JPS6238306A - Monitoring method for wave-height of jet solder - Google Patents

Monitoring method for wave-height of jet solder

Info

Publication number
JPS6238306A
JPS6238306A JP17820485A JP17820485A JPS6238306A JP S6238306 A JPS6238306 A JP S6238306A JP 17820485 A JP17820485 A JP 17820485A JP 17820485 A JP17820485 A JP 17820485A JP S6238306 A JPS6238306 A JP S6238306A
Authority
JP
Japan
Prior art keywords
image
wave
solder
jet
wavefront
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17820485A
Other languages
Japanese (ja)
Inventor
Michiharu Honda
本田 美智晴
Teruo Oi
大井 輝男
Teruo Okano
輝男 岡野
Yoshihiro Miyano
宮野 由廣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Kaken Corp
Hitachi Ltd
Tamura Corp
Original Assignee
Tamura Kaken Corp
Hitachi Ltd
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp, Hitachi Ltd, Tamura Corp filed Critical Tamura Kaken Corp
Priority to JP17820485A priority Critical patent/JPS6238306A/en
Publication of JPS6238306A publication Critical patent/JPS6238306A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make the monitoring of the wave-height of a jet solder unmanned by outputting the alarm of the wave-height abnormality according to the contact on the monitor television of the image of the jet solder wave surface obtd. from TV camera and the check point set to the allowable lower and upper limits of the variation thereof. CONSTITUTION:The waveface 15 of the jet solder from a nozzle 13 is caught by a TV camera 31, the image 15a of the wave surface thereof is processed by an image processor 32 and displayed by a monitor TV 33. The image 15a thereof is displayed in white and the background in black. Now the check point 43, 44 to express the allowable lower limit and allowable upper limit of the variation in the wave surface 15 is set by operating the unit 32 with watching the TV 33. The point 43, 44 thereof has a switching function, outputs a motion signal to an alarm 34 when the image 15a varies in the vertical direction and approaches the point 43, 44 and informs a controller of the wave surface 15 reaching to the allowable limit. The monitoring of high accuracy by the TV camera can thus be performed and the reliability in soldering can be increased.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、自動はんだ付けに係る噴流はんだの波高監視
方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for monitoring the wave height of jet solder related to automatic soldering.

〔従来の技術〕[Conventional technology]

従来、ノズルから噴流する溶融はんだを被はんだ付は物
に接触させて自動はんだ付けを行なう噴流式はんだ槽に
おいて、このはんだ槽の使用中は、ときどき目視により
、プリント配線基板に対する噴流はんだの接触状態また
は結果としてのはんだ付は状態を監視し、このような状
態から逆に噴流波面の波高が適正かどうかを監視してい
る。
Conventionally, in jet soldering baths, automatic soldering is carried out by bringing the molten solder jetted from a nozzle into contact with the object to be soldered, and while the soldering bath is in use, the state of contact of the jetted solder with the printed wiring board is checked from time to time by visual inspection. Alternatively, the state of soldering as a result is monitored, and from this state, it is conversely monitored to see whether the wave height of the jet wave front is appropriate.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、このような目視による波高の監視は、まず監視
員を必要とし、この監視員が定期的に監視する必要があ
り、次にこの監視員の勘によって前記噴流はんだの接触
状態、はんだ付は状態を同所しているため客観性に欠け
、常に適正なはんだ付けを行なう上で信頼性に欠けるお
それがあった。
However, such visual monitoring of the wave height first requires an observer, who must periodically monitor the wave height, and then determines the contact state of the solder jet and the soldering according to the intuition of this observer. Since the conditions are in the same place, there is a lack of objectivity, and there is a risk of a lack of reliability in consistently performing proper soldering.

