JPS6239081A - Light-emitting semiconductor device - Google Patents
Light-emitting semiconductor deviceInfo
- Publication number
- JPS6239081A JPS6239081A JP60178348A JP17834885A JPS6239081A JP S6239081 A JPS6239081 A JP S6239081A JP 60178348 A JP60178348 A JP 60178348A JP 17834885 A JP17834885 A JP 17834885A JP S6239081 A JPS6239081 A JP S6239081A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- signal
- elements
- infrared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
く技術分野〉
本発明は、ＴＶ、ＶＴＲ、ニアコンディショナー等の遠
隔繰作装置（ワイヤレスリモートコントロール）に使用
される発光ダイオード等の発光半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a light emitting semiconductor device such as a light emitting diode used in a remote operation device (wireless remote control) such as a TV, VTR, or near conditioner.
く従来技術〉
従来、この種のリモートコントロール（遠隔繰作装置）
は、機器本体の受信、受光部を狙って発信、発光する単
方向性のものと、受光、受信部を狙わなくとも発光、発
信する無方向性のものとがあり、これは造営物（床面、
天井面、壁面等）の反射により受信部が受信できるよう
構成されている。Conventional technology> Conventionally, this type of remote control (remote operation device)
There are unidirectional types that transmit and emit light by aiming at the reception and light receiving part of the device, and non-directional types that emit light and emit light without aiming at the reception and reception part. surface,
The receiver is configured so that the receiver can receive the signal by reflection from the ceiling, wall, etc.
特に無方向性のものは、リモートコントロールに使用さ
れているＬＥＤ（発光ダイオード）が複数個適当な反射
方向を有して設置されている。しかし、ＬＥＤの取付方
向や角度の正確な位置出しが困難であったり、正確な取
付ができても製造途上で物理的に外力により歪められた
りすることがあり、リモコンのハウジングの影響を受け
ることもあった。また部品点数が多いため材料管や製造
工程数も複雑で信頼性管理の面でも多くの問題点があっ
た。Particularly in the non-directional type, a plurality of LEDs (light emitting diodes) used for remote control are installed with appropriate reflection directions. However, it is difficult to accurately position the LED in the mounting direction and angle, and even if accurate mounting is possible, it may be physically distorted by external forces during manufacturing, and it may be affected by the remote control housing. There was also. In addition, since there were many parts, the material pipes and the number of manufacturing processes were complicated, and there were many problems in terms of reliability management.
く 目 的 〉
本発明は、可視光線と赤外線等のごとく二種の発光およ
び無方向性の発光が可能で、部品点数の削減および製造
工程数の削減を計り得る発光半導体装置の提供を目的と
する。Purpose The purpose of the present invention is to provide a light emitting semiconductor device that is capable of emitting two types of light such as visible light and infrared light, and non-directional light emission, and that can reduce the number of parts and manufacturing steps. do.
〈実施例〉
以下、本発明の実施例を第１図ないし第４図に基づいて
説明すると、本発明に係るリモートコントロール（遠隔
操作装置）等に使用される発光半導体装置としての発光
ダイオードは、−個（または複数個の）第一発光素子で
ある可視光線発光用の可視光ダイオード素子１と複数個
（または−個の）第二発光素子である赤外線発光用の赤
外線ダイオード素子２とがパッケージ（Ｂ）に一体化（
封入）され、該パッケージ（Ｂ）に駆動回路４が一体化
されたものである。<Example> Hereinafter, examples of the present invention will be described based on FIGS. 1 to 4. A light emitting diode as a light emitting semiconductor device used for a remote control (remote operation device) etc. according to the present invention will be described below. - Visible light diode elements 1 for emitting visible light that are (or a plurality of) first light emitting elements and infrared diode elements 2 for emitting infrared light that are a plurality (or -) of second light emitting elements are packaged. (B) integrated (
The drive circuit 4 is integrated into the package (B).
また、Ａ、Ｓ、には夫々７ノード、シグナル、カソード
の各端子を示す。第２，３図のごとく、パッケージ３の
中には四個の前記赤外線ダイオード素子２が平面視して
夫々９０°の角度で配列され、−個の前記可視光ダイオ
ード素子１は該赤外線ダイオード素子２の中心にありパ
ッケージ３の基台部５に直角に配置されている。また前
記赤外線ダイオード素子２は該基台部５に側面視して一
定角度θで配列されている。そして前記パッケージ３は
透明プラスチック素材により形成されている。Furthermore, A and S indicate seven nodes, signal terminals, and cathode terminals, respectively. As shown in FIGS. 2 and 3, in the package 3, the four infrared diode elements 2 are arranged at an angle of 90 degrees when viewed from above, and the - visible light diode elements 1 are the infrared diode elements. 2 and is disposed at right angles to the base portion 5 of the package 3. Further, the infrared diode elements 2 are arranged on the base portion 5 at a constant angle θ when viewed from the side. The package 3 is made of transparent plastic material.
