JPS6246807A - Circulating linear feeder - Google Patents

Abstract

PURPOSE:To prevent superfluous chips from dropping in a clearance between both troughs as well as to get rid of a crack and a break in each chip, by installing a hollow receiving part in a trough at the receiving side in a transfer spot for a fed work, and also installing a slide, projecting as far as the vicinity of the receiving part, in a trough at the feeding side. CONSTITUTION:A slide 24 consisting of a downward slope jutting out onto an adjacent trough is installed in a trough at the feeding side situated in a higher position. In a trough part at the receiving side situated in a lower position, there is provided with a rolling stop part 26 which extends as far as a space zone 25 at the feeding side formed in a way of hollowing out through a lower part of the slide 24, and overlapped with the slide 24, while it becomes higher by degrees toward the space zone 25, and the chips 3 dropped from a tip end of the slide 24 are made so as to be received in a hollowed receiving part 27. Therefore, these chips 3 are in no case entered in a clearance between these troughs, so that a crack and a break in each chip is preventable and, what is more, no stop of a device happens.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a circulating linear feeder, and relates to a technique that is effective when applied to, for example, a technique for stacking and supplying dome-shaped chips onto a substrate in light emitting diode assembly.

[Background technology]

2. Description of the Related Art Face-down bonding technology is known as one of the mounting technologies for semiconductor elements (referred to as chips) in the manufacture of semiconductor devices. One of the devices that performs this face-down bonding is, for example, "Monthly Semiconductor World" published by Press Journal Co., Ltd.
emicon-ductor World) Separate volume '8
4 Buyer's Guide and Directory
s-Guide & Directory) J 1988 1
As introduced in P2O3, published on October 20th, 2
2. Description of the Related Art A flip chip bonder is known in which a chip is fixed to a substrate after positioning a substrate pattern and a chip pattern using a monitor television (ITV).

By the way, in such face-down bonding, it is necessary to supply chips with high precision.

Conventionally, as one of the devices for automatically feeding objects to be processed (parts), for example, "Automation Technology J.
February 1981 issue, published February 1, 1981, P63~
As described in P. 69, a linear feeder that linearly feeds a workpiece is known. In addition, a twin-type circulating linear feeder in which a forward side trough and a return side trough are arranged side by side has also been developed in order to continuously supply the processed material while circulating it.

However, when the above-mentioned dome-shaped light emitting diode chips are fed using a conventional circulating linear feeder, the chip size is 0.4 mm or 0.4 mm.
．． Because its size is extremely small (6 mm), excess chips that move from one trough to the other may fall into the gap between both troughs and cause clogging, or the chips may crack and chip, reducing the operating rate. The inventors have found that this causes a decrease in yield and a decrease in yield.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a circulating linear feeder that can perform linear feeding without damaging the material to be fed.

Another object of the present invention is to provide a circulating linear feeder that can improve operating efficiency.

Another object of the present invention is to provide a circulating linear feeder that can achieve high-speed feeding of materials.

Another object of the present invention is to provide a circulating linear feeder that can be used for face-down bonding assembly and can improve throughput.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this example is as follows.

That is, the circulating linear feeder having the advance side trough and the return side trough of the present invention prevents surplus chips transferred from the advance side trough to the return side trough or from the return side trough to the advance side trough from entering the gap between both troughs. In order to do this, a feed bar is provided on the sending side of the trough that overhangs the receiving trough, and a feed bar is provided in the receiving trough to prevent chips that have fallen from the tip of the feed bar from being transferred to the interface between the two troughs. Since a recessed receiving part (or a protruding transfer prevention part) is provided in the trough, there is no possibility that the chip will enter the gap between the two troughs and cause clogging when moving between the two troughs, thereby improving the operating rate. will improve. In addition, in the circulating linear feeder of the present invention, as mentioned above, chips do not get caught between the troughs, so no large external force is applied, chips can be prevented from cracking, and the supply yield can be improved. It can be achieved.

〔Example〕

FIG. 1 is a plan view showing the essential parts of a circulating linear feeder according to an embodiment of the present invention, FIG. 2 is a front view, FIG. 3 is a cross-sectional view taken along line m-m in FIG. The figures are the same <
5 is a sectional view taken along the line IV-IV, FIG. 5 is a sectional view taken along the same line V-V, and FIG. 6 is a partially enlarged sectional view showing a state in which surplus articles return from the advance side trough to the return side trough. 7th
This figure is a perspective view showing a state in which a substrate and a chip are stacked on a light emitting diode, and FIG. 8 is a perspective view showing a state in which a chip is stacked on a substrate.

