JPS6252992U - - Google Patents
Info
- Publication number
- JPS6252992U JPS6252992U JP1985145282U JP14528285U JPS6252992U JP S6252992 U JPS6252992 U JP S6252992U JP 1985145282 U JP1985145282 U JP 1985145282U JP 14528285 U JP14528285 U JP 14528285U JP S6252992 U JPS6252992 U JP S6252992U
- Authority
- JP
- Japan
- Prior art keywords
- diode
- field effect
- effect transistor
- inverter device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Electronic Switches (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985145282U JPS6252992U (sr) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985145282U JPS6252992U (sr) | 1985-09-24 | 1985-09-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6252992U true JPS6252992U (sr) | 1987-04-02 |
Family
ID=31056677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985145282U Pending JPS6252992U (sr) | 1985-09-24 | 1985-09-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6252992U (sr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02290098A (ja) * | 1989-02-10 | 1990-11-29 | Fuji Electric Co Ltd | インバータ装置 |
WO2013136623A1 (ja) * | 2012-03-13 | 2013-09-19 | 富士電機株式会社 | 電力変換器及びその制御装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761985B2 (sr) * | 1975-10-11 | 1982-12-27 | Mitsubishi Electric Corp |
-
1985
- 1985-09-24 JP JP1985145282U patent/JPS6252992U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761985B2 (sr) * | 1975-10-11 | 1982-12-27 | Mitsubishi Electric Corp |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02290098A (ja) * | 1989-02-10 | 1990-11-29 | Fuji Electric Co Ltd | インバータ装置 |
WO2013136623A1 (ja) * | 2012-03-13 | 2013-09-19 | 富士電機株式会社 | 電力変換器及びその制御装置 |
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