JPS6251298A - Cooler - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] C Summary] In a cooling device that air-cools a heat source in an il air passage by forced air, a partition plate made of a Peltier element to separate intake air and exhaust air is provided in the ventilation passage, and the heat generating surface of the partition plate is provided in the ventilation passage. The cooling efficiency of the heat source is improved by cooling the heat source with the exhaust air and cooling the intake air with its heat absorption surface.

[Industrial application field]

The present invention relates primarily to a cooling device used for cooling electronic devices, such as communication devices, and particularly to improvements in the cooling capacity of air-cooled cooling devices.

BACKGROUND OF THE INVENTION Electronic devices such as communication devices generally have a structure in which electronic units are divided into blocks for each function and installed in multiple stages in a cabinet or rack, and an air cooling method is generally used to cool them.

[Prior art and problems to be solved by the invention] Conventional air cooling methods were originally natural air cooling using natural convection (or natural air blowing), but in recent years forced air cooling using forced air blowing with a blower fan has become mainstream. .

However, with the recent increase in the density of packaging, for example, in the case of a method in which air is taken in from the lower stage, cools the electronic unit while folding, and is then discharged from the upper stage, the cold air at the time of intake is carried away by Sophia. The temperature becomes high, and a situation occurs in which the cooling capacity in the upper stage is reduced or lost.

Therefore, the present invention aims to solve such problems, that is, to improve the cooling capacity.

[Means for solving problems]

In the cooling device of the present invention, a partition plate is provided in the ventilation passage to separate intake air and exhaust air, and the partition plate is composed of a Beltier element so that its heat generating surface and heat absorption surface are in contact with the exhaust air and the intake air, respectively. It is something.

[For production]

By setting the temperature of the heat-generating surface of the partition plate made of a Beltier element to be higher than the temperature of the exhaust air and the temperature of the heat-absorbing surface to be lower than the temperature of the intake air, the heat-generating surface is cooled by the exhaust air, and the intake air is cooled by the heat-absorbing surface. As a result of being cooled, the cooling capacity is improved.

[Embodiment] FIG. 1 shows a first embodiment of the present invention. In the figure, the symbol CA indicates a cabinet (or rack) of a vertical multi-stage mounting communication device, and the left and right sides of the figure are the front and rear surfaces of the cabinet, respectively. In the cabinet I-CA, an electronic unit node [J, ~ (],) is mounted on A4, and a partition plate unit 10 is installed between the second and third stages. Partition plate unit... The compartment 10 has an oblique partition plate 11 (details of which will be described later), which divides the interior (ventilation path) of the compartment A into an upper and lower part. An intake port 2 is provided on the front surface of the lower part of the cabinet 7), and an intake port 2 and an exhaust port 3 are provided on the front and rear surfaces at positions corresponding to the partition plate 10, respectively. Cabinet C
A also has fan units 20 and 30 mounted directly below and at the smallest portion of the partition plate unit 10, respectively.

The lower Fanconi throat 20 sucks the intake air A from the lower intake port 1, cools it by passing it through the electronic cornices (U,, U2), and discharges it as exhaust air B1 from the exhaust port 3. The upper fan unit 30 sucks intake air A2 from the middle intake port 2, and the electronic unit U
, ,' tJ The air flows through J to cool it and discharge it from the top of the cabinet as exhaust B2.

Now, the partition plate 11 of the partition plate unit 10 is composed of a Vertier element. As is well known, a Bertier element is a device in which dissimilar metals are bonded together and a voltage is applied between the two to transfer heat from one to the other, creating a temperature difference between the two.

In the present invention, the partition plate 11 made of such a Beltier element
The heat generating surface (high temperature surface, bottom surface in the first figure) and heat absorption surface (low temperature surface, top surface in FIG. 1) are the exhaust B+ and intake A2, respectively.
It is placed so that it is in contact with.

