JPS6232681A - Electronic material ceramic and electronic circuit substrate using the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an electronic material ceramic that can be used as a ceramic capacitor or a ceramic substrate incorporating such a capacitor, and an electronic device constructed using the same. Regarding circuit substrates.

[Conventional technology]

Conventionally, electronic circuit boards have been configured with only a conductor circuit, a conductor circuit and a resistor, or a conductor circuit and a resistor and a limited range of capacitors, and other functional parts have been separated as elements and attached to the base. It was broken.

That is, for example, in a conventional ceramic board, the board mainly has a built-in conductor and a resistor, and a capacitor is attached as a chip component by soldering. For this reason, there was a limit to the miniaturization of electronic circuits. An example is shown in FIG. 51 is a ceramic substrate, 52 is a conductor circuit, 53 is a resistor, 5
4 is a chip capacitor.

In recent years, attempts have been made to incorporate a plurality of capacitors within the same ceramic substrate by changing the dielectric constant within the same substrate. In other words, as shown in FIG. 9, this is an attempt to form a plurality of capacitors on the same substrate by separating a portion 61 with a high dielectric constant ε1 and a portion 62 with a low dielectric constant ε2. However, conventionally, it has been extremely difficult to form different dielectric parts on the same substrate, and as is obvious when considering the complexity of manufacturing multilayer ceramic capacitors, for example, it is difficult to form substrates with multiple capacitors built-in. Currently, this has not yet been realized or put into practical use.

[Problems to be solved by the invention]

The present invention has been made to solve the conventional problems and provide an electronic material ceramic that can define a plurality of high dielectric constant parts.

The present invention has also been made to provide an electronic circuit substrate that can house a plurality of capacitors by using such an electronic material ceramic.

A further object of the present invention is to provide a compact and inexpensive electronic circuit substrate that is equipped with many functional parts including a dielectric material.

[Means for solving problems]

That is, the electronic material ceramic provided by the present invention has portions with different dielectric constants formed by filling a void provided in a molded body containing a dielectric material or its precursor with substances having different dielectric constants. The electronic circuit substrate provided by the present invention is characterized by:
It is characterized in that it is made of the electronic material ceramic described above.

[Detailed description and examples of the invention]

In the present invention, the molded body refers to, for example, a green compact (a powder-like solid material such as a metal oxide as a raw material), a fired body or a sintered body (porcelain, etc.), and the electronic material of the present invention Dielectrics that make up ceramics or precursors for forming dielectrics (for example, the powder-like solids mentioned above, semiconductor porcelain obtained by primary firing when synthesizing high dielectric materials, or solids made of semiconductor particles) etc.).

The electronic material ceramic of the present invention is characterized by filling the voids provided in the molded body with substances having different dielectric constants, and forming portions having different dielectric constants through a process such as firing as necessary. be. Therefore, by providing a single or multiple cavities in the molded body and filling them with, for example, a substance with a low dielectric constant, the portion to be made high in dielectric constant can be separated into two or more parts around the cavities and mutually separated. Two or more spaced apart high dielectric portions can be defined.

As an example, a ceramic substrate composed of a grain-boundary insulated high dielectric material is usually made of, for example, B aT i 03 and Dy203.
, Si02, etc. are added and mixed, and the green compact is then fired to become a semiconductor, and then a metal or metal oxide (e.g. Cu, CuO, MnO2,
T1203, etc.) and secondary firing to form a grain boundary insulating layer. When carrying out the present invention in this example, first, the desired compacted body, the fired body after secondary firing, the fired body whose surface is coated with a metal or metal oxide, or the fired body after secondary firing. A cavity of a desired shape (for example, a recess bored in the surface layer) is provided in the area. The number of voids is appropriately determined depending on the number of dielectrics to be defined. Examples of the method for providing the void space include press molding of a compact, laser processing, mechanical processing (eg, diamond cutting), ultrasonic processing, and the like.

Next, the void space provided in this way is filled with, for example, a low dielectric constant material, and a plurality of high dielectric constant parts are formed through the subsequent process for obtaining a ceramic substrate or tertiary firing, which is performed as necessary. Obtain a defined porcelain substrate. The dielectric constants of the defined high dielectric portions may be the same or different.

As a method for making the coating different, for example, there is a method of changing the type of coating additive. The low dielectric constant material used to obtain the ceramic substrate of this example is preferably one having a melting point lower than that of the ceramic body, such as PbS.
iO3, BS f03, Li5i03. Various types of crystallized glasses are suitable.

A plurality of capacitors can be built into the thus obtained ceramic substrate by providing a conductor portion (electrode, lead-out portion, etc.) on the surface of each high dielectric portion. Furthermore, a conductive portion (
For example, by forming through-hole-shaped (9 bodies), resistor or insulator parts (for example, formed by normal thin film or thick film forming method), it is possible to create a substrate with many functional parts. .

Hereinafter, the present invention will be explained in more detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.

Example 1 FIG. 1 shows the manufacturing process of a ceramic substrate according to an example of the present invention. In this example, as shown in FIG. 2(a), four parts 2 are formed on the molded body 1 during press molding. Next, in the same process as making ordinary porcelain capacitors,
O3-Dy203-5i02-based dielectric ceramic is formed. That is, the molded body is first fired in a predetermined atmosphere, then an additive such as CuO is applied, and a second firing is performed in an oxidizing atmosphere to obtain a dielectric ceramic substrate. After filling the concave portion of the dielectric ceramic substrate with, for example, PbSiO3 powder 3 as shown in FIG. 2(b), tertiary firing is performed.