Ｚは四個の前記赤外線ダイオード素子２の赤外線放射方
向を示腰Ｙは前記可視光ダイオード素子１の可視光線放
射方向を示す。Z indicates the direction in which the four infrared diode elements 2 emit infrared rays, and Y indicates the direction in which the visible light diode element 1 emits visible light.
また、第４図はこれらの複数個の前記素子１゜２の駆動
回路４の実施例を示すものである。図中６．７，８，９
．１０は抵抗、１１．１２はＮＰＮトランジスタである
。該抵抗６１７４８．９．１１）＃よびトランジスタ１
１．１２は前記基台部５の中に組み込まれる。また、前
記駆動回路４と前記画素子１，２と前記７ノードＡ、カ
ソードＫ、シグナルＳとは金線１３で接続されている。Further, FIG. 4 shows an embodiment of the driving circuit 4 for these plurality of elements 1.2. 6.7, 8, 9 in the figure
．． 10 is a resistor, and 11.12 is an NPN transistor. The resistor 61748.9.11) # and transistor 1
1.12 is incorporated into the base part 5. Further, the drive circuit 4, the pixel elements 1 and 2, the seven nodes A, the cathode K, and the signal S are connected by gold wires 13.
次に、駆動回路４の動作を説明すると、アンードＡには
直流電源の＋側、カン−１’Ｋには直流電源の一側が接
続される。そしてシグナルＳに信号コードが印加される
と、そのハイレベル信号に同期してトランジスタ１１が
導通し、次にトランジスタ１２をスイッチングせしめる
。したがって四個の赤外線ダイオード素子２には負荷抵
抗７，８を介して信号に同期した電流が流れ、赤外線（
信号）を放出（放射）する。またこのとき可視光ダイオ
ード素子１も通電されて可視光線を放射する。Next, the operation of the drive circuit 4 will be described. The + side of the DC power supply is connected to the AND A, and one side of the DC power supply is connected to the can -1'K. When a signal code is applied to the signal S, the transistor 11 becomes conductive in synchronization with the high level signal, and then the transistor 12 is switched. Therefore, current synchronized with the signal flows through the four infrared diode elements 2 via the load resistors 7 and 8, and the infrared rays (
emit (radiate) a signal). At this time, the visible light diode element 1 is also energized and emits visible light.
以上の説明のごとく、見掛上は一個の発光ダイオードが
赤外線も可視光線も発光するので、使用者にとっても信
号を発信したタイミング、あるいはその事実が容易に確
認でき、視覚効果が上がるばかりでなく、−個の発光ダ
イオードとしてパッケージされているので、製造途上の
扱いが簡単であり、駆動回路４もパッケージ３に一体化
されているので、回路設計や製造工程も簡素化でき、取
付スペースも少しで良い等のメリットがある。また、パ
ッケージ材料も一定波長帯域をカットできる光学フィル
ター材料とすることにより、従来のリモートコントロー
ルとしての発光（信）部に必要だった光学フィルターを
省略することができ、リモートコントロールのハウジン
グも比較的制限を受けることなくフレキシブルな構造設
計も可能となる。なお、本発明は、上記実施例に限定さ
れるものではなく、本発明の範囲内で上記実施例に多く
の修正および変更を加え得ることは勿論である。As explained above, since a single light emitting diode appears to emit both infrared and visible light, it is easy for the user to confirm the timing or fact that a signal was sent, which not only improves the visual effect but also Since it is packaged as , - light emitting diodes, it is easy to handle during the manufacturing process, and since the drive circuit 4 is also integrated into the package 3, the circuit design and manufacturing process can be simplified, and the installation space is small. There are many advantages such as: In addition, by using an optical filter material that can cut a certain wavelength band for the package material, it is possible to omit the optical filter that was required for the light emitting (transmission) part of the conventional remote control, and the housing of the remote control is also relatively small. Flexible structural design is also possible without restrictions. It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
く効果〉
以上の説明から明らかな通り、本発明は、−個または複
数個の第一発光素子と複数個または一個の第二発光素子
とがパッケージに一体化封入されたことを特徴とする発
光ダイオードに関するらのである。Effect> As is clear from the above description, the present invention provides a light emitting device characterized in that - one or more first light emitting elements and one or more second light emitting elements are integrally enclosed in a package. This is about diodes.
