JPS6240449Y2 - - Google Patents

Info

Publication number
JPS6240449Y2
JPS6240449Y2 JP1980147769U JP14776980U JPS6240449Y2 JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2 JP 1980147769 U JP1980147769 U JP 1980147769U JP 14776980 U JP14776980 U JP 14776980U JP S6240449 Y2 JPS6240449 Y2 JP S6240449Y2
Authority
JP
Japan
Prior art keywords
electrode body
glass tube
large diameter
diameter portion
diameter part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980147769U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5771355U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980147769U priority Critical patent/JPS6240449Y2/ja
Publication of JPS5771355U publication Critical patent/JPS5771355U/ja
Application granted granted Critical
Publication of JPS6240449Y2 publication Critical patent/JPS6240449Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP1980147769U 1980-10-16 1980-10-16 Expired JPS6240449Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980147769U JPS6240449Y2 (en, 2012) 1980-10-16 1980-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980147769U JPS6240449Y2 (en, 2012) 1980-10-16 1980-10-16

Publications (2)

Publication Number Publication Date
JPS5771355U JPS5771355U (en, 2012) 1982-04-30
JPS6240449Y2 true JPS6240449Y2 (en, 2012) 1987-10-16

Family

ID=29507261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980147769U Expired JPS6240449Y2 (en, 2012) 1980-10-16 1980-10-16

Country Status (1)

Country Link
JP (1) JPS6240449Y2 (en, 2012)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636163U (en, 2012) * 1979-08-25 1981-04-07

Also Published As

Publication number Publication date
JPS5771355U (en, 2012) 1982-04-30

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