JPS58173875A - Manufacture of light receptor device - Google Patents
Manufacture of light receptor deviceInfo
- Publication number
- JPS58173875A JPS58173875A JP57056832A JP5683282A JPS58173875A JP S58173875 A JPS58173875 A JP S58173875A JP 57056832 A JP57056832 A JP 57056832A JP 5683282 A JP5683282 A JP 5683282A JP S58173875 A JPS58173875 A JP S58173875A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- container
- light receiving
- injected
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 2
- 230000008961 swelling Effects 0.000 abstract 2
- 125000006850 spacer group Chemical group 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は堀削機用し〜ザ式権削方−制御装置などに使
用される受光装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a light receiving device used in a control device for excavating machines and the like.
この種の受光装置は、１ＩｊＡＮ機の先導管の頭部に設
けられ、レーザ光−を受けてこれを電気信号に変換する
作用をなすもので、５ｙｉａ機の稼動中は大地圧堀制さ
れた水分や湿気の多いトンネル内にあるため、内蔵する
受光部や回路部に対する防水性や耐湿性が要求される。This type of light receiving device is installed at the head of the lead tube of the 1IjAN machine, and has the function of receiving laser light and converting it into an electrical signal. Since it is located inside a tunnel with a lot of water and humidity, the built-in light receiving section and circuit section must be waterproof and moisture resistant.
従来一般にこの種の受光装置としては、っぎに述べる方
法で内蔵部分に防水性や耐湿性を持たせていた。すなわ
ち一方が開口せる有底容器の内部に回路部および受光部
を収納し、受光部の受光面が容器の開口側に最も近いよ
うに配置した。そしてこの容器内部に空間を残さぬよう
に樹脂を注入した。注入する樹脂は回路部周辺は不透明
、牛透明（たとえばエボキン樹脂）でもよいが、少なく
とも受光部の受光面側は透明度の良好な樹脂（たとえば
シリコン系樹脂、ウレタン系樹脂）を使用しなければな
らない。次に容器の開口側は封止部材（たとえばゴムパ
ツキンなど）を介して透明ガラス板にて閉塞した。この
ような構造の受光装置によれば、レーザ光線は前記透明
ガラス板を通り次に透明性の注入樹脂を通過して受光部
の受光面に入党することができる。そして内蔵せる受光
部。Conventionally, this type of light-receiving device has generally had its built-in portion waterproof and moisture-resistant using the method described in section 3. That is, the circuit section and the light receiving section were housed inside a bottomed container with one side open, and arranged so that the light receiving surface of the light receiving section was closest to the opening side of the container. Then, resin was injected into the container without leaving any space. The resin to be injected may be opaque around the circuit area or transparent (e.g. Evokin resin), but resin with good transparency (e.g. silicone resin, urethane resin) must be used at least on the light-receiving surface side of the light-receiving part. . Next, the open side of the container was closed with a transparent glass plate via a sealing member (for example, a rubber gasket). According to the light receiving device having such a structure, the laser beam can pass through the transparent glass plate and then through the transparent injected resin to enter the light receiving surface of the light receiving section. And a built-in light receiving section.
回路部の防水性、耐湿性は、−次的には透明ガラス板に
て封止された個所で維持され、若しこの個所での防水性
、耐湿性が失われても、二次的には受光部９回路部の周
辺に注入された樹脂によって維持されるというものであ
る。The waterproofness and moisture resistance of the circuit section is maintained in the area sealed with a transparent glass plate, and even if the waterproofness and moisture resistance in this area are lost, it will be maintained secondary. is maintained by resin injected around the light receiving section 9 circuit section.
しかしながら上述した全注入法による構造は、受光盤内
を全て樹脂で封止する為防水性、耐湿性には優れている
が、次に述べる欠点を有している。However, the structure based on the above-mentioned all-injection method has excellent waterproofness and moisture resistance because the interior of the light receiving panel is entirely sealed with resin, but has the following drawbacks.