したがって、本発明によれば、第一、第二発光素子によ
り可視光線と赤外線等のごとく二種の発光および無方向
性の発光が可能であり、かつ従来必要とされた多数の信
号用発光素子や発信確認のためパイロツ）ＬＥＤ（可視
光ＬＥＤ）が省略でき、リモートコントロールの回路設
計や構造設計が極めて簡素化できる。なお、本発明を実
施例のごとく抵抗お上びトランジスタ等の駆動回路を基
台部に組み込むことによって発光半導体装置の製造工程
および部品管理や信頼性の管理も極めて簡素化できるの
で、本発明装置を装着すべき電気機器の総コストや又ベ
ースも省力化でき、安価で性能、信頼性の良いリモート
コントロール等に付属する発光半導体装置を提供するこ
とができるといった優れた効果がある。Therefore, according to the present invention, the first and second light emitting elements can emit two types of light such as visible light and infrared rays, and non-directional light emission, and a large number of signal light emitting elements are required in the past. The pilot LED (visible light LED) for confirming transmission can be omitted, and the circuit design and structural design of the remote control can be extremely simplified. It should be noted that by incorporating the present invention into the base part with a resistor and a drive circuit such as a transistor as in the embodiment, the manufacturing process of the light emitting semiconductor device and the component management and reliability management can be extremely simplified. This has excellent effects such as saving the total cost of electrical equipment to which the device is attached, as well as the labor required for the base, and making it possible to provide a light-emitting semiconductor device attached to a remote control, etc., which is inexpensive, has good performance, and has good reliability.
第１図は本発明の実施例を示す発光ダイオードの側面構
成図、第２図は同じくそのパッケージを透視状態で示す
平面図、第３図は同側面図、第４図は同駆動回路を示す
電気回路図である。
Ａニアノード、Ｋ：カソード、Ｓ：シグナル、１：可視
光ダイオ−に素子、２：赤外線ダイオード素子、３：発
光グイオード、４：駆動回路、６．？、８゜９．１０：
抵抗、１１．１２：）ランジスタ、１３：金線。Fig. 1 is a side view of a light emitting diode according to an embodiment of the present invention, Fig. 2 is a plan view of its package seen through, Fig. 3 is a side view of the same, and Fig. 4 is a drive circuit of the same. It is an electrical circuit diagram. A near node, K: cathode, S: signal, 1: visible light diode element, 2: infrared diode element, 3: light emitting diode, 4: drive circuit, 6. ? , 8°9.10:
Resistor, 11.12:) Transistor, 13: Gold wire.
Claims (1)
第二発光素子とがパッケージに一体化封入されたことを
特徴とする発光半導体装置。A light emitting semiconductor device characterized in that one or more first light emitting elements and one or more second light emitting elements are integrally encapsulated in a package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178348A JPS6239081A (en) | 1985-08-13 | 1985-08-13 | Light-emitting semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178348A JPS6239081A (en) | 1985-08-13 | 1985-08-13 | Light-emitting semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6239081A true JPS6239081A (en) | 1987-02-20 |
Family
ID=16046920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60178348A Pending JPS6239081A (en) | 1985-08-13 | 1985-08-13 | Light-emitting semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239081A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6426484U (en) * | 1987-08-06 | 1989-02-15 | ||
| JPH0196964U (en) * | 1987-12-18 | 1989-06-28 | ||
| KR100344296B1 (en) * | 1999-08-03 | 2002-07-19 | 알에프코어 주식회사 | Method of Manufacturing High Power LED Package |
| US6778225B2 (en) * | 2000-03-03 | 2004-08-17 | Koninklijke Philips Electronics N.V. | Transferring data from one device to another |
| EP1843080A3 (en) * | 2006-04-03 | 2008-07-16 | Firma Ivoclar Vivadent AG | Semi-conductor radiation source |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669636A (en) * | 1979-10-02 | 1981-06-11 | Erunsuto Harahiyaa Fa | Method and device for coating printing screen |
| JPS6048044A (en) * | 1983-08-27 | 1985-03-15 | Tokai Shoji Kk | Method and device for coating screen printing plate with emulsion |
| JPS60188948A (en) * | 1984-03-08 | 1985-09-26 | Tokai Shoji Kk | Coating method of emulsion to screen printing edition and its coating device |
-
1985
- 1985-08-13 JP JP60178348A patent/JPS6239081A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669636A (en) * | 1979-10-02 | 1981-06-11 | Erunsuto Harahiyaa Fa | Method and device for coating printing screen |
| JPS6048044A (en) * | 1983-08-27 | 1985-03-15 | Tokai Shoji Kk | Method and device for coating screen printing plate with emulsion |
| JPS60188948A (en) * | 1984-03-08 | 1985-09-26 | Tokai Shoji Kk | Coating method of emulsion to screen printing edition and its coating device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6426484U (en) * | 1987-08-06 | 1989-02-15 | ||
| JPH0196964U (en) * | 1987-12-18 | 1989-06-28 | ||
| KR100344296B1 (en) * | 1999-08-03 | 2002-07-19 | 알에프코어 주식회사 | Method of Manufacturing High Power LED Package |
| US6778225B2 (en) * | 2000-03-03 | 2004-08-17 | Koninklijke Philips Electronics N.V. | Transferring data from one device to another |
| EP1843080A3 (en) * | 2006-04-03 | 2008-07-16 | Firma Ivoclar Vivadent AG | Semi-conductor radiation source |
| US7530707B2 (en) | 2006-04-03 | 2009-05-12 | Ivoclar Vivadent Ag | Semiconductor radiation source |
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