JPS6249987B2 - - Google Patents

Info

Publication number
JPS6249987B2
JPS6249987B2 JP53107519A JP10751978A JPS6249987B2 JP S6249987 B2 JPS6249987 B2 JP S6249987B2 JP 53107519 A JP53107519 A JP 53107519A JP 10751978 A JP10751978 A JP 10751978A JP S6249987 B2 JPS6249987 B2 JP S6249987B2
Authority
JP
Japan
Prior art keywords
plating film
header
stem
lead
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53107519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5534473A (en
Inventor
Nobuo Ootani
Masahiro Ichiki
Shinichi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Hitachi Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Hitachi Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP10751978A priority Critical patent/JPS5534473A/ja
Publication of JPS5534473A publication Critical patent/JPS5534473A/ja
Publication of JPS6249987B2 publication Critical patent/JPS6249987B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP10751978A 1978-09-04 1978-09-04 Stem for semiconductor device Granted JPS5534473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10751978A JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10751978A JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5534473A JPS5534473A (en) 1980-03-11
JPS6249987B2 true JPS6249987B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-22

Family

ID=14461246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10751978A Granted JPS5534473A (en) 1978-09-04 1978-09-04 Stem for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5534473A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124272U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1990-03-29 1991-12-17

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516057U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-06-29 1976-01-17

Also Published As

Publication number Publication date
JPS5534473A (en) 1980-03-11

Similar Documents

Publication Publication Date Title
KR100318818B1 (ko) 리드프레임에대한보호피막결합
US5650661A (en) Protective coating combination for lead frames
JPH0612796B2 (ja) 半導体装置
KR920000127A (ko) 반도체 패키지와 그것을 위한 리드프레임
EP1094519A4 (en) LADDER FRAME FOR SEMICONDUCTOR ARRANGEMENT
JPS6249987B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61140160A (ja) 半導体用リ−ドフレ−ム
JPS6252939A (ja) 半導体装置
JPS58175852A (ja) 半導体装置
JPH028459B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3032077B2 (ja) 半導体装置用ステム
JPH0512858B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6312385B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0821662B2 (ja) 半導体装置用リ−ドフレ−ム
JPH11238840A (ja) リードフレーム
JPS638136Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6251500B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6146055A (ja) 半導体装置
JPS6316581A (ja) 気密ガラス端子
JPS59214247A (ja) 半導体装置
JPS647638A (en) Semiconductor device
JPH0519820B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH03225947A (ja) リードフレーム
JPS60195953A (ja) 半導体装置およびその製造方法
JPH0222140Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)