组件及其制造方法 |
| JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |
-
1985
- 1985-09-25 JP JP14716485U patent/JPS6255346U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687303A (zh) * | 2012-09-11 | 2014-03-26 | Ls产电株式会社 | 功率半导体器件和pcb 的联接组件及其制造方法 |
| JP2014057066A (ja) * | 2012-09-11 | 2014-03-27 | Lsis Co Ltd | 電力素子とｐｃｂとの結合アセンブリー及びその製造方法 |
| JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |