JPS6239039A - Chip carrier for electronic device - Google Patents

Abstract

PURPOSE:To suppress heating of an electronic part chip and to enable to make the high-density chip, by opening a through-hole through a printed circuit board at a position where there exists a metal plate, by filling a metal member with high heat-conductive resin in between in the through-hole, and by mounting the electronic part chip on the surface of the printed circuit board at a position where there exists the metal member. CONSTITUTION:A substrate 3 is comprised of insulator 1 and a metal plate 2 substituted for a portion of the insulator 1, and a conductor layer 4 is formed at least on one face of the substrate 3 to constitute a printed circuit board 5. At a position where there exists a metal plate 2, a through-hole is opened through the printed circuit board 5. In this through-hole, a metal member 17 is filled with high heat-conductive resin 16 in between, and at a position where there exists the metal member 17, an electronic part chip 6 is mounted on the surface of the printed circuit board 5. Thus better heat radiation can be attained so that the electronic part chip 6 does not have a high temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a chip carrier for electronic devices used as a mounting board for electronic devices such as IC puffboards.

[Prone Technique 1 For electronic devices such as 1C packages, the electronic component chip such as a semiconductor chip is attached to a lead frame. This is done by sealing or airtight sealing and puff canning. In response to an increase in the number of terminals in such electronic devices, attempts have been made to use printed wiring boards instead of lead frames as carriers for supporting electronic component chips.

Here, the recent increase in the density of electronic component chips is accompanied by heat generation, and it is necessary to devise ways to dissipate this heat. However, printed wiring boards used as carriers are made of resin laminates such as glass cloth epoxy 0 (fat laminates), and such printed wiring boards have poor thermal conductivity (and cannot achieve good heat dissipation). First, there are difficulties in using printed wiring boards as carriers for electronic component chips.

[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a chip carrier for electronic devices with excellent heat dissipation properties.

[Disclosure of the Invention 1] However, the chip carrier for electronic devices according to the present invention is made of a resin 81tN plate 1? A part of the NW6 laminate 1 is formed with the metal plate 2 and C/substrate 3 to be replaced with the base J.
A circuit board 4 is provided on the surface of the fi 3 to form a printed wiring board 5, a through hole 15 is provided in the printed wiring board 5 at the position of the metal @2, and a highly thermally conductive resin 16 is placed in the through hole 15. Load the metal member 17 through the metal member 1
It is characterized in that an electronic component chip 6 is mounted on the surface of a printed wiring board 5 at position 7, and a part of the substrate 3 of the printed wiring board 5 is replaced with a metal plate 2 having excellent thermal conductivity.
At the same time as forming the J! A metal member 17 is loaded into the through hole 15 via a highly thermally conductive resin 16, thereby allowing good heat dissipation to prevent the electronic component chip (3) from becoming hot.

The present invention will now be explained in detail with reference to Examples. The substrate 3 is mainly formed of a resin laminate 1, and the resin laminate 1 is made of glass cloth or other base material coated with epoxy 84, polyimide resin, 77 resin such as tear-on, etc. It is created by stacking a plurality of prepregs obtained by impregnating them with 04 oil varnish and drying them under heat and then molding them under heat and pressure. Then, a part of the central part of the laminate plate 1 shown in FIG. 2(a) is cut out, and 'r, ui,
: A bolt lower penetrating through the front and back sides is provided, and a metal plate 2 having the same thickness and approximately the same size as the 9M resin laminate 1 is fitted and fixed into the Sekiguchi 7, and the resin laminate 1
and the metal plate 2 to form a single board 3. This metal plate 2 only needs to have a sufficient area to mount an electronic component chip 6 such as a semiconductor 5-7, and has a size that does not affect the position of the through hole 9 provided in the resin laminate 1. Set. Further, as the metal plate 2, for example, a copper plate, a tempered alloy plate, copper-invar steel (C+r
i nv-Cu) alloy plate, chichi-nickel alloy plate, f
It is recommended to use a 1-plate, 1-plate, an aluminum plate, etc.

Then, as shown in FIG.
By layering a metal foil 10 such as a copper foil through the foil and heating and press-forming it, the impregnated resin of the prepreg 8 hardens as shown in FIG. At step 1-11, adhere the metal foil 10 to one surface of the substrate 3. Furthermore, a circuit pattern 4 is formed on the surface of the substrate 3 by etching the metal foil 10 by a common method such as printing wiring, and a through hole 9 is provided in the substrate 3 at the position of the fat laminate 1. A printed wiring board 5 as shown in FIG. 1 is created by providing through-hole plating 7112 on the through-hole plating layer 12 and connecting the circuit pattern t formed on the front and back surfaces of the substrate 3 with the through-hole plating layer 12.