Here, the temperature (room temperature) of intake air A + and A 2 is t,
The temperature of the heat-generating surface and the heat-absorbing surface of the partition plate (Bertier element) 10 are respectively t+α and t−β (therefore, the temperature difference between the two sides is α+β), and the intake air A1 enters the partition plate unit 10] The temperature at 1 (i.e. electron uniso) (J+, U
If t is set as t+α〉1, then the heat generating surface of the partition plate 11 will transfer heat to the exhaust air B−. On the contrary, the heat absorption surface of the partition plate 11 absorbs the intake air A2.
This will cool it down by removing heat from it. As a result,
After the intake air A2 passes through the partition plate unit 10, the temperature becomes t-Δt, and the cooling capacity for the electronic units tJ3 and U4 is improved. - As an example, t-15°C, E.

-25℃ (by the way, the standard limit is 25℃ for the heat resistance temperature of electronic Unisol), 10α-50℃, 1β-25℃ (
In other words, in the case of a temperature difference α+β-75°C), the temperature difference between the heat-generating surface of the partition plate 11 and the exhaust air B1 is t+α-t, -25°C, and the temperature difference between the heat-absorbing surface of the partition plate 11 and the intake air A2 is 1-
(1-β)-40°C, and the intake air A2 is cooled to a considerably low temperature.

In the embodiment shown in FIG. 1, if a partition plate unit and a fan unit are also provided at the bottom of the cabinet CA, the cooling capacity for the electronic units U+ and Uz will be similarly improved.

Furthermore, in the embodiment shown in FIG. 1, heat radiation fins 12 and heat absorption fins 13 are provided on the heat generation surface and heat absorption surface of the partition plate 11, respectively. A specific example of the shape is shown in FIG. Second
The fins shown in the figure 12.13t;l: Made from an extrusion mold +A of a good thermal conductor (e.g. copper, aluminum), the partition plate 1
1 by suitable means such as screws. By providing these fins 12 and 13, it is possible to efficiently exchange heat between the partition plate 11 and the exhaust air B1 and the intake air A1, thereby further strengthening the cooling of the intake air A. However, in principle, these fins may not be provided, and the present invention is not limited to the presence or absence of these fins.

Next, FIG. 3 shows a modification of the first embodiment.

That is, the first embodiment has a vertical multi-stage mounting structure, whereas the one in FIG. 3 has a horizontal mounting structure.

For convenience of comparison with FIG. 1-1-1, the configuration is the same and the cylinder numbers are also the same. In other words, the modified example in FIG. 3 includes electronic units U1 to J4, units 10. and Fan Uniso)
20.30 are lined up horizontally, and the intake air A from the left side cools the electronic units Ul and tJz, further cools the heat generating surface of the partition plate unit 10, and exhausts from the rear exhaust port (arrow Bl).
), and on the other hand, the intake air A2 from the front air intake port is cooled by the endothermic surface of the partition plate uni-nod 10, and the electronic uni-so 1-1J3
t14 is cooled and exhausted from the right side (arrow B). As described above, since the cooling device of the present invention is of a forced air type, it can be applied to either vertical mounting or horizontal mounting. In addition, as a further modified form, the second
A structure in which the mounting bodies shown in the figure are stacked vertically in multiple stages is also possible.

Furthermore, in the examples of FIGS. 1 and 3, the electronic Unison 1
4. The number of partition plates-ff-knit and fan units is not particularly limited, and it goes without saying that they can be appropriately selected in consideration of their calorific value and cooling capacity.

Furthermore, FIG. 4 shows a second embodiment of the present invention.

This example is an example where the entire system such as a communication device is cooled all at once. Basically, the system S is housed in a cabinet (or housing) CA, and the fan unit 120 is used to cool the intake port 101 of the cabinet/node CA. Intake air A is taken in from the system S, cooled by flowing through the system S, and then exhaust air B is discharged from the exhaust port 102. At the intake port 101 and the exhaust port 102, there is a partition plate unit 110 that partitions the intake air A and the exhaust air B.
It is a provision.

