JPS6251511B2 - - Google Patents
Info
- Publication number
- JPS6251511B2 JPS6251511B2 JP57056832A JP5683282A JPS6251511B2 JP S6251511 B2 JPS6251511 B2 JP S6251511B2 JP 57056832 A JP57056832 A JP 57056832A JP 5683282 A JP5683282 A JP 5683282A JP S6251511 B2 JPS6251511 B2 JP S6251511B2
- Authority
- JP
- Japan
- Prior art keywords
- container
- light receiving
- resin
- sealing
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000009412 basement excavation Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
この発明は堀削機用レーザ式堀削方向制御装置
などに使用される受光装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a light receiving device used in a laser type excavation direction control device for excavation machines.
この種の受光装置は、堀削機の先導管の頭部に
設けられ、レーザ光線を受けてこれを電気信号に
変換する作用をなすもので、堀削機の稼動中は大
地に堀削された水分や湿気の多いトンネル内にあ
るため、内蔵する受光部や回路部に対する防水性
や耐湿性が要求される。 This type of light receiving device is installed at the head of the lead pipe of the excavator and has the function of receiving laser beams and converting them into electrical signals. Because the device is located inside a tunnel with a lot of water and moisture, the built-in light receiving section and circuit section must be waterproof and moisture resistant.
従来一般にこの種の受光装置としては、つぎに
述べる方法で内蔵部分に防水性や耐湿性を持たせ
ていた。すなわち一方が開口せる有底容器の内部
に回路部および受光部を収納し、受光部の受光面
が容器の開口側に最も近いように配置した。そし
てこの容器内部に空間を残さぬように樹脂を注入
した。注入する樹脂は回路部周辺は不透明、半透
明（たとえばエポキシ樹脂）でもよいが、少なく
とも受光部の受光面側は透明度の良好な樹脂（た
とえばシリコン系樹脂、ウレタン系樹脂）を使用
しなければならない。次に容器の開口側は封止部
材（たとえばゴムパツキンなど）を介して透明ガ
ラス板にて閉塞した。このような構造の受光装置
によれば、レーザ光線は前記透明ガラス板を通り
次に透明性の注入樹脂を通過して受光部の受光面
に入光することができる。そして内蔵せる受光
部、回路部の防水性の耐湿性は、一次的には透明
ガラス板にて封止された個所で維持され、若しこ
の個所での防水性、耐湿性が失われても、二次的
には受光部、回路部の周辺に注入された樹脂によ
つて維持されるというものである。 Conventionally, this type of light-receiving device has generally had its built-in portion made waterproof and moisture-resistant by the method described below. That is, the circuit section and the light receiving section were housed inside a bottomed container with one side open, and arranged so that the light receiving surface of the light receiving section was closest to the opening side of the container. Then, resin was injected into the container without leaving any space. The resin to be injected may be opaque or semi-transparent (e.g. epoxy resin) around the circuit area, but resin with good transparency (e.g. silicone resin, urethane resin) must be used at least on the light-receiving surface side of the light-receiving part. . Next, the open side of the container was closed with a transparent glass plate via a sealing member (for example, a rubber gasket). According to the light receiving device having such a structure, the laser beam can pass through the transparent glass plate, then through the transparent injection resin, and enter the light receiving surface of the light receiving section. The waterproof and moisture resistance of the built-in light receiving section and circuit section is temporarily maintained in the area sealed with a transparent glass plate, even if the waterproofness and moisture resistance of this area is lost. , and secondarily, it is maintained by resin injected around the light receiving section and the circuit section.
しかしながら上述した全注入法による構造は、
受光盤内を全て樹脂で封止する為防水性、耐湿性
には優れているが、次に述べる欠点を有してい
る。すなわちその欠点とは、
(1) 注入樹脂の使用量が多いため製造コストが高
価となる。 However, the structure based on the above-mentioned all-injection method,
Since the entire interior of the light receiving panel is sealed with resin, it is excellent in waterproofness and moisture resistance, but it has the following drawbacks. That is, the disadvantages are: (1) The manufacturing cost is high because a large amount of injection resin is used.
(2) 透明度の良い樹脂は、一般に樹脂の熱膨張係
数が大きいので、温度変化による樹脂の熱膨張
に起因して熱反応が被注入品（受光部など）に
加わり、被注入品を破損する可能性が有る。(2) Resin with good transparency generally has a large coefficient of thermal expansion, so the thermal expansion of the resin due to temperature changes may cause a thermal reaction to be applied to the injected item (light receiving part, etc.), causing damage to the injected item. There is a possibility.
ということである。That's what it means.
