JPS63289999A - Mounting structure for information processor - Google Patents
Mounting structure for information processorInfo
- Publication number
- JPS63289999A JPS63289999A JP62123774A JP12377487A JPS63289999A JP S63289999 A JPS63289999 A JP S63289999A JP 62123774 A JP62123774 A JP 62123774A JP 12377487 A JP12377487 A JP 12377487A JP S63289999 A JPS63289999 A JP S63289999A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- cooling
- air
- cooled
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000010365 information processing Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 abstract description 23
- 230000020169 heat generation Effects 0.000 abstract description 20
- 239000000498 cooling water Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、情報処理装置の実装構造に関し、詳しくは、
水冷を要する高発熱電子部品と空冷で足りる低発熱電子
部品を混載して実装する場合に、その水冷および空冷の
冷却機構を単純化し、かつ高密度実装を可能とする情報
処理装置の実装構造に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a mounting structure of an information processing device, and in detail,
Relating to a mounting structure for information processing equipment that simplifies the water-cooling and air-cooling mechanisms and enables high-density mounting when high-heating electronic components that require water cooling and low-heating electronic components that require air cooling are mounted together. It is something.
従来、情報処理装置における電子部品の高密度実装構造
としては、例えば、日経エレクトロニクス、 Ｎｏ３Ｄ
６（１９８６，６，２）の１９７−２０９ページｒｃｐ
ｕをｌボードに実装した大型コンピュータ」の記載のよ
うに、高発熱電子部品と他の低発熱電子部品を同一ボー
ド面に混載して、両面実装構造としているものがある。Conventionally, as a high-density mounting structure for electronic components in information processing equipment, for example, Nikkei Electronics, No3D
6 (1986, 6, 2), pages 197-209 rcp
As shown in "Large-sized computer with U mounted on L board", there are some that have a double-sided mounting structure in which high heat generation electronic components and other low heat generation electronic components are mixedly mounted on the same board surface.
上記従来技術の実装構造は、高発熱電子部品と他の低発
熱電子部品が同一ボート面に混載される構造となってお
り、その実装ボートの冷却は空冷により行うようになっ
ている。このため、同一ボード面に混載実装した高発熱
電子部品と他の部品との冷却能力を調整するため、高発
熱電子部品には放熱フィンを設ける構造としており、冷
却のための構成が複雑化している。また、冷却機構は、
高発熱電子部品の方に合せて冷却能力を設定する必要が
あるため、過大な冷却能力が必要となる。The mounting structure of the above-mentioned prior art is such that high heat generation electronic components and other low heat generation electronic components are mixedly mounted on the same boat surface, and the mounting boat is cooled by air cooling. Therefore, in order to adjust the cooling capacity of high-heating electronic components and other components mounted together on the same board, high-heating electronic components are provided with heat dissipation fins, which complicates the cooling configuration. There is. In addition, the cooling mechanism is
Since it is necessary to set the cooling capacity according to the high heat generation electronic components, an excessive cooling capacity is required.
さらに、高発熱電子部品がより高発熱化して水冷を要す
る場合には、同一ボート面に対して空冷および水冷を行
うような実装構造にする必要があるンこめ、その構造は
一層腹雑化するという問題点があった。Furthermore, when high-heating electronic components generate even more heat and require water cooling, it is necessary to create a mounting structure that performs air cooling and water cooling on the same boat surface, making the structure even more complicated. There was a problem.
本発明は、前記問題点を解決するためになさ九たもので
ある。The present invention has been made to solve the above problems.
本発明の目的は、水冷を要する高発熱電子部品と空冷で
足りる低発熱電子部品を混載して実装する場合に、その
水冷および空冷の冷却機構を単純化し、かつ高密度実装
を可能とする実装構造を提供することにある。An object of the present invention is to simplify the water-cooling and air-cooling mechanisms and to enable high-density mounting when high-heating electronic components that require water cooling and low-heating electronic components that require air cooling are mounted together. It's about providing structure.
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.
前記の目的を達成するためになされた本発明のうち、代
表的なものの概要を簡単に説明すれば。Among the present inventions that have been made to achieve the above object, a typical overview will be briefly explained.
下記のとおりである。It is as follows.
本発明においては、情報処理装置の実装構造において、
第１の実装ボードの一方の面に、水冷を要する高発熱電
子部品を平面状に実装し、第１の実装ボードの他方の面
に、空冷で足りる低発熱電子部品を実装した第２の実装
ボードを、垂直に複数枚実装する構造としたことを主な
特徴とする。In the present invention, in the mounting structure of the information processing device,
A second mounting in which high heat generation electronic components that require water cooling are mounted in a flat manner on one surface of the first mounting board, and low heat generation electronic components that require air cooling are mounted on the other surface of the first mounting board. Its main feature is that it has a structure in which multiple boards are mounted vertically.
