JPS6251704B2 - - Google Patents
Info
- Publication number
- JPS6251704B2 JPS6251704B2 JP59235359A JP23535984A JPS6251704B2 JP S6251704 B2 JPS6251704 B2 JP S6251704B2 JP 59235359 A JP59235359 A JP 59235359A JP 23535984 A JP23535984 A JP 23535984A JP S6251704 B2 JPS6251704 B2 JP S6251704B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- soldering
- tip
- sheath
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 19
- 229910001220 stainless steel Inorganic materials 0.000 claims description 16
- 239000010935 stainless steel Substances 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 claims description 15
- 239000010959 steel Substances 0.000 claims description 15
- 230000035945 sensitivity Effects 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 2
- 230000004044 response Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 16
- 239000002131 composite material Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000002788 crimping Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003670 easy-to-clean Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23535984A JPS60121066A (ja) | 1984-11-09 | 1984-11-09 | 半田器具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23535984A JPS60121066A (ja) | 1984-11-09 | 1984-11-09 | 半田器具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60121066A JPS60121066A (ja) | 1985-06-28 |
| JPS6251704B2 true JPS6251704B2 (nl) | 1987-10-31 |
Family
ID=16984915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23535984A Granted JPS60121066A (ja) | 1984-11-09 | 1984-11-09 | 半田器具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121066A (nl) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875441A (nl) * | 1971-03-08 | 1973-10-11 | ||
| JPS4979572A (nl) * | 1972-12-05 | 1974-08-01 | ||
| JPS5364647A (en) * | 1976-11-19 | 1978-06-09 | Fortune William S | Solder instrument |
-
1984
- 1984-11-09 JP JP23535984A patent/JPS60121066A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875441A (nl) * | 1971-03-08 | 1973-10-11 | ||
| JPS4979572A (nl) * | 1972-12-05 | 1974-08-01 | ||
| JPS5364647A (en) * | 1976-11-19 | 1978-06-09 | Fortune William S | Solder instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60121066A (ja) | 1985-06-28 |
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