本発明の目的は、噴流はんだの波高を無人で常に監視で
きる噴流はんだの波高監視方法を提供し、はんだ付けの
信頼性を高めることにある。
An object of the present invention is to provide a method for monitoring the wave height of a solder jet, which can constantly monitor the wave height of a solder jet unattended, and to improve the reliability of soldering.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の噴流はんだの波高監視方法は、ノズル13から
噴流する溶融はんだの波面15に向けてテレビカメラ3
1をセットし、このテレビカメラ31から得た波面の映
像15aと、この波面の変動の許容下限および許容上限
に設定したチェックポイント43゜44とを、画像処理
装置32を介してモニターテレビ33に表示し、このモ
ニターテレビ33において前記波面の映像15aが前記
チェックポイン1−43.44に接触した時点で、前記
画像処理袋r1132から噴流はんだの波高異常警報を
出力するものである。
The method of monitoring the wave height of molten solder according to the present invention involves directing a television camera 3 toward a wave surface 15 of molten solder jetting from a nozzle 13.
1, and the wavefront image 15a obtained from the television camera 31 and the checkpoints 43 and 44 set as the permissible lower limit and upper limit of this wavefront fluctuation are sent to the monitor television 33 via the image processing device 32. When the image 15a of the wavefront comes into contact with the checkpoint 1-43.44 on the monitor television 33, the image processing bag r1132 outputs an abnormal wave height alarm of the solder jet.

〔作用〕[Effect]

本発明は、前記噴流はんだの波面15を前記テレビカメ
ラ31でとらえ、この波面の映像15aを前記モニター
テレビ33に映し出し、そのテレビ33の波面映像15
aを見ながら、前記画像処理装置32を操作して、前記
下限および上限のチェックポイント43、44を設定す
る。
In the present invention, the wavefront 15 of the solder jet is captured by the television camera 31, and an image 15a of this wavefront is projected on the monitor television 33.
The lower and upper limit checkpoints 43 and 44 are set by operating the image processing device 32 while looking at the image a.

そして、前記モニターテレビ33の画面において、前記
波面15の映@1Saが上下方向に変動して前記チェッ
クポイント43.44にかかった時点で、前記画像処理
装置32よりブザー等を通じて波^異常警報を出し、人
に異常を知らせる。
Then, when the image @1Sa of the wavefront 15 fluctuates in the vertical direction on the screen of the monitor television 33 and reaches the checkpoint 43, 44, the image processing device 32 issues a wave abnormality alarm via a buzzer or the like. and notify people of the abnormality.

(実施例) 以下、本発明を図面に示す一実施例を参照して詳細に説
明する。
(Example) Hereinafter, the present invention will be described in detail with reference to an example shown in the drawings.

第1図に示すように、11はla流式iんだ槽であり、
このはんだI/f111は、槽本体12の内部にノズル
13を設け、また槽本体内ヒータにより一定IIIに制
御された溶融はんだ14を収容してなる。
As shown in FIG.
This solder I/f 111 has a nozzle 13 provided inside a tank body 12, and houses molten solder 14 controlled at a constant level III by a heater inside the tank body.

そして、前記槽本体12内に設けた図示しないポンプに
より前記溶融はんだ14を前記ノズル13の下部の開口
に圧送すると、このノズル13の上部の開口から溶融は
んだが噴流するので、この噴流はんだの波面15にプリ
ント配I!基板の下面が接触するようにその基板を搬送
すれば、このプリント配線基板に噴流はんだの一部をは
んだ付けできる。
Then, when the molten solder 14 is pumped to the lower opening of the nozzle 13 by a pump (not shown) provided in the tank body 12, the molten solder is jetted from the upper opening of the nozzle 13, so that the wave surface of this jetted solder Print distribution I on 15! By transporting the board so that the bottom surfaces of the board are in contact with each other, a portion of the jet solder can be soldered to the printed wiring board.

このような噴流式はんだ梢1l−17)上側にライト2
1を設け、このライト21から前記wA流はんだ波面1
5に光を照射する。
This type of jet soldering tree 1l-17) has a light 2 on the upper side.
1, and from this light 21 the wA flow soldering wavefront 1
Irradiate light to 5.

また、前記噴流はんだ波面15に向けてテレビカメラ3
1を水平にセットする。このテレビカメラ31としては
、電荷結合素子(チャージ・カップルド・デバイス、一
般的にCODと呼ばれる)等を利用したCODカメラが
適する。
Also, a television camera 3 is directed toward the jet solder wavefront 15.
Set 1 horizontally. As the television camera 31, a COD camera using a charge coupled device (generally called COD) or the like is suitable.

このテレビカメラ31は画像処理袋fit(商品名ビデ
オチェッカにおけるコントローラ)32に接続され、こ
の画像処理装置ff32で処理された映像は、モニター
テレビ(CRT>33に表示される。前記画像処理’l
置32およびモニターテレビ33は、集中管理室等に置
かれている。
This television camera 31 is connected to an image processing bag fit (controller in the product name video checker) 32, and the video processed by this image processing device ff32 is displayed on a monitor television (CRT>33.
The station 32 and the monitor television 33 are placed in a central control room or the like.

前記画像処理装置i32は、ブザー等の警報器34を一
体または別体に設けてなり、この警報器34に前記画像
処理装置32より判定出力信号が出力される。
The image processing device i32 is integrally or separately provided with an alarm device 34 such as a buzzer, and a determination output signal is outputted from the image processing device 32 to the alarm device 34.

前記画像処理装設32は、第2図に示すように、前記テ
レビカメラ31から得た前記波面15の映像15aを、
ライト(明)エリア41として、前記モニターテレビ3
3に白で表示する。前記噴流はIυだ波面15は、光を
当てると明るくなるからである。一方、前記波面15の
背景を黒にしておくことにより、テレビ画面では、前記
映像15aの上側がダーク(暗)エリア42となり、黒
で表示される。
As shown in FIG. 2, the image processing equipment 32 processes an image 15a of the wavefront 15 obtained from the television camera 31.
The monitor television 3 serves as a light (bright) area 41.
3 is displayed in white. This is because the wavefront 15 of the jet stream becomes brighter when exposed to light. On the other hand, by making the background of the wavefront 15 black, the upper side of the image 15a becomes a dark area 42 and is displayed in black on the television screen.

次に、前記噴流はんだ波面15の映像15aとともに、
前記波面15の変動の許容下限および許容上限を表すチ
ェックポイント43.44を、前記モニターテレビ33
に映し出し、そして、このテレビ33の画面を見ながら
、前記画像処理袋M32を操作して、前記波面映像15
aとの関係で、前記チェックポイント43.44を希望
する位置に設定する。前記チェックポイント43.44
は、ライトエリア41とダーク     “エリア42
とにそれぞれ3個づつ設定したが、各エリアにざらに多
くを設定してもよい。前記ビデオチェッカ(商品名)で
は、最高20ポイントまで監視可能である。
Next, together with the image 15a of the jet solder wavefront 15,
The checkpoints 43 and 44 representing the permissible lower limit and upper limit of the variation of the wavefront 15 are checked on the monitor television 33.
Then, while viewing the screen of this television 33, operate the image processing bag M32 to display the wavefront image 15.
Set the checkpoints 43 and 44 at desired positions in relation to a. Checkpoint 43.44
are light area 41 and dark “area 42”.
Although three areas are set in each area, more may be set in each area. The video checker (product name) can monitor up to 20 points.

前記ライトエリア41に設定したチェックポイント43
は、ダーク([)オンのスイッチ機能を有し、ダークエ
リア42がこのチェックポイント43に達すると、オン
となって、前記噴流はんだ波面15が許容下限に達した
ことを知らせる。また、前記ダークエリア42に設定し
たチェックポイント44は、ライト(明)オンのスイッ
チill flを有し、ライトエリア41がこのチェッ
クポイント44に達すると、オンとなって、前記噴流は
んだ波面15が許容上限に達したことを知らせる。
Checkpoint 43 set in the light area 41
has a dark ([) on switch function, and when the dark area 42 reaches this checkpoint 43, it is turned on to notify that the solder jet wave front 15 has reached the lower limit of tolerance. The checkpoint 44 set in the dark area 42 has a light (bright) on switch ill fl, and when the light area 41 reaches this checkpoint 44, it is turned on and the jet solder wavefront 15 is turned on. Informs you that the allowable limit has been reached.

