JPS6249244U - - Google Patents
Info
- Publication number
- JPS6249244U JPS6249244U JP1985140143U JP14014385U JPS6249244U JP S6249244 U JPS6249244 U JP S6249244U JP 1985140143 U JP1985140143 U JP 1985140143U JP 14014385 U JP14014385 U JP 14014385U JP S6249244 U JPS6249244 U JP S6249244U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- circuit device
- hybrid integrated
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985140143U JPS6249244U (enrdf_load_stackoverflow) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985140143U JPS6249244U (enrdf_load_stackoverflow) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249244U true JPS6249244U (enrdf_load_stackoverflow) | 1987-03-26 |
Family
ID=31046713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985140143U Pending JPS6249244U (enrdf_load_stackoverflow) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249244U (enrdf_load_stackoverflow) |
-
1985
- 1985-09-12 JP JP1985140143U patent/JPS6249244U/ja active Pending