The partition plate unit 110 has a partition plate 111 made of a Vertier element as in the previous example, and its heat generating surface (upper surface in the figure) and heat absorbing surface (lower surface in the figure) are connected to the exhaust air B and the intake air A, respectively.
, and heat-radiating fins 112 and heat-absorbing fins 113 are provided on the heat-generating surface and the heat-absorbing surface, respectively. As a result, the exhaust air B cools the heat-generating surface of the partition plate 111, while the intake air A is cooled by the heat-absorbing surface of the partition plate 111, resulting in a high cooling capacity for the system S.

In the illustrated examples of FIGS. 1 to 4, the fan units 20, 30, and 120 are all arranged on the exhaust side of the ventilation path. By the way, in principle, it is possible to place the fan unit on the intake side, but in that case, the heat generated by the fan unit would heat the intake air and reduce the cooling capacity, so it is recommended to place it on the exhaust side. The illustrated structure is advantageous. Considering this point further, the fan unit 20 in the example of FIGS. 1 and 3 and the fan unit 20 in the example of FIG.
It is more advantageous to arrange the throat 120 at the position of the exhaust port 3, 102 immediately after the partition plate unit 10, 110, rather than immediately before it. This prevents the temperature of the exhaust gas flowing into the partition plate uniform throat from rising due to heat generation from the fan unit and reducing the temperature difference between the temperature of the heat generating surface of the partition plate and the cooling efficiency of the heat generating surface of the partition plate by the exhaust air. This is because it is possible to increase the

〔Effect of the invention〕

As described above, the cooling device of the present invention can achieve a high cooling capacity by cooling intake air using the partition plate made of the Vertier element.

Incidentally, although the application of the present invention to cooling of electronic devices has been described as an example of the present invention, the present invention is not limited thereto and can be applied to various fields.

[Brief explanation of drawings]

Fig. 1 shows the first embodiment of the present invention during a visit to the park, Fig. 2 is an external perspective view of the partition plate unit, Fig. 3 shows a modification of the first embodiment, and Fig. 4 shows the first embodiment of the present invention. FIG. 2 is a diagram showing a second embodiment. In Figures 1 to 4, CA is the cabinet, U1 to U4 are the electronic units, S is the system, A, A,, AI are the intakes, B, B,, B2 are the exhaust, 1.2, 101 are the intake ports , 3 and 102 are exhaust ports, 10 and 110 are partition plate units, 11 and 111 are partition plates, 12 and 112 are radiation fins, 13 and 113 are heat absorption fins, and 20, 30 and 120 are fan units. FIG. 1 shows the first embodiment of the present invention CA...cabinets U1 to U4...electronic unit, TOAI, A2...intake B, B2...exhaust 1.2...intake port 10 ... Partition plate unit 11 - Partition plate (Peltier element) 12 ... Heat radiation fin 13 ... Heat absorption fin 20.30. ,, External appearance perspective view of the fan unit Partition plate unit Fig. 2 10 Partition plate unit) 12-Radiating fins 11・Partition plate 13・Heat absorbing fins 1 Example 1 Dimensions M This invention FIG. 4 CA shows the second embodiment of the cabinet S System 101...Intake port 102...Exhaust port 110・Partition plate unit 112・Radiating fins FIG. 3U-U4 Electronic unit 10゛ Partition plate unit AI , A2 ・Intake 2
0.30... Fan Uni, ToBl, B2. ．． Exhaust 113, heat absorption fin 120 fin unit

Claims (1)

[Scope of Claims] 1. In a cooling device that air-cools the heat source by forcing air into the ventilation path in which the heat source is housed, a partition plate is provided in the ventilation path to partition intake air and exhaust air, and the partition plate is equipped with a Peltier element. 1. A cooling device characterized in that the heat generating surface and the heat absorbing surface thereof are in contact with exhaust air and intake air, respectively. 2. The cooling device according to claim 1, characterized in that heat-radiating fins and heat-absorbing fins are provided on the heat-generating surface and heat-absorbing surface of the partition plate, respectively. 3. The cooling device according to claim 1 or 2, characterized in that a forced air blowing fan is disposed on the exhaust side of the ventilation path.