この発明は上述した欠点を除去して、安価な製
造コストで、しかも熱信頼性の高い樹旨注入方法
を提供することを目的とし、この目的達成のた
め、注入樹脂が少なくて済み、しかも樹脂が熱膨
張しても被注入品が破損されないように受光盤の
製造方法を改良した。すなわち、容器の底部に近
い位置に回路部を収納し、続いてこの回路部と間
隔を隔てた位置に受光部を装置したのち容器開口
部を封止部材を介して透明ガラス板にて閉塞し、
この容器の底部が上側に、透明ガラス板側が下側
になる状態で、容器側壁の底部に近い位置に設け
られた注入口より透明樹脂を注入し、容器側壁に
おける前記受光部と前記回路部との中間位置に設
けられたオーバーフローより流出した時点で透明
樹脂の注入を止め、注入された透明樹脂を硬化さ
せたのち前記注入口とオーバーフロー口を封止す
る。 The purpose of this invention is to eliminate the above-mentioned drawbacks and provide a resin injection method that is inexpensive to manufacture and has high thermal reliability. The manufacturing method of the light receiving plate has been improved so that the injected product will not be damaged even if it expands thermally. That is, the circuit section is housed near the bottom of the container, the light receiving section is installed at a distance from the circuit section, and the opening of the container is closed with a transparent glass plate via a sealing member. ,
With the bottom of the container facing upward and the transparent glass plate side facing downward, transparent resin is injected through the injection port provided near the bottom of the side wall of the container, and the light receiving section and the circuit section on the side wall of the container are injected. The injection of the transparent resin is stopped when it flows out from an overflow provided at an intermediate position, and after the injected transparent resin is cured, the injection port and the overflow port are sealed.
以下この発明の実施例を図面に基づいて説明す
る。図に示すのは、この発明の一実施例である受
光装置の縦断面図である。まず容器１の構造は一
方が開口して他方には底部１ａがあり、側壁１ｂ
の底部１ａに近い位置にめねじをもつた注入口１
b1を有し、開口部に近い側で後述する受光部と回
路部との中間位置にめねじをもつたオーバフロー
口１b2を有している。容器１の内部の底部１ａに
は内蔵品を取付けるための取付座１ｃが複数個所
あり、また側壁１ｂの外側には後述する枠体を取
付けるため取付片１ｄが複数個所に設けてある。
この容器１に内蔵品を収納するには、まず第１の
回路部２（２ａ：回路基板、２ｂ：電子部品）を
間隔管３１を介して置き、次に第２の回路部４
（４ａ：回路基板、４ｂ：電子部品）を間隔管３
２を介して置き、続いて受光部５（５ａ：受光部
基板、５ｂ：受光素子）を間隔管３３を介して受
光面（受光素子５ｂ側）を容器１の開口側に近く
なるように置く。そしてこれらは図に示すように
ねじ６で取付座１ｃにとも締めして固定した。次
にこの容器１の開口側の側壁１ｂ端面を封止用パ
ツキン（たとえばゴムパツキン）７を介して透明
ガラス板８にて閉塞し、この透明ガラス板８は中
央に空間部のある額縁状の枠体９によりねじ１０
にて取付片１ｄに取付けた。このようにして組立
てた容器１は図に示すように底部１ａが上側に、
透明ガラス板８側が下側になる状態にしておい
て、樹脂の注入を行なう。すなわち注入口１b1よ
り透明度の良い樹脂（たとえばシリコン系樹脂、
ウレタン系樹脂）を注入すると１１のように樹脂
が溜まる。透明樹脂１１がオーバーフロー口１b2
より流出した時点で樹脂の注入を止め、恒温槽な
どを使用して注入された樹脂を硬化させる。続い
て容器１内部空間を十分乾燥させた後、注入口１
b1とオーバーフロー口１b2のめねじ部に、封止剤
を塗布または封止テープを巻回したおねじ（図示
せず）をねじ込んで封止し、さらにその上に封止
用樹脂を注入してシーリングを行なうものであ
る。 Embodiments of the present invention will be described below based on the drawings. What is shown in the figure is a longitudinal sectional view of a light receiving device that is an embodiment of the present invention. First, the structure of the container 1 is that one side is open, the other side has a bottom 1a, and a side wall 1b.
Inlet 1 with a female thread near the bottom 1a of the
b 1 , and has an overflow port 1b 2 with a female thread at an intermediate position between a light receiving section and a circuit section, which will be described later, on the side closer to the opening. There are a plurality of mounting seats 1c on the inside bottom 1a of the container 1 for mounting built-in items, and a plurality of mounting pieces 1d are provided on the outside of the side wall 1b for mounting a frame body to be described later.
To store built-in items in this container 1, first place the first circuit section 2 (2a: circuit board, 2b: electronic components) through the spacer tube 31 , then place the second circuit section 4.
(4a: circuit board, 4b: electronic components) into the spacer tube 3
2 , and then place the light receiving section 5 (5a: light receiving section substrate, 5b: light receiving element) through the spacer tube 33 so that the light receiving surface (light receiving element 5b side) is close to the opening side of the container 1. put. These were then fixed by tightening them to the mounting seat 1c with screws 6 as shown in the figure. Next, the end face of the side wall 1b on the opening side of this container 1 is closed with a transparent glass plate 8 via a sealing gasket (for example, a rubber gasket) 7, and this transparent glass plate 8 is formed into a frame-like frame with a space in the center. Screw 10 by body 9
It was attached to the mounting piece 1d using the following steps. The container 1 assembled in this way has the bottom 1a facing upward as shown in the figure.
