JPS6241264Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a handling jig for special semiconductor packages that enables testing of LSIs and other devices built into special semiconductor packages with exposed terminals on the periphery, using the most common DIT (Dual Inline Type) type autohandler for semiconductor packages.

When developing a special semiconductor package of the type mentioned above, it is necessary to test the LSI etc. built into the special semiconductor package, but a special autohandler is prepared each time for this test. The problem was that doing so required a large amount of money and increased development costs.

This invention is intended to solve the above problems.
The object of the present invention is to provide a handling jig for special semiconductor packages that enables testing of special semiconductor packages using a ready-made autohandler for DIT type semiconductor packages.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front sectional view of a handling jig for a special semiconductor package, and FIG. 2 is an exploded perspective view. In the figure, 1 is a handling jig and 2 is a special semiconductor package.

The handling jig 1 is a contact guide 3
, a package guide 4, and a package presser 5.

The contact guide 3 includes a plurality of metal contact pins 7 provided on the surface of an insulating substrate 6 made of synthetic resin or the like. The contact pins 7 are provided in a number corresponding to the terminal portions 8 of the special semiconductor package 2, one end 7a of which is located in the center of the substrate 6 in a position where it can contact the terminal portion 8, and the other end 7b is located on both sides of the substrate 6. They face each other and protrude below the substrate 6.

The package guide 4 has a through hole 10 for storing the special semiconductor package 2 in the center of an insulating plate 9 made of synthetic resin or the like which is thinner than the thickness of the special semiconductor package 2.
, one end 7a of each contact pin 7 is connected to the through hole 10.
They are overlapped so that they are exposed inside and are attached using coupling screws (not shown) or the like.

The package retainer 5 is removably attached to the package guide 4 using a mounting screw (not shown) or the like.

Now, the special semiconductor package 2 is stored in the through hole 10 of the package guide 4 attached to the contact guide 3, and the package presser 5 is placed over it.
When the is attached to the package guide 4 and assembled, since the thickness of the insulating plate 9 is thinner than the thickness of the special semiconductor package 2 as described above, the special semiconductor package 2 is pressed by the package presser 5 and its respective terminals are pressed. 8 contacts one end 7a of each contact pin 7 while maintaining an appropriate pressure. Since the shape in this state is similar to that of a general DIT type semiconductor package, it is possible to use the autohandler for the DIT type semiconductor package.

Furthermore, in this embodiment, a thin elastic rubber 11 is attached to the center of the surface of the insulating substrate 6, and each contact pin 7 is formed so that one end 7a thereof rests on the periphery of the elastic rubber 11. , by utilizing the elastic force of the elastic rubber 11, the terminal portion 8 and one end 7 of the contact pin 7 during assembly.
It is possible to further improve the reliability of the contact state with a.

As described above, according to the present invention, it is possible to test special semiconductor packages using an off-the-shelf DIT type autohandler for semiconductor packages, so there is no need to prepare a special autohandler, and development costs are reduced. It is possible to reduce the

[Brief explanation of the drawing]

FIG. 1 is a front sectional view showing an embodiment of a handling jig for a special semiconductor package according to the present invention, and FIG. 2 is an exploded perspective view of the same, in which 1 is a handling jig, 2 is a special semiconductor package handling jig, 3 is a handling jig for a special semiconductor package, and 3 is an exploded perspective view of the same. is a contact guide, 4 is a package guide, 5 is a package holder, 6 is an insulating board, 7 is a contact pin,
7a is one end, 7b is the other end, 8 is a terminal portion, 9 is an insulating plate, 10 is a through hole, and 11 is an elastic rubber.

Claims (1)

[Scope of utility model registration request] A plurality of metal contact pins corresponding to each terminal part of a special semiconductor package with a plurality of terminal parts exposed at the periphery are attached to the surface of an insulating substrate with elastic rubber in the center, and each contact pin a contact guide having one end positioned so as to be in contact with each terminal portion of the special semiconductor package and riding around the elastic rubber, and the other end protruding downward on both sides of the substrate; A through hole for accommodating the special semiconductor package is provided in the center of an insulating plate thinner than the thickness of the special semiconductor package, and the contact pin is stacked on the contact guide so that one end of the contact pin is exposed in the through hole. A package guide attached together with the special semiconductor package detachably attached to the surface of the package guide and housed in the through hole is pressed to press each terminal portion of the special semiconductor package to one end of each of the contact pins. A handling jig for a special semiconductor package, comprising a package holder made of an insulating material.