JPS6234448Y2 - - Google Patents
Info
- Publication number
- JPS6234448Y2 JPS6234448Y2 JP1982072499U JP7249982U JPS6234448Y2 JP S6234448 Y2 JPS6234448 Y2 JP S6234448Y2 JP 1982072499 U JP1982072499 U JP 1982072499U JP 7249982 U JP7249982 U JP 7249982U JP S6234448 Y2 JPS6234448 Y2 JP S6234448Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- locking portion
- component
- legs
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 1
- 238000007664 blowing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982072499U JPS58175645U (ja) | 1982-05-18 | 1982-05-18 | ヒ−トシンク装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982072499U JPS58175645U (ja) | 1982-05-18 | 1982-05-18 | ヒ−トシンク装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58175645U JPS58175645U (ja) | 1983-11-24 |
JPS6234448Y2 true JPS6234448Y2 (US08066781-20111129-C00013.png) | 1987-09-02 |
Family
ID=30082061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982072499U Granted JPS58175645U (ja) | 1982-05-18 | 1982-05-18 | ヒ−トシンク装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58175645U (US08066781-20111129-C00013.png) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS538806B2 (US08066781-20111129-C00013.png) * | 1974-08-28 | 1978-04-01 | ||
JPS5416371B2 (US08066781-20111129-C00013.png) * | 1974-09-28 | 1979-06-21 | ||
JPS5714450B2 (US08066781-20111129-C00013.png) * | 1974-03-13 | 1982-03-24 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5631917Y2 (US08066781-20111129-C00013.png) * | 1976-07-06 | 1981-07-29 | ||
JPS5394566U (US08066781-20111129-C00013.png) * | 1976-12-29 | 1978-08-01 | ||
JPS5416371U (US08066781-20111129-C00013.png) * | 1977-07-06 | 1979-02-02 | ||
JPS5491070U (US08066781-20111129-C00013.png) * | 1977-12-09 | 1979-06-27 | ||
JPS5833754Y2 (ja) * | 1978-02-15 | 1983-07-28 | 株式会社富士通ゼネラル | 放熱板の取付構造 |
JPS55139549U (US08066781-20111129-C00013.png) * | 1979-03-24 | 1980-10-04 | ||
JPS5714450U (US08066781-20111129-C00013.png) * | 1980-06-30 | 1982-01-25 |
-
1982
- 1982-05-18 JP JP1982072499U patent/JPS58175645U/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5714450B2 (US08066781-20111129-C00013.png) * | 1974-03-13 | 1982-03-24 | ||
JPS538806B2 (US08066781-20111129-C00013.png) * | 1974-08-28 | 1978-04-01 | ||
JPS5416371B2 (US08066781-20111129-C00013.png) * | 1974-09-28 | 1979-06-21 |
Also Published As
Publication number | Publication date |
---|---|
JPS58175645U (ja) | 1983-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100310391B1 (ko) | 전자기기 | |
JP4804472B2 (ja) | 組合せigbt実装方法 | |
US5179506A (en) | Securing component arrangement | |
JPS6234448Y2 (US08066781-20111129-C00013.png) | ||
EP0888039B1 (en) | Heat sink attachment | |
JPS6023996Y2 (ja) | 発熱部品取付装置 | |
JPH0537507Y2 (US08066781-20111129-C00013.png) | ||
JPH0617309Y2 (ja) | 半導体の放熱装置 | |
JPS6125254Y2 (US08066781-20111129-C00013.png) | ||
JPS5833754Y2 (ja) | 放熱板の取付構造 | |
JPH0617355Y2 (ja) | プリント配線板における放熱板取付構造 | |
JP2578547Y2 (ja) | 取付金具 | |
JPH0559894U (ja) | 発熱電子部品の放熱構造 | |
JP2574766Y2 (ja) | 回路基板収納装置 | |
JPS5818291Y2 (ja) | ヒ−トシンク等の取付脚 | |
JPS61141200A (ja) | 発熱部品の取付方法 | |
JPS5832313Y2 (ja) | 放熱板取付構造 | |
JPH0356078Y2 (US08066781-20111129-C00013.png) | ||
JPH0617310Y2 (ja) | 放熱板の固定構造 | |
KR200145464Y1 (ko) | 모니터의 회로기판 고정구조 | |
JPS6144478Y2 (US08066781-20111129-C00013.png) | ||
JPH0316314Y2 (US08066781-20111129-C00013.png) | ||
JPS58222549A (ja) | ヒ−トシンク装置 | |
JPH0322920Y2 (US08066781-20111129-C00013.png) | ||
JPS6023984Y2 (ja) | Ic取付装置 |