The resin is injected with the transparent glass plate 8 facing downward. In other words, resin with better transparency than injection port 1b 1 (for example, silicone resin,
When injecting urethane resin), the resin accumulates as shown in 11. Transparent resin 11 is overflow port 1b 2
Stop injecting the resin once it has flowed out, and use a constant temperature bath or the like to harden the injected resin. Next, after sufficiently drying the inner space of the container 1, the inlet 1
Screw the male screws (not shown) coated with sealant or wrapped with sealing tape into the female threads of b 1 and overflow port 1b 2 to seal them, and then inject sealing resin on top of them. Sealing is performed by
以上述べた本発明による受光装置は容器内の受
光部週辺にのみ樹脂注入を行なつて容器の開口部
を封止した構造なので容器の空間に置かれた回路
部を防水性、耐湿性が維持でき、従来の樹脂全モ
ールドの場合と同程度の防水性、耐湿性を有す
る。しかも樹脂の使用量が少なくなつて製造コス
トが低減でき樹脂が熱膨張しても前記容器に空間
を有するのでその体積増量分は空間に逃げ、被注
型品（受光部）を破損することもない。 The light-receiving device according to the present invention described above has a structure in which resin is injected only into the light-receiving part of the container to seal the opening of the container, so that the circuit section placed in the space of the container is waterproof and moisture-resistant. It has the same level of waterproofness and moisture resistance as conventional all-resin molds. In addition, the amount of resin used is reduced, which reduces manufacturing costs.Even if the resin thermally expands, the container has a space, so the volume increase escapes into the space, and the molded product (light receiving part) may be damaged. do not have.
図は本発明の一実施例である受光装置の縦断面
図である。
１：容器、１ａ：底部、１ｂ：側壁、１b1：注
入口、１b1：オーバーフロー口、１ｄ：取付片、
２，４：回路部、５：受光部、７：封止部材（封
止用パツキン）、８：透明ガラス板、９：枠体、
１０：ねじ、１１：透明樹脂。
The figure is a longitudinal sectional view of a light receiving device that is an embodiment of the present invention. 1: Container, 1a: Bottom, 1b: Side wall, 1b 1 : Inlet, 1b 1 : Overflow port, 1d: Mounting piece,
2, 4: circuit section, 5: light receiving section, 7: sealing member (sealing packing), 8: transparent glass plate, 9: frame body,
10: Screw, 11: Transparent resin.
Claims (1)
に近い位置に回路部を収納し、続いてこの回路部
と間隔を隔てた位置に受光部を装着したのち容器
開口部を封止部材を介して透明ガラス板にて閉塞
し、この容器の底部が上側に、透明ガラス板側が
下側になる状態で、容器側壁の底部に近い位置に
設けられた注入口より透明樹脂を前記容器内部に
注入し、前記樹脂が容器側壁における前記受光部
と前記回路部との中間位置に設けられたオーバー
フロー口より流出した時点で透明樹脂の注入を止
め、注入された透明樹脂を硬化させたのち前記注
入口とオーバーフロー口を封止することを特徴と
する受光装置の製造方法。 ２ 特許請求の範囲第１項記載の方法において、
注入口およびオーバーフロー口を封止する手段と
して注入口およびオーバーフロー口の内周にめね
じ部を設け、このめねじ部に封止剤を付着したお
ねじを螺合して閉塞し、さらにその上に封止用樹
脂を注入してシーリングを行うことを特徴とする
受光装置の製造方法。[Claims] 1. A circuit section is stored in a bottomed container that can be opened on one side at a position close to the bottom of the container, and then a light receiving section is installed at a position spaced apart from the circuit section, and then the container is opened. The container is closed with a transparent glass plate via a sealing member, and with the bottom of the container facing upward and the transparent glass plate side facing downward, a transparent injection port is inserted through the injection port provided near the bottom of the side wall of the container. A resin is injected into the container, and when the resin flows out from an overflow port provided at an intermediate position between the light receiving section and the circuit section on the side wall of the container, the injection of the transparent resin is stopped, and the injected transparent resin is discharged. A method of manufacturing a light receiving device, comprising sealing the injection port and the overflow port after curing. 2. In the method described in claim 1,
As a means of sealing the inlet and overflow port, a female thread is provided on the inner periphery of the inlet and overflow port, a male thread coated with a sealant is screwed into this female thread to close it, and then A method of manufacturing a light receiving device, characterized in that sealing is performed by injecting a sealing resin into the light receiving device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57056832A JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57056832A JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58173875A JPS58173875A (en) | 1983-10-12 |
| JPS6251511B2 true JPS6251511B2 (en) | 1987-10-30 |
Family
ID=13038353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57056832A Granted JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173875A (en) |
-
1982
- 1982-04-06 JP JP57056832A patent/JPS58173875A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58173875A (en) | 1983-10-12 |
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