前記手段によれば、水冷を要する高発熱電子部品（以下
、水冷部品と略称する）を、第１の実装ボードの一方の
面に平面状に実装し、第１の実装ボードの他方の面には
、空冷で定番）る低発熱電子部品（以下、空冷部品と略
称する）を実装した第２の実装ボードを、垂直に複数枚
実装した実装構造とする。このような実装構造をとるた
め、発熱電子部品に対する冷却機構は、第１の実装ボー
ドの一方の面側および他方の面側で、水冷部品に対する
冷却機構と空冷部品に対する冷却機構とに分離して設け
る構成とすることができ、冷却機構の構成を簡単なもの
とすることができる。According to the above means, high heat generation electronic components that require water cooling (hereinafter abbreviated as water-cooled components) are mounted in a planar manner on one surface of the first mounting board, and are mounted on the other surface of the first mounting board. The mounting structure is such that a plurality of second mounting boards on which low heat generation electronic components (hereinafter referred to as air-cooled components) mounted thereon are vertically mounted. Due to this mounting structure, the cooling mechanism for the heat-generating electronic components is separated into a cooling mechanism for the water-cooled components and a cooling mechanism for the air-cooled components on one side and the other side of the first mounting board. The cooling mechanism can be configured to have a simple configuration.
すなわち、水冷部品が第１の実装ボードの一方の面に、
空冷部品が第１の実装ボードの他方の面に分離して搭載
され、水冷部品が平面状に搭載された実装構造としてい
るので、水冷部品を冷却する冷却機構は第１の実装ボー
ドの一方の面を専有して構成することができ、また水冷
部品が平面状に搭載された構造であるため、水冷部品の
冷却のための冷却機構の水冷配管等の構造が単純化でき
る。また、第１の実装ボードの他方の面は空冷部品のみ
が実装される構造であり、空冷部品の冷却のための冷却
機構の構造が単純化できる。That is, the water cooling components are placed on one side of the first mounting board,
Since the mounting structure is such that the air-cooled components are mounted separately on the other side of the first mounting board and the water-cooled components are mounted on a flat surface, the cooling mechanism for cooling the water-cooled components is mounted on one side of the first mounting board. Since the surface can be occupied exclusively, and the water-cooled components are mounted in a flat structure, the structure of the water-cooled piping of the cooling mechanism for cooling the water-cooled components can be simplified. Further, the other surface of the first mounting board has a structure in which only air-cooled components are mounted, and the structure of the cooling mechanism for cooling the air-cooled components can be simplified.
以下、図面を用いて本発明の一実施例を具体的に説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the drawings.
第１図は、本発明の一実施例の情報処理装置の実装構造
を示す斜視図である。第１図１；おいて、この実装構造
の要となる第【の実装ボード１は、一方の面には、水冷
を要する高発熱電子部品（水冷部品）２が平面状に搭載
され、他方の面には、第２の実装ボード３を垂直に複数
枚実装するためのコネクタ４が塔載される。第２の実装
ボード３には、空冷で足１ｊる低発熱電子部品（空冷部
品）が塔載され、この第２の実装ボード３がコネクタ４
により、第１の実装ボード１に対して垂直に複数枚実装
される構造となっている。このような実装構造に対する
冷却機構としては、水冷冷却機構１００と空冷冷却機構
２００とが併用されて装備される構造となっている。FIG. 1 is a perspective view showing a mounting structure of an information processing device according to an embodiment of the present invention. In FIG. 1, the second mounting board 1, which is the key to this mounting structure, has high heat generation electronic components (water-cooled components) 2 that require water cooling mounted in a flat manner on one side, and A connector 4 for vertically mounting a plurality of second mounting boards 3 is mounted on the surface. On the second mounting board 3, low heat generation electronic components (air-cooled components) that are cooled by air are mounted.
Accordingly, a plurality of boards are mounted perpendicularly to the first mounting board 1. As a cooling mechanism for such a mounting structure, a water-cooled cooling mechanism 100 and an air-cooled cooling mechanism 200 are used together.