Further, by forming predetermined conductor portions, resistor portions, and insulator portions on the ceramic substrate, a C and R built-in substrate can be obtained.

Example 2 FIG. 3 shows another manufacturing process of the ceramic substrate according to the embodiment of the present invention. A recess 23 is formed by laser irradiation in the ceramic substrate 22 which has been made into a semiconductor by the subsequent firing (FIG. 4(b)). Next, additives are applied and secondary firing is performed to obtain a dielectric ceramic substrate. The concave portion of the ceramic substrate is filled with powder 24 of, for example, P b Si O 3 as shown in FIG. 4(c), and tertiary firing is performed.

Further, by forming predetermined conductor portions, resistor portions, and insulator portions on this substrate, a C and R built-in substrate can be obtained.

Embodiment 3 FIG. 5 shows another manufacturing process of a ceramic substrate according to an embodiment of the present invention. In this example, a molded body 31 having a desired shape is obtained by molding (FIG. 6(a)), and after applying an additive to a ceramic substrate made into a semiconductor by secondary firing, a dielectric ceramic substrate is subjected to secondary firing. Get 32. A recess 33 is formed in this ceramic substrate by machining using a diamond tool (FIG. 6(b)), and the recess is filled with powder 34 of, for example, P b Si O3 as shown in FIG. 6(c). . Next, tertiary firing is performed. By forming predetermined conductor portions, resistor portions, and insulator portions on the substrate, a C and R built-in substrate can be obtained.

In addition, FIG. 7 (a) and (
b) is a plan view and a cross-sectional view of the ceramic substrate, respectively;
41 is a high dielectric portion, and 42 is a low dielectric portion. Further, FIG. 7(c) further shows a conductor portion 43, a resistor portion 44,
and a ceramic substrate on which an insulator portion 45 is formed.

〔Effect of the invention〕

The electronic material ceramic of the present invention can define a plurality of dielectric bodies having various dielectric constants. Therefore, the electronic circuit substrate of the present invention constructed using this can incorporate a plurality of capacitors of various capacities, and various functional parts such as conductors, resistors, and insulators can be formed on this substrate. As a result, it becomes a base for electronic circuits that is equipped with many functional parts, is smaller in size, and is inexpensive. Further, in this way, the degree of freedom in designing capacitors, resistors, etc. within the base can be greatly improved.

Note that in the present invention, the voids provided in the molded body are filled with substances having different dielectric constants; however, it is possible to achieve a low dielectric constant without a filler, that is, with only an air phase. As some parts of the substrate become extremely thin, the strength of the substrate itself becomes a problem. Therefore, by filling the voids with the filler material, it is possible to achieve the effect of improving the strength.

[Brief explanation of drawings]

FIG. 1 is a process explanatory diagram for explaining the manufacturing process of a ceramic substrate according to an embodiment of the present invention, and FIG. , (b
) shows a cross-sectional view of a ceramic substrate whose recesses are filled with substances having different dielectric constants. FIG. 3 is a process explanatory diagram for explaining another manufacturing process of a ceramic substrate according to an embodiment of the present invention, and
) shows a cross-sectional view of the resulting molded body, (b) shows a semiconductor ceramic substrate with a recess formed therein, and (C) shows a cross-sectional view of a ceramic substrate in which the recess is filled with a substance having a different dielectric constant. FIG. 5 is a process explanatory diagram for explaining still another manufacturing process of a ceramic substrate according to an embodiment of the present invention, and FIG. 6(a) is a molded product at this time. (b) shows a cross-sectional view of a dielectric ceramic substrate in which a recess is formed, and (C) shows a dielectric ceramic substrate in which the recess is filled with a substance having a different dielectric constant. FIG. 7(a) is a plan view of a ceramic substrate according to an embodiment of the present invention, and FIG. 7(b) is a sectional view taken along line A-A in FIG.
C) is a sectional view of a ceramic substrate with built-in R and C in which functional parts such as conductors, resistors, and insulators are further formed on this ceramic substrate. FIG. 8 is a cross-sectional view of a conventional ceramic substrate. FIG. 9 is a cross-sectional view of a ceramic substrate having a plurality of high dielectric portions according to a conventional method. 1.21.31・Φ・Molded body. 2.23, 32.41・Fist・Dielectric porcelain. 3.24,33,42・-Φ low dielectric constant material. 22・Φ・Semiconductor porcelain. 43...Conductor. 44.9 - Resistor. 45...Insulator. Agent Patent Attorney Seki Yamashita Figure 1 (G) (b) Figure 3 Figure 4 (a) (b) (C) Figure M5 Figure 6 (b) (C) Cause 7 (a) ( C)

Claims (5)

[Claims] (1) An electronic material characterized by having portions with different dielectric constants formed by filling a void provided in a molded body containing a dielectric material or its precursor with substances having different dielectric constants. ceramic. (2) The electronic material ceramic according to claim (1), wherein the void space is filled with a substance having a low dielectric constant to reduce the dielectric constant. (3) Comprised of an electronic material ceramic having portions with different dielectric constants formed by filling a void provided in a molded body containing a dielectric material or its precursor with substances having different dielectric constants. An electronic circuit substrate characterized by: (4) Claim (3) comprising two or more high dielectric parts spaced apart from each other with a low dielectric constant part sandwiched between the hollow space filled with a low dielectric constant material and a low dielectric constant part sandwiched therebetween. The electronic circuit substrate described above. (5) The ceramic according to claim (3) or (4) further has at least one type of functional part among a conductor, a resistor, an insulator, etc. inside or around the ceramic. Substrate for electronic circuits.