JPS6240449Y2 - - Google Patents
Info
- Publication number
- JPS6240449Y2 JPS6240449Y2 JP1980147769U JP14776980U JPS6240449Y2 JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2 JP 1980147769 U JP1980147769 U JP 1980147769U JP 14776980 U JP14776980 U JP 14776980U JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode body
- glass tube
- large diameter
- diameter portion
- diameter part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- SDIXRDNYIMOKSG-UHFFFAOYSA-L disodium methyl arsenate Chemical compound [Na+].[Na+].C[As]([O-])([O-])=O SDIXRDNYIMOKSG-UHFFFAOYSA-L 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980147769U JPS6240449Y2 (ko) | 1980-10-16 | 1980-10-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980147769U JPS6240449Y2 (ko) | 1980-10-16 | 1980-10-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5771355U JPS5771355U (ko) | 1982-04-30 |
JPS6240449Y2 true JPS6240449Y2 (ko) | 1987-10-16 |
Family
ID=29507261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980147769U Expired JPS6240449Y2 (ko) | 1980-10-16 | 1980-10-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6240449Y2 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5636163B2 (ko) * | 1974-08-09 | 1981-08-22 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5636163U (ko) * | 1979-08-25 | 1981-04-07 |
-
1980
- 1980-10-16 JP JP1980147769U patent/JPS6240449Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5636163B2 (ko) * | 1974-08-09 | 1981-08-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS5771355U (ko) | 1982-04-30 |
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