すなわちその欠点とは、
１）注入樹脂の使用量が多いため製造コストが高価とな
る。That is, the disadvantages are as follows: 1) The manufacturing cost is high because the amount of injection resin used is large.
２）透明度の真い樹脂は、一般に＠脂の熱１１彊係数が
大きいので、温度変化による樹脂の熱膨張に起因して熱
応力が被注入品（受光部など）Ｋ加わり、被注入品を破
損する可能性が有る。2) Truly transparent resins generally have a large thermal 11j coefficient, so thermal stress is applied to the injected part (light receiving part, etc.) due to thermal expansion of the resin due to temperature changes, causing damage to the injected part. There is a possibility of damage.
ということである。That's what it means.
この発明は上述した欠点を除去して、安価な製造コスト
で、しかも熱信麺性の高い樹脂注入方法を提供すること
を目的とし、この目的達成のため、注入樹脂が少なくて
済み、しかも樹脂が熱膨張しても被注入品が破損されな
いよ５に受光盤の襄遣方法を改良した。すなわち、容器
の底部に近い位ｔＩＩＫ回路部を収納し、続いてこの回
路部と間隔を隔てた位置に受光部を装置したのち容器開
口部を封止部材を介して透明ガラス板にて閉塞し、この
容器の底部が上側に、透明ガラス板側が下＠になる状態
で、容器側壁の底部に近い位置に設けられた注入口より
透明樹脂を注入し、容器側ＩＩｋおける前記受光部と前
記回路部との中間位置に設けられたオーバーフロー口よ
り流出した時点で透明樹脂の注入を止め、注入された透
明樹脂を硬化させたのち前記注入口とオーバーフロー口
を封止する。The purpose of this invention is to eliminate the above-mentioned drawbacks and provide a resin injection method that is inexpensive to manufacture and has high heat-reliability. 5. The method for storing the light receiving plate has been improved so that the injected product will not be damaged even if it thermally expands. That is, the tIIK circuit section is housed near the bottom of the container, and then the light receiving section is installed at a position spaced apart from this circuit section, and then the opening of the container is closed with a transparent glass plate via a sealing member. , With the bottom of this container facing upward and the transparent glass plate side facing downward, transparent resin is injected through an injection port provided at a position close to the bottom of the side wall of the container, and the light receiving section and the circuit on the container side IIk are injected. The injection of the transparent resin is stopped when the transparent resin flows out from the overflow port provided at an intermediate position between the injection port and the overflow port, and after the injected transparent resin is cured, the injection port and the overflow port are sealed.
以下この発明の実施例を図ＷｊＪＫ基づいて説明する０
図に示すのは、この発明の一実施例である受光装置の縦
断面図である。まず容器１の構造は一方が開口して他方
には底部１ｍがあり、側壁１ｂの底部１ａＫ近い位置に
めねじをもった注入口ｌｂｌ を有し、′開口部に近い
側で後述する受紫部と回路部との中間位置にめねじをも
ったオーバ７四−口ｌｂｇを有している。容器１の内部
のＪ＆部１ｍ Ｋは内蔵品を取付けるための取付座１ｃ
が複数個所あり、また儒ｌ１ｌｂの外ｌＩｌには後述す
る枠体を取付けるための取付片１ｄが複数個所に設けで
ある。この容ｓｌｋ内蔵品を収納するＫは、まず第１の
回路部２（２ｍ：（ハ）路基板、２ｂ ＝電子部品）を
間隔管３１を介して置き、次に第２の回路部４（４ａ：
Ｉ回路基板、４ｂ ：電子部品）を間隔管３２を介して
置き、続いて受光部５（５ａ：受光部基板、５ｂ ：受
光素子）を間隔管３３を介して受光面（受光素子５ｂ儒
）を容器１の開口側に近くなるように置く。゛そしてこ
れらは図に示すよ５にねじ６で取付座ｌｃ Ｋとも締め
して固定した。次にこの容器１の開口側の側壁１ｂ端面
を封止用パツキン（たとえばゴムパツキン）７を介して
透明ガラス板８にて閉塞し、この透明ガラス板８は中央
に空関部のある額縁状の枠体９によりねじＩＯＫて取付
片１ｄｋ取付けた。このようにして組立てた容器１はｒ
ｌＡＫ示すように底部１Ｍが上側ｋ、透明ガラス板８備
が下側になる状ＩＩＫしておいて、樹脂の注入を行なう
。すなわち注入口ｌｂ１ より透明度の良い樹脂（たと
えばシリコン系樹脂、ウレタン系樹脂）を注入すると１
１のように樹脂が溜まる。透明樹脂１１がオーバー７四
−口ｌｂ２ より流出した時点で樹脂の注入を止め、恒
温槽などを使用して注入された樹脂を硬化させる。続い
て容器１内部空間を十分乾燥させた後、注入口１ｂｘ
とオーバフローロｌｂｚのめねじ部に、封止剤を塗布ま
たは封止テープを巻回したおねじ（図示せず）をねじ込
んで封止し、さらＫその上忙封止用樹脂を注入してシー
