JPH037954Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to an integrated circuit device such as a one-chip microcomputer in which integrated circuit elements are enclosed, and in particular relates to an IC package that can evaluate the functions of a one-chip microcomputer. be.

In recent one-chip microcontrollers, the built-in
The ROM, PLA, input/output ports, etc. are mask options that can be selected by the user.
Therefore, for one-chip microcontrollers, before going into actual mass production, we manufacture an evaluation chip that is almost the same as the finished product but does not have mask options. It is necessary to externally attach a predetermined circuit to replace the one-chip microcontroller, and perform functional tests and evaluations on various one-chip microcomputers. Also, regarding the ROM in which user programs etc. are written,
It is usually formed with a mask ROM, but in small-volume production products, it may be built in as an EPROM so that program debugging can be performed during the above evaluation.

In order to evaluate as described above, if it is externally connected, it is necessary that the conduction means such as the external terminal for external
It is necessary to provide a terminal other than the regular external terminals arranged on the IC package, and even if an EPROM is built-in, a conduction means is required for writing to it.

Therefore, in order to solve the above problems, this invention
In an integrated circuit device in which a microcomputer element with a circuit integrated on the surface of the substrate is enclosed in an IC package, regular external terminals are arranged according to the standard at the bottom of the IC package, and the microcomputer element is placed at the top of the IC package. The present invention provides an integrated circuit device characterized in that it is equipped with evaluation conduction means consisting of external terminal receiving holes arranged so that other IC packages can be mounted during functional evaluation of computer elements.

Hereinafter, an example of a separate application and an embodiment of the present invention will be described in detail with reference to the drawings.

1 and 2 are a plan view and a side view of an integrated circuit device, which is an example of a separately filed application.

This example is a 42-pin IC package PKG that houses elements such as a one-chip microcontroller (not shown).
The 42 regular external terminals RL are arranged according to the standard in terms of shape and position (for example, l in Figure 2), and a separate evaluation external terminal EL is provided to be used when evaluating the functionality of the device. ing. A device for evaluation is housed in such a device, mounted on a motherboard, etc., and circuits such as a predetermined simulated ROM, PLA, input/output port, etc. are mounted via the external terminal EL for evaluation, and various types of Perform a functional test.

After the above evaluation is completed, the completed device is then housed and actually used as an integrated circuit device. At that time, for example, the external evaluation terminal EL is cut off and the device is mounted on the motherboard. In this case, there will be no problem since the regular external terminals RL are arranged according to the standard.

3 and 4 are a plan view and a side view of an embodiment of the present invention. In this embodiment, external terminal receiving holes EH are arranged on the top surface of the IC package RKG so that another IC package PKG1 can be mounted on the top of the IC package RKG. Electrical conduction between the accommodated element and the receiving hole EH is achieved by multilayer wiring when the IC package PKG is laminated. In the IC package PKG, regular external terminals RL are arranged according to the standard, similar to the above-mentioned example of the separate application. Other IC packages installed during evaluation in this example
As PKG1, for example, ROM etc. can be considered.
In other words, during evaluation, the installed ROM is used in place of the ROM built into the one-chip microcontroller, and once the completed device is accommodated, the ROM is
is not installed.

An important point of the present invention is that the same IC package can be used whether it is accommodating an element for evaluation or a completed element. For that purpose, the regular external terminal RL is
Arranged according to standards.

According to the present invention, the ROM, etc. used during evaluation
IC package PKG1 can be easily connected and mounted to IC package PKG.
IC is placed in high density on the mounting board on which PKG1 is mounted.
Packages can be implemented.

The present invention is very effective in terms of cost, especially in the case of products produced in small quantities, since the same IC package, motherboard, etc. can be used during evaluation as in the case of the finished product.

[Brief explanation of the drawing]

1 and 2 are a plan view and a side view of an example of the separately filed application, and FIGS. 3 and 4 are a plan view and a side view of an embodiment of the present invention. In the figure, PKG: IC package, PKG1: other IC
Package cage, RL: Regular external terminal, EL: External terminal for evaluation, EH: External terminal receiving hole.

Claims (1)

[Claim for Utility Model Registration] An integrated circuit device in which a microcomputer element with circuits integrated on the surface of a substrate is enclosed in an IC package, including regular external terminals arranged according to standards at the bottom of the IC package; 1. An integrated circuit device, characterized in that an evaluation conduction means is provided on the upper part of the IC package, the conduction means consisting of receiving holes for external terminals arranged so that another IC package can be mounted when evaluating the function of the microcomputer element.