As shown in FIGS. 7 and 8, the alignment and supply device of this embodiment has near-infrared light emitting diode elements (chips) 3 on the upper surface of a substrate 2 fixed to the main surface of a TO-shaped stem 1. Applies to technology that connects by face-down bonding. The chip 3 has a hemispherical (dome) shape at the top and has circular and horseshoe-shaped electrodes 4 and 5 on the bottom surface, as shown by the broken line in FIG.

Further, wiring layers 6 and 7 having portions corresponding to the electrodes 4 and 5 are provided on the main surface of the substrate 2. After the chip 3 is held by a bonding tool such as a collet, it is connected so that the electrodes 4 and 5 of the chip 3 overlap the wiring layers 6 and 7 of the substrate 2, as shown in FIG. Ru. Note that 8 in the figure is a lead.

As shown in FIG. 1, the circulating linear feeder of this embodiment is a twin type in which two linear feeders 9 and 10 are arranged side by side. In other words, the linear feeder is
As shown in FIG. 2, a main body 11 having a trough on its main surface (upper surface) for guiding the material to be supplied is supported on a base 14 by a pair of inclined leaf springs 12 and 13. It has a structure. Then, the main body 11 is vibrated by a vibration mechanism including an electromagnet (not shown) to vibrate, and the material to be supplied contained in the trough of the main body 11 is moved. Note that 15 in FIG. 2 is a screw that connects the leaf springs 12, 13 and the pace 14 or the main body 11.

Therefore, in the circulating linear feeder of this embodiment, the first
As shown in the figure, the trough of the linear feeder 9 on the front side is used as the advancing side trough 16, and the chips 3 as shown in FIG. The trough of the linear feeder IO is used as a return side trough 17, and the chips 3 are moved from right to left. Furthermore, a protruding material supply table 18 is provided at the forward end of the forward side trough 16. The material supply table 18 has a guide groove 19 connected to the advancing side trough 16, and a stopper 20 (wall surface at the end of the groove) is provided at the tip thereof. Therefore, the chips 3 that have advanced through the advancing side trough 16 are placed in the guide groove 1.
9 and moves forward until it comes into contact with a stopper 20 and stops.

Furthermore, the object supply table 18 is made of a transparent material. Therefore, if a television camera is installed below this material supply table 18, it is possible to detect the electrodes 4.degree. Position of.

Directionality can be detected with high precision. therefore,
Based on the information detected by the television camera, the chip 3 on the supply table 18 is adsorbed by a collet, and the chip 3 is placed on the substrate 2 of the stem whose position and direction are corrected based on the information detected by the television camera. By transporting and stacking the chips 3 on the substrate 2, highly accurate bonding between the substrate 2 and the chips 3 can be achieved.

The advancing side trough 16 receives chips 3 from the returning side trough 17 at its left end, and also receives the chips 3 from the returning side trough 17 at the left end.
As shown in the figure, as you go to the right, the road becomes uphill and gradually narrows. As shown in FIG. 6, the trough portion of the advancing trough 16 corresponding to the right end of the returning trough 17 is a separation path 21 narrow enough for one chip 3 to pass through. This separation path 21 has a guide wall 22 for guiding the chips 3 on one side thereof, but has no guide wall on the other side and has a downward separation ring 23 in which the chips 3 are transferred and dropped. Therefore, when the chip 3 passes through the separation path 21 with a width of δ,
As shown in FIG. 6, the chip 3 is not on the left side.
In other words, as shown in the figure, the excess chips 3 are removed from the separation path 21, transferred down the separation ring 23, and enter the adjacent return side trough 17.

The advancing side trough 16 and the returning side trough 17 are configured to move the chip 3 along a groove having a rectangular cross section. Moreover, the chips 3 are adapted to move along an uphill slope, as shown in FIGS. 2 and 3, respectively. Therefore, at the position where the chips 3 have reached the top of the uphill slope, that is, at the left end of the linear feeder 10 and at the right end of the linear feeder 9a, the chips 3 are
is designed to enter the adjacent trough. At this time, as shown in FIGS. 4 and 5, the feed side trough located at a high position is provided with a feed platform 24 consisting of a downward slope extending over the adjacent trough. Further, the lower receiving side trough portion is provided with a transfer prevention portion 26 that extends to a sending side space region 25 formed by separately penetrating the lower part of the feeding table 24. This rolling stop part 26 has a structure that overlaps the feed table 24, and gradually becomes higher toward the space area 25, and prevents chips 3 that have fallen from the tip of the feed table 24.
It is adapted to be received in a recessed receiving portion 27. Therefore, when the chips 3 are transferred from one trough to the other, the chips 3 are transferred from the tip of the feed bar 24 to the receiving portion 27 in the center of the receiving trough, as shown in FIGS. 4 and 5. Since this receiving part 27 has a high transfer prevention part 2G between it and the adjacent trough, it will not get into the gap between the troughs, and the receiving part 27 will not enter the gap between the troughs, and the receiving part 27 will not enter the gap between the troughs. move smoothly within. In addition, the above-mentioned separation plate 23 also serves as the above-mentioned feed table 24.

Such a circulating linear feeder is called linear feeder 1.
If a large number of chips 3 are placed in the chip 0, they are sequentially transferred and delivered to the supply table 18.

In addition, the chip 3 has a hemispherical shape (dome shape), and -
Since the surface is a flat surface, it rolls due to the vibrations applied during movement, resulting in a stable posture, that is, a posture with the flat surface facing downward. In addition, this circulation type linear feeder has a feeding table 24 at the transition part between the troughs of the chips 3.
．． Since the receiving part 27° and the rolling prevention part 26 are provided,
The chip 3 will not get stuck between the troughs, and the chip 3 can be prevented from cracking and chipping. Further, since this circulating linear feeder does not cause clogging due to the chips 3 entering between the troughs, there is no need to stop the apparatus.

〔effect〕

(1) Since the circulating linear feeder of the present invention has a structure in which the material to be fed is circulated between a pair of linear feeders, high-speed and continuous feeding work is possible, and throughput can be improved.

(2) The circulating linear feeder of the present invention has a structure that prevents the material from entering the gap at the interface between the two troughs when the material is transferred between the troughs in a pair of linear feeders. Since a large force is not applied to the supplied material and damage to the supplied material can be prevented, the yield can be improved.

(3) From (2) above, in the circulating linear feeder of the present invention, the material to be fed does not enter between the troughs when the material is transferred between the troughs, so clogging does not occur and the operating rate of the device is improved. The effect of improvement can be obtained.

(4) From the above (2) and (3), according to the circulating linear feeder of the present invention, since the objects to be fed can be sequentially fed to predetermined positions, the effect of highly accurate feeding can be obtained.

(5) According to the above (11), in the circulating linear feeder of the present invention, since each operation is automated, it is possible to reduce the number of workers.

(6) Due to the above (1) and (2), the circulating linear feeder of the present invention has the effect that productivity can be improved by improving feeding accuracy and feeding speed.

(7) According to (1) to (6) above, the circulating linear feeder of the present invention can be used for mounting dome-shaped chips of light emitting diodes, thereby achieving high-quality assembly at high speed without requiring much manpower. Since the process can be carried out in the following manner, a synergistic effect can be obtained in that the manufacturing cost of the light emitting diode device can be reduced.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, the material supply table may not be transparent (although the material to be supplied can be automatically supplied at high speed and with high accuracy as in the above embodiment).

[Application field]

In the above description, the invention made by the present inventor is mainly applied to the chip supply technology in the face-down bonding technology, which is the field of application in which the invention is based, but the present invention is not limited thereto.

The present invention is applicable to at least automatic feeding technology for fine articles.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the essential parts of a circulating linear feeder according to an embodiment of the present invention, FIG. 2 is a front view, FIG. 3 is a sectional view taken along line 4-m in FIG. The figures are the same< Cross-sectional view along the IV-IV line, Figure 5 is the same<
A cross-sectional view taken along the v-vwc line, FIG. 6 is a partially enlarged cross-sectional view showing the state in which surplus items return from the advance side trough to the return side trough, and FIG. FIG. 8 is a perspective view showing a state in which chips are stacked on a substrate. DESCRIPTION OF SYMBOLS 1... Stem, 2... Substrate, 3... Light emitting diode (chip), 4.5... Electrode, 6.7... Wiring layer, 8... Lead, 9.10...・Linear feeder, 1
DESCRIPTION OF SYMBOLS 1... Main body, 12.13... Leaf spring, 14... Base, 15... Screw, 16... Advance side trough, 17
...Return side trough, 1B...Supplied material supply stand, 19
... Guide groove, 20 ... Stopper, 21 ... Separation path, 22 ... Guide wall, 23 ... Separation ring, 24 ...
・Feeding stand, 25... Spatial area, 26... 3rd
figure

Claims (1)

[Claims] 1. A circulating linear feeder in which a forward side trough and a return side trough are arranged side by side, and the receiving side trough at the transfer point of the supplied material is provided with a recessed receiving part. A circulation type linear feeder characterized in that the feed side trough is provided with a feed base that extends to the vicinity of the receiving portion. 2. The circulating linear feeder according to claim 1, wherein the material supply stage provided at the advancing end of the advancing side trough for feeding the material is made of a transparent body.