JPS6249743B2 - - Google Patents
Info
- Publication number
- JPS6249743B2 JPS6249743B2 JP54031823A JP3182379A JPS6249743B2 JP S6249743 B2 JPS6249743 B2 JP S6249743B2 JP 54031823 A JP54031823 A JP 54031823A JP 3182379 A JP3182379 A JP 3182379A JP S6249743 B2 JPS6249743 B2 JP S6249743B2
- Authority
- JP
- Japan
- Prior art keywords
- disk
- metal foil
- copper
- structured copper
- structured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 78
- 229910052802 copper Inorganic materials 0.000 claims description 71
- 239000010949 copper Substances 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000011888 foil Substances 0.000 claims description 35
- 238000009792 diffusion process Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- FBEHFRAORPEGFH-UHFFFAOYSA-N Allyxycarb Chemical compound CNC(=O)OC1=CC(C)=C(N(CC=C)CC=C)C(C)=C1 FBEHFRAORPEGFH-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000005238 degreasing Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 238000000992 sputter etching Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 239000000872 buffer Substances 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000737 Duralumin Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92734478A | 1978-07-24 | 1978-07-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS551982A JPS551982A (en) | 1980-01-09 |
JPS6249743B2 true JPS6249743B2 (fr) | 1987-10-21 |
Family
ID=25454609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3182379A Granted JPS551982A (en) | 1978-07-24 | 1979-03-20 | Method of diffusion connecting metallic foil to structural copper and its device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS551982A (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3781861T2 (de) * | 1986-10-27 | 1993-04-01 | Electric Power Res Inst | Herstellung einer mehrschichtigen leistungshalbleiterschaltung mit mehrfachen parallelen kontaktfingern. |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51112455A (en) * | 1974-11-15 | 1976-10-04 | Ass Eng Ltd | Connected structure and method of connecting same |
-
1979
- 1979-03-20 JP JP3182379A patent/JPS551982A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51112455A (en) * | 1974-11-15 | 1976-10-04 | Ass Eng Ltd | Connected structure and method of connecting same |
Also Published As
Publication number | Publication date |
---|---|
JPS551982A (en) | 1980-01-09 |
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