水冷冷却機構１００は、一枚の平面基板に熱伝導板（冷
却モジュール）１０１が複数個実装されて、各熱伝導板
１０１が給水パイプ１０２で結ばれて構成されているも
のであり、第１の実装ボード１の高発熱電子部品（水冷
部品）２を塔載する面側に配置されている。また空冷冷
却機構２ （１０は、送風ファン２０１が複数個搭載さ
れて構成されているものであり、第１の実装ボート１の
他方の面側の下部に配置されている。The water-cooled cooling mechanism 100 is constructed by mounting a plurality of heat conduction plates (cooling modules) 101 on one flat board, and connecting each heat conduction plate 101 with a water supply pipe 102. It is arranged on the side of the mounting board 1 on which high heat generating electronic components (water-cooled components) 2 are mounted. Further, the air cooling mechanism 2 (10 is configured by mounting a plurality of blower fans 201, and is arranged at the lower part of the other surface side of the first mounting boat 1).
このような冷却機構により、第１の実装ボート１の一方
の面に平面状に実装された高発熱電子部品２は、その部
品表面部に冷却モジュール１０１が密着されて、冷却モ
ジュール１０１に給水パフブー１０２を介して冷却水を
循環させて、間接熱伝導冷却される。また、第１の実装
ボード１の他方の面側のコネクタ４により垂直に複数枚
実装さ九た第２の実装ボード３における空冷部品（図示
せず）は、送風ファン２０１を塔載した空冷冷却機構２
００により、強制空気冷却される。With such a cooling mechanism, the high heat generating electronic component 2 mounted flat on one surface of the first mounting boat 1 has the cooling module 101 in close contact with the surface of the component, and the cooling module 101 has a water supply puff boob. Cooling water is circulated through 102 for indirect heat conduction cooling. In addition, the air-cooled components (not shown) on the second mounting board 3, which are vertically mounted by the connector 4 on the other side of the first mounting board 1, are air-cooled components (not shown) mounted on a blower fan 201. Mechanism 2
00, forced air cooling is performed.
第２図は、本発明の他の実施例の情報処理装置の実装構
造を示す斜視図である。第２図の実装構造においては、
第１の実装ボード１の空冷部品を搭載する側の実装構造
として、更に第３の実装ボード５が、第２の実装ボード
３ （３−１３−２゜３−３）上に設けられる構造とな
っている。このため、第２の実装ボード３上にはコネク
タ６が設けられ、このコネクタ６に第３の実装ボード５
が接続される構造となっている。この第３の実装ボード
５には、空冷部品が搭載される。FIG. 2 is a perspective view showing a mounting structure of an information processing apparatus according to another embodiment of the present invention. In the mounting structure shown in Figure 2,
As a mounting structure on the side where the air-cooled components of the first mounting board 1 are mounted, a third mounting board 5 is further provided on the second mounting board 3 (3-13-2°3-3). It has become. Therefore, a connector 6 is provided on the second mounting board 3, and a third mounting board 5 is connected to this connector 6.
The structure is such that they are connected. Air-cooled components are mounted on this third mounting board 5.
この実装構造は、第２の実装ボート３上で、第３の実装
ボード５を実装する構造の３次元実装となっており、第
３の実装ボード５上において空冷部品が搭載されて、空
冷部品が高密度実装される構造となっている。This mounting structure is a three-dimensional mounting structure in which the third mounting board 5 is mounted on the second mounting board 3, and the air-cooled components are mounted on the third mounting board 5. The structure has a high density mounting structure.
以下に、このような実施例による実装構造の特徴点をま
とめて説明する。Below, the features of the mounting structure according to such an embodiment will be summarized and explained.
