JPS6236309Y2 - - Google Patents

Info

Publication number
JPS6236309Y2
JPS6236309Y2 JP1981162380U JP16238081U JPS6236309Y2 JP S6236309 Y2 JPS6236309 Y2 JP S6236309Y2 JP 1981162380 U JP1981162380 U JP 1981162380U JP 16238081 U JP16238081 U JP 16238081U JP S6236309 Y2 JPS6236309 Y2 JP S6236309Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
optical fiber
light
mounting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981162380U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5868048U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16238081U priority Critical patent/JPS5868048U/ja
Publication of JPS5868048U publication Critical patent/JPS5868048U/ja
Application granted granted Critical
Publication of JPS6236309Y2 publication Critical patent/JPS6236309Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP16238081U 1981-10-30 1981-10-30 発光ダイオ−ドの取付構造 Granted JPS5868048U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16238081U JPS5868048U (ja) 1981-10-30 1981-10-30 発光ダイオ−ドの取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16238081U JPS5868048U (ja) 1981-10-30 1981-10-30 発光ダイオ−ドの取付構造

Publications (2)

Publication Number Publication Date
JPS5868048U JPS5868048U (ja) 1983-05-09
JPS6236309Y2 true JPS6236309Y2 (cs) 1987-09-16

Family

ID=29954695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16238081U Granted JPS5868048U (ja) 1981-10-30 1981-10-30 発光ダイオ−ドの取付構造

Country Status (1)

Country Link
JP (1) JPS5868048U (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726854Y2 (ja) * 1989-11-15 1995-06-14 松下電工株式会社 Ｌｅｄ素子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147887A (cs) * 1974-05-17 1975-11-27
JPS55121212U (cs) * 1979-02-21 1980-08-28

Also Published As

Publication number Publication date
JPS5868048U (ja) 1983-05-09

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