JPS6242387B2 - - Google Patents
Info
- Publication number
- JPS6242387B2 JPS6242387B2 JP56047418A JP4741881A JPS6242387B2 JP S6242387 B2 JPS6242387 B2 JP S6242387B2 JP 56047418 A JP56047418 A JP 56047418A JP 4741881 A JP4741881 A JP 4741881A JP S6242387 B2 JPS6242387 B2 JP S6242387B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- ceramic
- ceramic substrate
- main surface
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4741881A JPS57162451A (en) | 1981-03-31 | 1981-03-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4741881A JPS57162451A (en) | 1981-03-31 | 1981-03-31 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57162451A JPS57162451A (en) | 1982-10-06 |
JPS6242387B2 true JPS6242387B2 (enrdf_load_stackoverflow) | 1987-09-08 |
Family
ID=12774601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4741881A Granted JPS57162451A (en) | 1981-03-31 | 1981-03-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57162451A (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5758783B2 (enrdf_load_stackoverflow) * | 1973-02-22 | 1982-12-11 | Nippon Electric Co | |
JPS5449070A (en) * | 1977-09-26 | 1979-04-18 | Nec Corp | Container for semiconductor device |
-
1981
- 1981-03-31 JP JP4741881A patent/JPS57162451A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57162451A (en) | 1982-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5293301A (en) | Semiconductor device and lead frame used therein | |
US5075759A (en) | Surface mounting semiconductor device and method | |
US5909058A (en) | Semiconductor package and semiconductor mounting part | |
US5841183A (en) | Chip resistor having insulating body with a continuous resistance layer and semiconductor device | |
EP2159837B1 (en) | Electronic component storing package and electronic device | |
US5406120A (en) | Hermetically sealed semiconductor ceramic package | |
JP3336982B2 (ja) | 半導体装置およびその製造方法 | |
EP0517967B1 (en) | High current hermetic package | |
JPH1174439A (ja) | 樹脂モールドパッケージ | |
KR950009625B1 (ko) | 유리봉지형 세라믹 패키지 | |
EP0408904A2 (en) | Surface mounting semiconductor device and method | |
JPH04249353A (ja) | 樹脂封止型半導体装置 | |
JPH0645504A (ja) | 半導体装置 | |
JPH0382060A (ja) | 半導体装置 | |
JPS6242387B2 (enrdf_load_stackoverflow) | ||
JPS6120768Y2 (enrdf_load_stackoverflow) | ||
JPH05315467A (ja) | 混成集積回路装置 | |
JPS639664B2 (enrdf_load_stackoverflow) | ||
JP2690248B2 (ja) | 表面実装型半導体装置 | |
JP2834878B2 (ja) | 混成集積回路 | |
JP2870501B2 (ja) | 半導体装置 | |
JP2002184890A (ja) | 表面実装型半導体装置 | |
KR100861509B1 (ko) | 전기적 및 열적으로 향상된 반도체 패키지 | |
JP3527902B2 (ja) | 半導体素子収納用パッケージおよび半導体装置 | |
JP2629653B2 (ja) | 半導体装置 |