そうして、前記噴流はんだ波面15が稼働中に徐々に下
降して、そのモニター映像15aが前記ライトエリア4
1に設定したチェックポイント43にかかると、ダーク
オンとなり、前記警報器34に作動信号を出力し、管理
者に航記噴流はんだ波面15が許容限界に達したことを
知らせる。同様に、前記噴流はんだ波面15が稼働中に
徐々に上昇して、そのモニター映像15aが前記ダーク
エリア42に設定したチェックポイント44にかかると
、ライトオンとなり、前記警報器34に作動信号を出力
し、管理者に前記噴流はんだ波面15が許容限界に達し
たことを知らせる。
Then, the jet solder wavefront 15 gradually descends during operation, and the monitor image 15a becomes the light area 4.
When the checkpoint 43 set to 1 is reached, a dark-on occurs, an activation signal is output to the alarm 34, and the administrator is informed that the solder wavefront 15 of the solder jet has reached the permissible limit. Similarly, when the jet solder wavefront 15 gradually rises during operation and the monitor image 15a reaches the checkpoint 44 set in the dark area 42, the light is turned on and an activation signal is output to the alarm 34. Then, the administrator is informed that the jet solder wavefront 15 has reached the permissible limit.

管理者は、前記噴流はんだ波面15が上限に達している
場合は、無段変速機を調整するなどして、前記槽本体1
2内に設けた噴流用ポンプの回転速度を低速側に調整し
、前記波面15を下降復帰させる。
When the jet solder wave front 15 has reached the upper limit, the administrator adjusts the continuously variable transmission to reduce the temperature of the tank body 1.
The rotational speed of the jet pump provided in the jet pump 2 is adjusted to the low speed side, and the wave surface 15 is returned to a downward direction.

また前記噴流はんだ波面15が下限に達している場合は
、無段変速機を調整するなどして、前記ポンプの回転速
度を高速側に調整し、前記波面15を上昇復帰させる。
If the jet solder wave front 15 has reached the lower limit, the rotational speed of the pump is adjusted to a high speed side by adjusting the continuously variable transmission, etc., and the wave front 15 is raised again.

なお、前記ポンプの回転速度を自動制御することにより
、前記噴流はIυだ波面15の波高制御を自動的に行う
ようにしてもよい。
In addition, by automatically controlling the rotational speed of the pump, the wave height of the wave surface 15 of the jet flow may be automatically controlled.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、テレビカメラでとらえた噴流はんだ波
面の映像と、この波面の変動の許容下限および許容上限
に設定したチェックポイントとを、画像処理装置で比較
処理し、前記波面の映像が前記チェックポイントに接触
した時点で前記画像処理装置から波高異常善報を出力す
るにうにしたから、噴流はんだの波高監視を無人化でき
、かつ前記テレビカメラにより高精度の監視が可能であ
り、はんだ付けの信頼性を高めることができる。さらに
、モニターテレビを見ながら前記波面の映像との関係で
前記チェックポイントを設定するようにしたから、この
チェックポイントの設定を容易にできる利点がある。
According to the present invention, an image processing device compares and processes an image of a jet solder wavefront captured by a television camera with checkpoints set as a permissible lower limit and an allowable upper limit of fluctuations in this wavefront, and the image of the wavefront is Since the image processing device outputs a wave height abnormality report when a checkpoint is contacted, the wave height monitoring of jet soldering can be automated, and highly accurate monitoring is possible using the television camera. reliability can be increased. Furthermore, since the checkpoints are set in relation to the image of the wavefront while watching a monitor television, there is an advantage that the checkpoints can be easily set.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の噴流はんだの波高監視方法の一実施例
を示す訳明図、第2図はそのモニターテレビの画面を示
す正面図である。 13・・ノズル、15・・噴流はんだの波面、15a・
・波面の映像、31・・テレビカメラ、32・・画像処
理装置、33・・モニターテレビ、43.44・・チェ
ックポイント。
FIG. 1 is a diagram showing an embodiment of the method for monitoring the wave height of a solder jet according to the present invention, and FIG. 2 is a front view showing the screen of a monitor television. 13... Nozzle, 15... Wave front of jet solder, 15a...
・Wavefront image, 31...TV camera, 32...Image processing device, 33...Monitor TV, 43.44...Checkpoint.

