JPS6250925B2 - - Google Patents
Info
- Publication number
- JPS6250925B2 JPS6250925B2 JP18165682A JP18165682A JPS6250925B2 JP S6250925 B2 JPS6250925 B2 JP S6250925B2 JP 18165682 A JP18165682 A JP 18165682A JP 18165682 A JP18165682 A JP 18165682A JP S6250925 B2 JPS6250925 B2 JP S6250925B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- adhesive layer
- flat cable
- insulating material
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18165682A JPS5971207A (ja) | 1982-10-15 | 1982-10-15 | フラツトケ−ブル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18165682A JPS5971207A (ja) | 1982-10-15 | 1982-10-15 | フラツトケ−ブル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5971207A JPS5971207A (ja) | 1984-04-21 |
| JPS6250925B2 true JPS6250925B2 (enrdf_load_stackoverflow) | 1987-10-27 |
Family
ID=16104557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18165682A Granted JPS5971207A (ja) | 1982-10-15 | 1982-10-15 | フラツトケ−ブル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5971207A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6051824U (ja) * | 1983-09-18 | 1985-04-11 | 住友電気工業株式会社 | アンダ−カ−ペツトフラツトケ−ブル |
| JP4945374B2 (ja) * | 2007-08-29 | 2012-06-06 | 本田技研工業株式会社 | サブパレット反転装置及びサブパレットの反転を伴うワークの加工・組付け方法 |
-
1982
- 1982-10-15 JP JP18165682A patent/JPS5971207A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5971207A (ja) | 1984-04-21 |