JPS6250072B2 - - Google Patents
Info
- Publication number
- JPS6250072B2 JPS6250072B2 JP5072781A JP5072781A JPS6250072B2 JP S6250072 B2 JPS6250072 B2 JP S6250072B2 JP 5072781 A JP5072781 A JP 5072781A JP 5072781 A JP5072781 A JP 5072781A JP S6250072 B2 JPS6250072 B2 JP S6250072B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sheet
- cleavage
- blade
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Dicing (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072781A JPS57166092A (en) | 1981-04-03 | 1981-04-03 | Cleaving process and cleaving device of semicnductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5072781A JPS57166092A (en) | 1981-04-03 | 1981-04-03 | Cleaving process and cleaving device of semicnductor laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166092A JPS57166092A (en) | 1982-10-13 |
| JPS6250072B2 true JPS6250072B2 (show.php) | 1987-10-22 |
Family
ID=12866886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5072781A Granted JPS57166092A (en) | 1981-04-03 | 1981-04-03 | Cleaving process and cleaving device of semicnductor laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166092A (show.php) |
-
1981
- 1981-04-03 JP JP5072781A patent/JPS57166092A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57166092A (en) | 1982-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3547143B2 (ja) | 試料作製方法 | |
| KR900001232B1 (ko) | 반도체 웨이퍼 방형절단기 | |
| EP1036773B1 (en) | Scribing method and apparatus | |
| US4141456A (en) | Apparatus and method for aligning wafers | |
| JPWO1999005506A1 (ja) | 試料作製方法及び装置 | |
| KR20010104228A (ko) | 반도체 웨이퍼의 분할방법 | |
| JP2020181931A (ja) | ウエハーのブレイク方法並びにブレイク装置 | |
| US4775085A (en) | Semiconductor wafer breaking apparatus | |
| JP2754301B2 (ja) | 電子顕微鏡観察用試料の作成方法 | |
| JPS6250072B2 (show.php) | ||
| JP6140325B2 (ja) | 脆性材料基板の分断装置 | |
| JPH0732281B2 (ja) | 劈開装置及び劈開方法 | |
| KR102854905B1 (ko) | 웨이퍼의 가공 방법 | |
| JP2017195254A (ja) | エキスパンドシート | |
| JP6493512B2 (ja) | 分断方法および分断装置 | |
| KR100722786B1 (ko) | 투과전자현미경 분석용 시료 제작 방법 | |
| US20240316823A1 (en) | Workpiece processing method | |
| JP4439675B2 (ja) | 光学素子基板の基板接合方法 | |
| JPH0919782A (ja) | 基板の加工方法及びその加工装置 | |
| JPS59115536A (ja) | 半導体基板の保持方法 | |
| TW202413292A (zh) | 玻璃物品的製造方法、電子元件的製造方法以及基板剝離用夾具 | |
| JP2025145867A (ja) | ブレーキング装置 | |
| JP3082885B2 (ja) | 電子顕微鏡観察用試料の作成方法及び電子顕微鏡観察用試料の固定装置 | |
| JP3367482B2 (ja) | ウェハ分割装置及びウェハ分割方法 | |
| JP2018058304A (ja) | 加工方法 |