（１）第２図に示したような実装構造においては、空冷
部品を搭載した第３の実装ボード５が、第２の実装ボー
ド３上にコネクタ接続されて実装される構造となってい
る。このような実装構造では、第１の実装ボード１にお
ける第２の実装ボート３の装着枚数を減らすことができ
、第２の実装ボード３が第１の実装ボード１上の水冷部
品２（２−１，２−２，２−３）の搭載エリア間の空エ
リア部位にのみの搭載で足りるようにできる。二九によ
り、第１の実装ボード１上の表面（一方の面）および裏
面（他方の面）に、水冷部品２と第２の実装ボード３と
を塔載するについて、水冷部品２が搭載されている位置
のすぐ裏側は空エリアとすることができ、また、第２の
実装ボード３が搭載されている位置のすぐ裏側も空エリ
アとすることができる。このため、両面実装の構造が簡
易なものとなる。このような構造であると、水冷部品２
はピン挿入形にすることもできる。さらに、第１の実装
ボード１においては、空冷部品塔載側の面の空エリアを
使って、大電流を要する水冷部品へ直接給電する配線構
造とすることができ、この場合、第１の実装ボード１は
電源層数を減らすことができ、その構造は簡易なものと
なる。また、第１の実装ボード１上で実装部品面の反対
面の空エリアを利用して、波形観測を行なうためのチェ
ック端子等を配設することが可能となる。(1) In the mounting structure shown in FIG. 2, the third mounting board 5 on which air-cooled components are mounted is mounted on the second mounting board 3 by being connected to the connector. With such a mounting structure, the number of second mounting boards 3 mounted on the first mounting board 1 can be reduced, and the second mounting board 3 can be mounted on the water cooling component 2 (2- 1, 2-2, and 2-3) can be mounted only in the empty area between the mounting areas. According to No. 29, when the water-cooled component 2 and the second mounting board 3 are mounted on the front surface (one surface) and the back surface (the other surface) of the first mounting board 1, the water-cooled component 2 is mounted. The area immediately behind the position where the second mounting board 3 is mounted can be an empty area, and the area immediately behind the position where the second mounting board 3 is mounted can also be an empty area. Therefore, the double-sided mounting structure becomes simple. With such a structure, the water cooling component 2
can also be of pin insertion type. Furthermore, in the first mounting board 1, the empty area on the side where the air-cooled components are mounted can be used to create a wiring structure that directly supplies power to the water-cooled components that require a large current. The board 1 can reduce the number of power supply layers and has a simple structure. Furthermore, it is possible to arrange check terminals and the like for waveform observation by utilizing the empty area on the first mounting board 1 on the opposite side of the mounted component side.
（２）この実装構造では、水冷部品と空冷部品が第１の
実装ボードの両面に配置される両面実装構造となってお
り、水冷部品と空冷部品を第１の実装ボード上の同一面
に混載した場合に比べて、水冷部品と空冷部品の間の実
装距離を短くできる。(2) This mounting structure has a double-sided mounting structure in which water-cooled components and air-cooled components are placed on both sides of the first mounting board, and water-cooled components and air-cooled components are mixedly mounted on the same surface of the first mounting board. The mounting distance between the water-cooled components and the air-cooled components can be shortened compared to the case where the components are cooled.
これは、高発熱電子部品の論理ＬＳＩであるメモリ制御
用ＬＳＩと低発熱電子部品のＤＲＡＭのメモリ素子によ
りメモリ装置を構成する場合に、適用して好適な実装構
造となっている。すなわち、この実装構造においては、
水冷部品のメモリ制御用ＬＳＩと空冷部品のメモリ素子
との間の実装距離は短くなっており、メモリ制御用ＬＳ
Ｉとメモリ素子間の配線遅延時間を少なくでき、メモリ
の性能をフルに引き出せる等、性能向上にも寄与するこ
とができる。なお、この場合の回路構成の論理分割は、
水冷部品（メモリ制御用ＬＳＩ）２−１の３個で第２の
実装ボード３−１の空冷部品（ＤＲＡＭメモリ素子）を
制御するようにし、水冷部品２−２の３個で第２の実装
ボード３−２の空冷部品を制御するようにし、水冷部品
２−３の３個で第２の実装ボード３−３の空冷部品を制
御するようにして、装置を構成するゆ
（３）この実装構造において用いる冷却機構は、その構
造において、さらに水冷部の冷却配管を空冷部の下部へ
まで配置する構成とすることにより、空冷部の導入空気
を冷却して空冷効果を補強できる構造とすることができ
る。This is a mounting structure that is suitable for application when a memory device is constituted by a memory control LSI, which is a logic LSI that is a high heat generation electronic component, and a DRAM memory element that is a low heat generation electronic component. That is, in this implementation structure,
The mounting distance between the memory control LSI of the water-cooled component and the memory element of the air-cooled component is shortened, and the memory control LSI
The wiring delay time between I and the memory element can be reduced, and the full performance of the memory can be brought out, contributing to improved performance. In addition, the logical division of the circuit configuration in this case is
The three water-cooled components (memory control LSI) 2-1 control the air-cooled components (DRAM memory element) on the second mounting board 3-1, and the three water-cooled components 2-2 control the second mounting board 3-1. (3) This mounting method controls the air-cooled components on the board 3-2, and the three water-cooled components 2-3 control the air-cooled components on the second mounting board 3-3. The cooling mechanism used in the structure shall have a structure in which the cooling piping of the water cooling section is further arranged to the bottom of the air cooling section, so that the air introduced into the air cooling section can be cooled and the air cooling effect can be reinforced. Can be done.
以上、本発明を実施例にもとづき具体的に説明したが、
本発明は前記実施例に限定されるものではなく、その要
旨を逸脱しない範囲において種々変更可能であることは
いうまでもない。The present invention has been specifically explained above based on examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.
