JPS6236744B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved liquid ejection head.

Conventionally, a liquid ejecting head, for example, an inkjet head in which a nozzle plate having a plurality of nozzles is fixed to a head body, is constructed as shown in FIG. In Fig. 1, 1 is the head body, 2 is a nozzle plate, 3 is a plurality of nozzles provided on the nozzle plate 2, 4 is a liquid chamber, 5 is an electrostrictive vibrator, 6 is an ink introduction tube, and 7 is an adhesive. It is.

In the conventional example configured in this way, pressurized ink is supplied to the liquid chamber 4 through the ink introduction pipe 6, and the supplied ink is vibrated by the electrostrictive vibrator 5, and the nozzle plate is The ink is ejected as minute ink droplets from a plurality of nozzles 3 provided in the ink droplet.

However, the nozzle plate 2 is attached to the head body 1 only at the outer periphery of the nozzle plate 2, which is fixed to the head body 1 with, for example, an epoxy adhesive 7, and moreover, a plurality of nozzles 3 are provided. Since the multi-nozzle plate 2 has a relatively large area, it may be pushed outward by the pressurized ink, causing the central part of the nozzle plate 2 to swell, especially in the case of high pressure (approximately 10 kg/cm ² ). There was a drawback that liquid seeped into the joint surface between the nozzle plate 2 and the head body 1, reducing the joint strength.

In order to eliminate the drawbacks of the conventional example, the present invention provides a through hole around the nozzle of the nozzle plate, and when attaching the nozzle plate to the head body, adhesive is poured into the through hole to attach the nozzle plate to the head body. The present invention provides a liquid ejecting head which is fixed to a liquid ejecting head and has improved mechanical pressure resistance. Hereinafter, embodiments will be described in detail with reference to the drawings.

FIG. 2 shows one embodiment of the present invention.
FIG. 2a shows a nozzle plate manufactured by drilling desired holes in a silicon single crystal wafer by anisotropic etching, and FIG. 2b shows a structure in which this nozzle plate is fixed to the head body. In FIG. 2, 8 is a nozzle plate, 9 is a nozzle, 10a and 10b are positioning pin holes, 11 is a through hole provided around the nozzle 9 through which adhesive is poured, 12 is a head body, and 13
14 is a liquid chamber, 14 is an ink introduction tube, 15a and 15b are reference pins, 16 is an ink passage from the liquid chamber 13 to the nozzle 9, and 17a and 17b are adhesives. In addition,
The shape of the through hole 11 into which the adhesive is poured may be arbitrary.

When joining the nozzle plate 8 to the head body 12,
First, the positioning pin holes 10a, 1 of the nozzle plate 8
Insert the reference pins 15a and 15b, which are set at predetermined positions on the head body 12, into 0b, apply the adhesive 1a to the outer periphery of the nozzle plate 8 while pressing the nozzle plate 8 against the head body 12, and dry it. let With this, the nozzle plate 8 and the head body 12 can be fixed to some extent. Next, the adhesive 17b is poured into the through hole 11 provided around the nozzle 9, and is dried and fixed.

In this embodiment configured as described above, the nozzle plate 8 and the head body 12 are closely fixed around the nozzle 9, so that no swelling of the nozzle plate 8 occurs, and the mechanical pressure resistance is significantly improved. can be improved.

FIG. 3 shows another embodiment of the present invention, in which a recess 18 is provided in the head body 12 at the location where the through hole is located, thereby increasing the bonding area and further improving the bonding strength. . Also, Figure 4 shows
This shows still another embodiment of the present invention, in which the inclination of the through hole 19 formed in the nozzle plate 8 is opposite to the inclination of the nozzle 9, and the effect is similar to that of fixing with a countersunk screw. FIG. 5 shows still another embodiment of the present invention, in which the nozzle plate 8 of FIG. 3 is turned over and fixed to the head body 12. In this way, by making the inclinations of the nozzle and the through-hole in the same direction, there is an effect that the hole can be formed by one etching.

As explained above, according to the present invention, a through hole is provided around the nozzle of the nozzle plate, and an adhesive is poured into the hole to fix the nozzle plate and the head body, thereby improving the mechanical pressure resistance of the nozzle plate. This has the advantage of improving the reliability of the liquid ejecting head.

[Brief explanation of the drawing]

FIG. 1 is a block diagram of a conventional example, FIG. 2 is a block diagram of one embodiment of the present invention, FIG. 3 is a partially enlarged sectional view of another embodiment of the present invention, and FIGS. The figure is a partially enlarged sectional view of still another embodiment of the present invention. 8... Nozzle plate, 9... Nozzle, 11, 19... Through hole, 12... Head main body, 13... Liquid chamber, 17a, 1
7b...Adhesive.

Claims (1)

[Claims] 1. A liquid injection nozzle and a nozzle plate provided with a through hole around the nozzle are attached to a head body provided with a liquid chamber, and the nozzle plate is connected to the outer peripheral part of the nozzle plate and the through hole so that the liquid chamber and the nozzle communicate with each other. A liquid injection head characterized by being fixed with adhesive poured into the head.