Then, the printed wiring board 5 formed in this way is
)ill surface, and as shown in Figure 1'12 (e), drill a hole (1, 1:3) at a position corresponding to the metal plate 2 and make a through hole on the surface side of this through hole 15. When the metal member 17 made of aluminum alloy or the like is loaded by counterboring the recess 18 of the hole 15 and slightly wide,
1. Filling a 1 m distance between the metal member 17, the through hole 15, and the Nissin 13 with a highly thermally conductive resin 16. V+ for fixing the metal member 17 to the printed wiring board 5. Here, as the highly thermally conductive resin 16, 64 resin containing a large amount of conductive metal powder can be used. 20, and the upper end surface of the head 20 is at a distance =e from the surface of the printed wiring board 5.
The head 20 is disposed in a slightly recessed position and has four portions 21 on the surface thereof, and an electronic component chip 6 such as a semiconductor chip is mounted in the recess 21. And the first
As shown in the figure, the electronic component chip 6 is mounted on the printed wiring board 5 by applying wire bonding 14 or the like between the electronic component chip 6 and the circuit pattern 4. In this way, the printed wiring board 5 is used as a chip carrier to hold the electronic component chip 6, and the electronic component chip 6 is finished as an electronic device by being badged. It is possible to finish it as an LCC (leadless nap carrier) type electronic device, but when finishing it as a PGA type, terminal pins are inserted into each through hole 9, 9, etc. provided in the printed wiring board 5. Attach it so that it protrudes downward or upward.

Therefore, since the electronic component chip 6 is attached to the printed wiring board 5 to form an electronic element as described above, the electronic component chip 6 is attached to the recess 21 of the metal member 17.
The heat generated by the electronic component chip 6 is transmitted from the metal member 17 to the metal plate 2 via the highly thermally conductive resin 1G with excellent thermal conductivity, and the heat is well radiated from the metal plate 2. It is something that will be done. Moreover, since the highly thermally conductive resin 1G is interposed between the metal member 17 and the metal plate 2, the difference in thermal expansion coefficient between the metal member 17 and the metal plate 2, which are made of iron-nickel alloy, etc. High thermal conductivity reduces the force of mismatch! ! Moisture can be absorbed by the fat 16, and since the resin 16 fills the space between the metal plate 2 and the metal member 17 without any gap, moisture absorption from the substrate 3 side can be prevented.

In the embodiment shown in FIG. 3, the insertion portion 19 of the metal member 17 in the printed wiring board 5 is formed by increasing the thickness of the board 3 so as to protrude from the surface side of the printed wiring board 5, and the tip of this protruding insertion portion 19 is A heat dissipation section 22 formed by a heat vibrator, a heat dissipation fin, etc. is attached to the i section.In this embodiment, the heat generated by the electronic component chip 6 is radiated using gold 14.
Heat is transferred directly from the member 17 to the heat dissipation section 22, and the heat of the electronic component chip 6 can be radiated to the outside of the substrate 3, resulting in extremely excellent heat dissipation.

[Effects of the Invention] As described above, in the present invention, a through hole is provided in the printed wiring board at the position of the metal plate, a metal member is loaded into the through hole via a highly thermally conductive resin, and the metal member is Since the electronic component chip was mounted on the surface of the printed circuit #i@ at the position shown in FIG. The high-quality metal plate dissipates heat well, and the heat of electronic components can be dissipated well.As a result, the heat generation of electronic component chips can be suppressed, making it possible to increase the density of electronic component chips. This makes it possible to improve thermal reliability.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIGS. 2(a) to (e) are cross-sectional views of each manufacturing process of the same, and FIG. 3 is a cross-sectional view of another embodiment of the present invention. 71 is a resin laminate, 2 is a metal plate, 3 is a substrate, 4 is a circuit pattern, 5 is a printed wiring board, 6 is an electronic component chip, 15 is a through hole, 16 is a high thermal conductive resin, and 17 is a metal member. be.

Claims (1)

[Claims] (1) Form a board with a resin laminate and a metal plate that replaces a part of the resin laminate, form a printed wiring board by providing a circuit pattern on the surface of the board, and attach the printed wiring board at the position of the metal plate. For electronic devices, characterized in that a through hole is provided, a metal member is loaded into the through hole via a highly thermally conductive resin, and an electronic component chip is mounted on the surface of a printed wiring board at the position of the metal member. chip carrier.