JPS6248766U - - Google Patents
Info
- Publication number
- JPS6248766U JPS6248766U JP13572585U JP13572585U JPS6248766U JP S6248766 U JPS6248766 U JP S6248766U JP 13572585 U JP13572585 U JP 13572585U JP 13572585 U JP13572585 U JP 13572585U JP S6248766 U JPS6248766 U JP S6248766U
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- lead wire
- sealing insulating
- sealed
- airtight terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図は従来の気密端子を用いてパツケージさ
れた回路素子の気密パツケージの断面図、第２図
は他の従来例の気密端子の断面図、第３図は本考
案による一実施例の気密端子の断面図、第４図は
本考案による一実施例の気密端子の正面図、第５
図は本考案による前記実施例に用いる絶縁材ブロ
ツクの斜視図である。
１……ベース、２……ベース上壁、３……リー
ド線挿通孔、４……リード線、５……封着用絶縁
材、６……周壁、７……回路素子、１２……高融
点絶縁材。
Fig. 1 is a sectional view of an airtight package of a circuit element packaged using a conventional airtight terminal, Fig. 2 is a sectional view of another conventional airtight terminal, and Fig. 3 is an airtight package of an embodiment of the present invention. FIG. 4 is a cross-sectional view of the terminal, and FIG. 5 is a front view of an airtight terminal according to an embodiment of the present invention.
The figure is a perspective view of an insulating material block used in the embodiment according to the present invention. DESCRIPTION OF SYMBOLS 1...Base, 2...Base upper wall, 3...Lead wire insertion hole, 4...Lead wire, 5...Insulating material for sealing, 6...Peripheral wall, 7...Circuit element, 12...High melting point Insulating material.
Claims (1)
にリード線を挿通し、封着用絶縁材によりリード
線を封着した気密端子において、前記封着用絶縁
材の少なくともインナー側表面に前記封着用絶縁
材よりも高い融点を有する絶縁材を敷置し、前記
封着用絶縁材を溶融固化させリード線を封着した
ことを特徴とする気密端子。 In an airtight terminal in which a lead wire is inserted into a lead wire insertion hole provided in a base having a predetermined shape and the lead wire is sealed with a sealing insulating material, the sealing insulating material is provided on at least the inner side surface of the sealing insulating material. 1. An airtight terminal, characterized in that an insulating material having a melting point higher than the above is laid down, and the lead wire is sealed by melting and solidifying the sealing insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985135725U JPH0357021Y2 (en) | 1985-09-06 | 1985-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985135725U JPH0357021Y2 (en) | 1985-09-06 | 1985-09-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6248766U true JPS6248766U (en) | 1987-03-26 |
| JPH0357021Y2 JPH0357021Y2 (en) | 1991-12-25 |
Family
ID=31038187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985135725U Expired JPH0357021Y2 (en) | 1985-09-06 | 1985-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357021Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49129089U (en) * | 1973-03-05 | 1974-11-06 | ||
| JPS5626305U (en) * | 1979-08-01 | 1981-03-11 |
-
1985
- 1985-09-06 JP JP1985135725U patent/JPH0357021Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49129089U (en) * | 1973-03-05 | 1974-11-06 | ||
| JPS5626305U (en) * | 1979-08-01 | 1981-03-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357021Y2 (en) | 1991-12-25 |
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