JPS6252992U - - Google Patents

Info

Publication number
JPS6252992U
JPS6252992U JP1985145282U JP14528285U JPS6252992U JP S6252992 U JPS6252992 U JP S6252992U JP 1985145282 U JP1985145282 U JP 1985145282U JP 14528285 U JP14528285 U JP 14528285U JP S6252992 U JPS6252992 U JP S6252992U
Authority
JP
Japan
Prior art keywords
diode
field effect
effect transistor
inverter device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985145282U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985145282U priority Critical patent/JPS6252992U/ja
Publication of JPS6252992U publication Critical patent/JPS6252992U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
    • H10W72/5473Dispositions of multiple bond wires multiple bond wires connected to a common bond pad

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electronic Switches (AREA)
JP1985145282U 1985-09-24 1985-09-24 Pending JPS6252992U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985145282U JPS6252992U (enFirst) 1985-09-24 1985-09-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985145282U JPS6252992U (enFirst) 1985-09-24 1985-09-24

Publications (1)

Publication Number Publication Date
JPS6252992U true JPS6252992U (enFirst) 1987-04-02

Family

ID=31056677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985145282U Pending JPS6252992U (enFirst) 1985-09-24 1985-09-24

Country Status (1)

Country Link
JP (1) JPS6252992U (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (ja) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd インバータ装置
WO2013136623A1 (ja) * 2012-03-13 2013-09-19 富士電機株式会社 電力変換器及びその制御装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761985B2 (enFirst) * 1975-10-11 1982-12-27 Mitsubishi Electric Corp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5761985B2 (enFirst) * 1975-10-11 1982-12-27 Mitsubishi Electric Corp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290098A (ja) * 1989-02-10 1990-11-29 Fuji Electric Co Ltd インバータ装置
WO2013136623A1 (ja) * 2012-03-13 2013-09-19 富士電機株式会社 電力変換器及びその制御装置

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