JPS6250970B2 - - Google Patents

Info

Publication number
JPS6250970B2
JPS6250970B2 JP54025615A JP2561579A JPS6250970B2 JP S6250970 B2 JPS6250970 B2 JP S6250970B2 JP 54025615 A JP54025615 A JP 54025615A JP 2561579 A JP2561579 A JP 2561579A JP S6250970 B2 JPS6250970 B2 JP S6250970B2
Authority
JP
Japan
Prior art keywords
wafer
holder
container
holder support
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54025615A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55118631A (en
Inventor
Hiroyuki Ino
Mikio Takagi
Haruo Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2561579A priority Critical patent/JPS55118631A/ja
Publication of JPS55118631A publication Critical patent/JPS55118631A/ja
Publication of JPS6250970B2 publication Critical patent/JPS6250970B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Charging Or Discharging (AREA)
JP2561579A 1979-03-07 1979-03-07 Diffusion furnace for treatment of semiconductor wafer Granted JPS55118631A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2561579A JPS55118631A (en) 1979-03-07 1979-03-07 Diffusion furnace for treatment of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2561579A JPS55118631A (en) 1979-03-07 1979-03-07 Diffusion furnace for treatment of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS55118631A JPS55118631A (en) 1980-09-11
JPS6250970B2 true JPS6250970B2 (enrdf_load_stackoverflow) 1987-10-28

Family

ID=12170782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2561579A Granted JPS55118631A (en) 1979-03-07 1979-03-07 Diffusion furnace for treatment of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55118631A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292490A (ja) * 1986-06-12 1987-12-19 Toppan Moore Co Ltd 転写方法
JPS6321187A (ja) * 1986-07-15 1988-01-28 Toppan Moore Co Ltd 転写シ−トの作製方法
JPS6321188A (ja) * 1986-07-15 1988-01-28 Toppan Moore Co Ltd 転写方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875840A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 半導体用加熱処理炉
JPS60111037U (ja) * 1983-12-28 1985-07-27 株式会社　デンコ− 縦形半導体熱処理炉
JPS6192049U (enrdf_load_stackoverflow) * 1984-11-21 1986-06-14
JPS6211224A (ja) * 1986-07-18 1987-01-20 Hitachi Ltd 半導体ウエハの熱処理方法
JPS63102225A (ja) * 1986-10-20 1988-05-07 Deisuko Haitetsuku:Kk 縦形半導体熱処理装置のウエ−ハボ−ト
JPH0193724U (enrdf_load_stackoverflow) * 1987-12-14 1989-06-20
US8382180B2 (en) 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
KR200451640Y1 (ko) * 2007-10-31 2010-12-28 어플라이드 머티어리얼스, 인코포레이티드 고온 인출용 블레이드

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US62318A (en) * 1867-02-26 James b
JPS4710730U (enrdf_load_stackoverflow) * 1971-03-03 1972-10-07
CH540990A (fr) * 1971-07-07 1973-08-31 Battelle Memorial Institute Procédé pour augmenter la résistance à l'usure de la surface d'un outil de coupe
JPS5213778A (en) * 1975-07-23 1977-02-02 Toshiba Corp Plasma-etching method
US4062318A (en) * 1976-11-19 1977-12-13 Rca Corporation Apparatus for chemical vapor deposition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62292490A (ja) * 1986-06-12 1987-12-19 Toppan Moore Co Ltd 転写方法
JPS6321187A (ja) * 1986-07-15 1988-01-28 Toppan Moore Co Ltd 転写シ−トの作製方法
JPS6321188A (ja) * 1986-07-15 1988-01-28 Toppan Moore Co Ltd 転写方法

Also Published As

Publication number Publication date
JPS55118631A (en) 1980-09-11

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