リングを行なうものである。Embodiments of this invention will be described below based on Figures WjJK.
What is shown in the figure is a longitudinal sectional view of a light receiving device that is an embodiment of the present invention. First, the structure of the container 1 is that one side is open and the other side has a bottom 1m, and an inlet lbl with a female thread is located near the bottom 1aK of the side wall 1b. It has an over-7 four-port lbg with a female thread at an intermediate position between the section and the circuit section. J & part 1m inside container 1 K is mounting seat 1c for installing built-in parts
There are a plurality of mounting pieces 1d for attaching a frame body, which will be described later, on the outside of the frame 11lb. K, which stores this product with built-in capacity slk, first places the first circuit section 2 (2m: (c) circuit board, 2b = electronic component) via the spacer tube 31, and then places the second circuit section 4 ( 4a:
I circuit board, 4b: electronic components) is placed through the spacer tube 32, and then the light receiving section 5 (5a: light receiving section board, 5b: light receiving element) is placed on the light receiving surface (light receiving element 5b) through the spacer tube 33. Place it near the opening side of container 1. These were then fixed by tightening screws 5 and 6 to the mounting seats lc and K as shown in the figure. Next, the end face of the side wall 1b on the opening side of the container 1 is closed with a transparent glass plate 8 via a sealing gasket (for example, a rubber gasket) 7, and the transparent glass plate 8 is shaped like a frame with an air gap in the center. Mounting piece 1dk was attached to frame body 9 using screws IOK. The container 1 assembled in this way is r
As shown in AK, the bottom 1M is on the upper side and the transparent glass plate 8 is on the lower side, and the resin is injected. In other words, if a resin with better transparency (for example, silicone resin, urethane resin) is injected into the injection port lb1, 1
Resin accumulates as shown in 1. When the transparent resin 11 flows out from the over 74-port lb2, injection of the resin is stopped, and the injected resin is cured using a constant temperature bath or the like. Subsequently, after sufficiently drying the inner space of the container 1, the injection port 1bx
A male thread (not shown) coated with a sealant or wrapped with sealing tape is screwed into the female threaded part of the overflow lbz to seal it, and then a sealing resin is injected. This is for sealing.
以上述べた本発明による受光装置は容器内の受先部周辺
にのみ樹脂注入を行なって容器の開口部を封止した構造
なので容器の空間に置かれた回路部も紡水性、耐湿性が
維持でき、従来の桐脂全モールドの場合と同程度の防水
性、耐湿性を有する。The light receiving device according to the present invention described above has a structure in which resin is injected only around the receiving part in the container and the opening of the container is sealed, so that the circuit part placed in the space of the container also maintains water spinability and moisture resistance. It has the same level of waterproofness and moisture resistance as conventional tung fat molds.
しかも樹脂の使用量が少なくなって製造コストが低減で
き樹脂が熱膨張しても前記容ＩＩＫ空間な有する。ので
その体積増量分は空間に逃げ、微性製品（受光部）を破
損することもない。Moreover, since the amount of resin used is reduced, manufacturing costs can be reduced, and even if the resin expands thermally, the above-mentioned capacity IIK space can be maintained. Therefore, the increased volume escapes into space and does not damage the microscopic product (light receiving part).
図は本発明の一実施例である受光装置の縦断面図である
。
ｌ：容器、ｌａ：底部、ｌｂ：１ｍ壁、ｌｂｌ：注入口
、ｌｂｘニオ−バフ四−口、１ｄ：取付片。
２．４：回路部、５：受光部、７：封止部材（封止用パ
ツキン）、８：透明ガラス板、９：枠体、′１０：ねじ
、１１：透ＷＡ樹脂。The figure is a longitudinal sectional view of a light receiving device that is an embodiment of the present invention. l: container, la: bottom, lb: 1m wall, lbl: injection port, lbx Niobuff 4-port, 1d: mounting piece. 2.4: circuit section, 5: light receiving section, 7: sealing member (sealing packing), 8: transparent glass plate, 9: frame body, '10: screw, 11: transparent WA resin.
Claims (1)
置に回路部を収納し、続いてこの回路部と間隔を隔てた
位置に受光部を装着したのち容器開口部を封止部材を介
して透明ガラス板にて閉塞し、この容６の底部が上側に
、透明ガラス板側が下側になる状態で、容器側壁の底部
に近い位置に設けられた注入口より透明樹脂を前記容器
内部に注入し、前記樹脂が容器側壁における前記受光部
と前記回路部との中間位置に設けられたオーバー７ａ−
口より流出した時点で透舅樹脂の注入を止め、注入され
た透明樹脂を硬化させたのち前記注入口とオーバーフ胃
−口を封止することを特徴とする受光装置の製造方法。 ２、特許請求の範囲第１項記載の方法において、注入口
およびオーバーフロー口を封止する手段として注入口お
よびオーバーフロー口の内周和めねじ部を設け、このめ
ねじ部に封止剤を付着したおねじを螺合して閉塞口、さ
らｋその上に新庄用樹脂を注入してシーリングを行５こ
とを特徴とする受光装置の製造方法。[Scope of Claims] A circuit section is stored in the interior K of a bottomed container with one side open, at a position near the bottom of the container, and then a light receiving section is installed at a position spaced apart from the circuit section, and then the container is opened. The container is closed with a transparent glass plate via a sealing member, and with the bottom of the container 6 facing upward and the transparent glass plate side facing downward, an injection port is inserted through an injection port provided at a position close to the bottom of the side wall of the container. A transparent resin is injected into the container, and the resin is provided at an intermediate position between the light receiving section and the circuit section on the side wall of the container.
A method for manufacturing a light receiving device, characterized in that the injection of the transparent resin is stopped when it flows out from the opening, and after the injected transparent resin is cured, the injection opening and the overflow stomach-orifice are sealed. 2. In the method described in claim 1, a female threaded portion on the inner periphery of the filler port and the overflow port is provided as a means for sealing the filler port and the overflow port, and a sealant is attached to the female thread portion. 5. A method for manufacturing a light receiving device, characterized in that the male screws are screwed together to form a closing opening, and a Shinjo resin is injected onto the closing opening for sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57056832A JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57056832A JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58173875A true JPS58173875A (en) | 1983-10-12 |
| JPS6251511B2 JPS6251511B2 (en) | 1987-10-30 |
Family
ID=13038353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57056832A Granted JPS58173875A (en) | 1982-04-06 | 1982-04-06 | Manufacture of light receptor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173875A (en) |
-
1982
- 1982-04-06 JP JP57056832A patent/JPS58173875A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251511B2 (en) | 1987-10-30 |
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