Claims (1)

【特許請求の範囲】[Claims] (1)ノズルから噴流する溶融はんだの波面に向けてテ
レビカメラをセットし、このテレビカメラから得た波面
の映像と、この波面の変動の許容下限および許容上限に
設定したチェックポイントとを、画像処理装置を介して
モニターテレビに表示し、このモニターテレビにおいて
前記波面の映像が前記チェックポイントに接触した時点
で、前記画像処理装置から前記噴流はんだの波高異常警
報を出力することを特徴とする噴流はんだの波高監視方
法。
(1) A television camera is set to face the wavefront of the molten solder jetting from the nozzle, and the image of the wavefront obtained from this television camera and the checkpoints set as the allowable lower limit and upper limit of fluctuations in this wavefront are imaged. The jet is displayed on a monitor television via a processing device, and when the image of the wave front comes into contact with the checkpoint on the monitor television, the image processing device outputs an abnormal wave height alarm of the jet solder. Method for monitoring solder wave height.
JP17820485A 1985-08-13 1985-08-13 Monitoring method for wave-height of jet solder Pending JPS6238306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17820485A JPS6238306A (en) 1985-08-13 1985-08-13 Monitoring method for wave-height of jet solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17820485A JPS6238306A (en) 1985-08-13 1985-08-13 Monitoring method for wave-height of jet solder

Publications (1)

Publication Number Publication Date
JPS6238306A true JPS6238306A (en) 1987-02-19

Family

ID=16044393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17820485A Pending JPS6238306A (en) 1985-08-13 1985-08-13 Monitoring method for wave-height of jet solder

Country Status (1)

Country Link
JP (1) JPS6238306A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191040A (en) * 1984-10-08 1986-05-09 Nippon Furitsuto Kk Opaque enamel frit
WO1994024518A1 (en) * 1993-04-21 1994-10-27 Omron Corporation Visual inspection support apparatus, substrate inspection apparatus, and soldering inspection and correction methods using the same apparatuses
JP2020019040A (en) * 2018-07-31 2020-02-06 オムロン株式会社 Information processor, management system, control program, and method for controlling information processor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210757A (en) * 1975-07-15 1977-01-27 Tamura Seisakusho Co Ltd Measuring method of a jet solder wave
JPS5310757A (en) * 1976-07-14 1978-01-31 Tsudakoma Ind Co Ltd Method and device for controlling jet in fluiddjet shuttleless loom
JPS54124751A (en) * 1978-03-20 1979-09-27 Toshiba Corp Display meter
JPS5829014A (en) * 1981-08-17 1983-02-21 Toshiba Corp Alarm displaying device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210757A (en) * 1975-07-15 1977-01-27 Tamura Seisakusho Co Ltd Measuring method of a jet solder wave
JPS5310757A (en) * 1976-07-14 1978-01-31 Tsudakoma Ind Co Ltd Method and device for controlling jet in fluiddjet shuttleless loom
JPS54124751A (en) * 1978-03-20 1979-09-27 Toshiba Corp Display meter
JPS5829014A (en) * 1981-08-17 1983-02-21 Toshiba Corp Alarm displaying device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6191040A (en) * 1984-10-08 1986-05-09 Nippon Furitsuto Kk Opaque enamel frit
WO1994024518A1 (en) * 1993-04-21 1994-10-27 Omron Corporation Visual inspection support apparatus, substrate inspection apparatus, and soldering inspection and correction methods using the same apparatuses
US6362877B1 (en) 1993-04-21 2002-03-26 Omron Corporation Visual inspection supporting apparatus and printed circuit board inspecting apparatus, and methods of soldering inspection and correction using the apparatuses
JP2020019040A (en) * 2018-07-31 2020-02-06 オムロン株式会社 Information processor, management system, control program, and method for controlling information processor

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