以上、説明したように、本発明によれば、水冷を要する
高発熱電子部品と空冷で足りる低発熱電子部品を混載し
て実装する場合に、その水冷および空冷の冷却機構を単
純化でき、かつ高密度実装を行うことができる。さらに
、高密度実装化のための開面実装は、比較的に簡単な実
装技術で実施できるので、′！Ａ置の高密度化を経済的
に実現できる効果がある。また、このような実装構造を
用いれば、回路構成上、水冷部品と空冷部品を配置する
実装上の距離がクリティカルであるような場合に、同一
ボード面に水冷部品と空冷部品を配置した実装構造に比
べ、実装上の配置距離を短くできるので性能向上できる
効果がある。As described above, according to the present invention, when high heat generation electronic components that require water cooling and low heat generation electronic components that require air cooling are mounted together, the cooling mechanisms for water cooling and air cooling can be simplified, and High-density mounting is possible. Furthermore, open surface mounting for high-density mounting can be implemented with relatively simple mounting technology, so ′! This has the effect of economically realizing higher density in the A area. In addition, if such a mounting structure is used, when the mounting distance between water-cooled components and air-cooled components is critical due to the circuit configuration, it is possible to create a mounting structure in which water-cooled components and air-cooled components are arranged on the same board surface. Compared to this, the mounting distance can be shortened, which has the effect of improving performance.
第１図は本発明の一実施例の情報処理装置の実装構造を
示す斜視図、
第２図は本発明の他の実施例の情報処理装置の実装構造
を示す斜視図である。
図中、１・・・第１の実装ボード、２・・・高発熱電子
部品、３・・・第２の実装ボード、４・・・コネクタ、
５・・・第３の実装ボード、６・・・コネクタ、１００
・・・水冷冷却機構、２００・・・空冷冷却機構である
。
第２図FIG. 1 is a perspective view showing a mounting structure of an information processing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a mounting structure of an information processing apparatus according to another embodiment of the invention. In the figure, 1... first mounting board, 2... high heat generation electronic component, 3... second mounting board, 4... connector,
5... Third mounting board, 6... Connector, 100
. . . water-cooled cooling mechanism, 200 . . . air-cooled cooling mechanism. Figure 2
Claims (1)
熱電子部品を平面状に実装し、第１の実装ボードの他方
の面に、空冷で足りる低発熱電子部品を実装した第２の
実装ボードを、垂直に複数枚実装する構造とした情報処
理装置の実装構造。1. High heat generating electronic components that require water cooling are mounted in a flat manner on one surface of the first mounting board, and low heat generating electronic components that require air cooling are mounted on the other surface of the first mounting board. A mounting structure for an information processing device in which multiple mounting boards are mounted vertically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62123774A JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62123774A JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289999A true JPS63289999A (en) | 1988-11-28 |
| JPH0821787B2 JPH0821787B2 (en) | 1996-03-04 |
Family
ID=14868950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62123774A Expired - Fee Related JPH0821787B2 (en) | 1987-05-22 | 1987-05-22 | Information processing device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0821787B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01191917A (en) * | 1988-01-27 | 1989-08-02 | Nec Corp | Cooling structure for electronic equipment |
| JPH02197194A (en) * | 1989-01-26 | 1990-08-03 | Nec Corp | Electronic circuit package and cage structure thereof |
| JPH0832262A (en) * | 1994-07-13 | 1996-02-02 | Nec Corp | Cooling module for lsi |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| JP2015082565A (en) * | 2013-10-22 | 2015-04-27 | 富士通株式会社 | Electronic apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5486353B2 (en) * | 2010-03-04 | 2014-05-07 | 株式会社ティラド | Modular heat exchanger |
-
1987
- 1987-05-22 JP JP62123774A patent/JPH0821787B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01191917A (en) * | 1988-01-27 | 1989-08-02 | Nec Corp | Cooling structure for electronic equipment |
| JPH02197194A (en) * | 1989-01-26 | 1990-08-03 | Nec Corp | Electronic circuit package and cage structure thereof |
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7035108B2 (en) | 1992-05-20 | 2006-04-25 | Seiko Epson Corporation | Information processing device |
| US7345883B2 (en) | 1992-05-20 | 2008-03-18 | Seiko Epson Corporation | Processing device |
| US7359202B2 (en) | 1992-05-20 | 2008-04-15 | Seiko Epson Corporation | Printer apparatus |
| JPH0832262A (en) * | 1994-07-13 | 1996-02-02 | Nec Corp | Cooling module for lsi |
| JP2015082565A (en) * | 2013-10-22 | 2015-04-27 | 富士通株式会社 | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0821787B2 (en) | 1996-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |