JPS6244285A - 椅子の椅子カバ−の張り付け機 - Google Patents
椅子の椅子カバ−の張り付け機Info
- Publication number
- JPS6244285A JPS6244285A JP18343685A JP18343685A JPS6244285A JP S6244285 A JPS6244285 A JP S6244285A JP 18343685 A JP18343685 A JP 18343685A JP 18343685 A JP18343685 A JP 18343685A JP S6244285 A JPS6244285 A JP S6244285A
- Authority
- JP
- Japan
- Prior art keywords
- chair cover
- chair
- lower support
- pasting
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010030 laminating Methods 0.000 title 1
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 description 10
- 239000011162 core material Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000010793 Steam injection (oil industry) Methods 0.000 description 7
- 230000001629 suppression Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000011120 plywood Substances 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000010985 leather Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18343685A JPS6244285A (ja) | 1985-08-21 | 1985-08-21 | 椅子の椅子カバ−の張り付け機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18343685A JPS6244285A (ja) | 1985-08-21 | 1985-08-21 | 椅子の椅子カバ−の張り付け機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6244285A true JPS6244285A (ja) | 1987-02-26 |
| JPH0125595B2 JPH0125595B2 (cg-RX-API-DMAC7.html) | 1989-05-18 |
Family
ID=16135736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18343685A Granted JPS6244285A (ja) | 1985-08-21 | 1985-08-21 | 椅子の椅子カバ−の張り付け機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244285A (cg-RX-API-DMAC7.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
| US6669489B1 (en) | 1993-11-16 | 2003-12-30 | Formfactor, Inc. | Interposer, socket and assembly for socketing an electronic component and method of making and using same |
| US7195503B2 (en) | 1999-08-17 | 2007-03-27 | Formfactor, Inc. | Electrical contactor, especially wafer level contactor, using fluid pressure |
| US7396236B2 (en) | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
-
1985
- 1985-08-21 JP JP18343685A patent/JPS6244285A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6669489B1 (en) | 1993-11-16 | 2003-12-30 | Formfactor, Inc. | Interposer, socket and assembly for socketing an electronic component and method of making and using same |
| US6913468B2 (en) | 1993-11-16 | 2005-07-05 | Formfactor, Inc. | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
| US7195503B2 (en) | 1999-08-17 | 2007-03-27 | Formfactor, Inc. | Electrical contactor, especially wafer level contactor, using fluid pressure |
| US7396236B2 (en) | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125595B2 (cg-RX-API-DMAC7.html) | 1989-05-18 |