JPH02230798A - Compound laminated ceramic parts - Google Patents

Abstract

PURPOSE:To prevent the generation of exfoliation and cracks in the interface between an insulative layer and a dielectric layer and improve quality stability and reliability by using three-component composition of aluminum oxide, magnesium oxide and borosilicate lead system glass as the main component of insulative material for forming an insulator layer, and using perovskite structure compound containing lead as the main component of dielectric material for forming a dielectric layer. CONSTITUTION:As for the ratio of each component constituting insulative material, the following composition range is desirable; aluminum oxide is 20wt.% or less, magnesium oxide is 15-45wt.% and borosilicate lead system glass is 52-75wt.%. Perovskite structure compound containing lead is used as dielectric material. The difference of thermal expansion coefficient between the insulative material forming an insulator layer 2 and dielectric material forming a dielectric layer 1 is controlled to be 2X10<-6>/ deg.C or less, thereby reducing the difference of thermal coefficient between both layers and preventing the generation of cracks.

Description

[Detailed description of the invention] [Industrial application fields] The present invention relates to composite laminated ceramic components.

? Conventional technology] Conventionally, electronic circuits using large-capacity capacitors have been mounted with chip-type capacitors on substrates such as alumina to achieve high integration.

In other words, a hybrid integrated circuit is created by forming a wiring pattern using resistors, electrodes, and conductors on an insulating substrate such as a ceramic substrate using a printing method, and then mounting chip capacitors, semiconductor integrated circuits, etc. on the same surface. was being created. Recently, the development of composite ceramic parts in which a dielectric material forming a capacitor is sandwiched between insulators has progressed, and applications such as hybrid integrated circuits are being carried out.

In general, in recent years, with rapid technological advances in electronics, various electronic parts are becoming smaller, and making parts lighter, thinner, shorter, and smaller has become an essential condition in terms of cost reduction.

However, in conventional composite parts such as hybrid integrated circuits,
There are certain limits to printing resistors, electrodes, and wiring patterns at a higher density on limited insulator substrates such as ceramics, and mounting chip capacitors, semiconductor integrated circuits, etc. in a higher density. There is.

For example, if a high-density wiring pattern is formed, quality may deteriorate or costs may rise, and in highly integrated designs, mounting space issues and shape constraints may arise due to an increase in the number of mounted components. It became a problem.

Therefore, in order to achieve higher density and higher integration, composite laminated ceramic parts are being developed that have a structure in which resistors and capacitors are housed in an insulating substrate and laminated.

FIG. 2 is a cross-sectional view of a substrate before lamination, showing an example of this composite laminated ceramic component.

In this example, electrode layers 3 forming capacitor electrodes are provided on two of three dielectric layers 1 having a predetermined dielectric constant, and these are laminated to form a capacitor. One of the outermost layers of the insulator layer 2 is provided with a pad electrode 6 for connecting to an external circuit on the outer surface, and a lead-out conductor 4 and a connection pattern wiring 5 provided on the insulator layer 2 together with other components, wiring, etc. The structure is such that the external pad electrode 6 and the electrode layer 3 are connected when the insulator layer 2 and the dielectric layer 1 are laminated and pressure-bonded.

These dielectric materials and insulating materials have different properties, and among these, a two-component composition of aluminum oxide and lead borosilicate glass is usually used as the insulating material.

[Problems to be Solved by the Invention] The conventional composite laminated ceramic component described above has a structure in which the laminated dielectric layer 1 and insulator layer 2 are formed of dielectric materials and insulator materials having mutually different properties. Therefore, due to subtle differences in shrinkage rates and large differences in thermal expansion coefficients of each material, phenomena such as peeling and clutter easily occur at the interface between the insulator layer 2 and dielectric layer 1, resulting in unstable quality. This had the disadvantage of hindering performance and reliability.

An object of the present invention is to provide a composite laminated ceramic component that prevents peeling and cracking at the interface between an insulator layer and a dielectric layer, and has improved quality stability and reliability.

[Means for Solving the Problem] The present invention includes an insulating layer, a dielectric layer provided with an internal electrode forming a capacitor, and a conductor that leads the capacitor of the dielectric layer to the top of the insulating layer. , a composite laminated ceramic component comprising a conductive wiring layer, in which the insulating material forming the insulating layer is mainly composed of a three-component composition of aluminum oxide, magnesium oxide, and lead borosilicate glass, and forming the dielectric layer. The dielectric material is mainly composed of a compound having a perovskite structure containing lead, and the difference in coefficient of thermal expansion between the insulator material and the dielectric material is 2.0×10-6/
The present invention is a composite laminated ceramic component characterized by a temperature within °C.

In conventional composite laminated ceramic parts, insulator materials and dielectric materials with different thermal properties (coefficients of thermal expansion) are used, and this difference is a factor that causes cracks to occur after sintering. It had become.

In the present invention, the above-mentioned insulator materials and dielectric materials are used, and the difference in thermal expansion coefficient between the insulator material forming the insulator layer and the dielectric material forming the dielectric layer is 2X.
By controlling the temperature within 10-6/°C, the difference in thermal expansion coefficient between the two layers is reduced and the occurrence of cracks is prevented.

The proportions of each component constituting the insulator material are preferably in a composition range of 20% by weight or less of aluminum oxide, 15 to 40% by weight of magnesium oxide, and 52 to 75% by weight of lead borosilicate glass.

In the range where aluminum oxide exceeds 20% by weight and the range where magnesium oxide exceeds 40% by weight, iooo
It is not sintered at temperatures below 'c, and magnesium oxide is 15
The coefficient of thermal expansion becomes small in the range of weight percent ungrooved. Generally, in lead borosilicate glass, if the content is outside the above range, glass stability cannot be obtained, and foaming and outflow of glass components are likely to occur.

Regarding the difference in shrinkage after sintering between the insulator material and the dielectric material, the slight difference in shrinkage will not be a problem due to the above-mentioned matching of thermal expansion coefficients, but if the difference in shrinkage becomes a problem, It is possible to make it suitable by controlling the composition ratio of the body.

[Example] Next, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of a substrate before lamination molding, showing one embodiment of the present invention. The main components in the cross-sectional view of the board in Figure 1 are
Since it is the same as that shown in the figure, explanations of the same components will be omitted. The difference between this embodiment and the conventional composite laminated ceramic component shown in FIG. 2 is that conventionally, the insulating material forming the insulating layer 2 is a two-component composition of aluminum oxide and lead borosilicate glass. In contrast, in this example, the insulator material was a three-component composition of aluminum oxide, magnesium oxide, and lead borosilicate glass, and the difference in thermal expansion coefficient with the dielectric material was controlled within 2X10-6/℃. It is in.

Next, the manufacturing method of this example will be explained.

To obtain ceramic green sheets for the dielectric layer and the insulator layer, powder raw materials are first weighed and mixed or pulverized using a ball mill or the like. Next, the mixed powder raw material is calcined using an electric furnace or the like to produce a prefired powder material. The precalcined powder material obtained by calcining is mixed with an organic solvent and an organic binder to obtain a slurry. This slurry is formed into a green sheet on a polyethylene film using a casting device such as a doctor blade method to obtain a ceramic green sheet.

By the above method, an insulating ceramic green sheet,
A dielectric ceramic green sheet is produced and cut into a predetermined shape to produce each ceramic green sheet piece.

The dielectric material used here is a compound with a perovskite structure containing lead, and the dielectric constant of this dielectric material is
It varies depending on the composition ratio of the constituent elements, but approximately 500~
It can be controlled within a range of 20,000.

Therefore, it is extremely advantageous for forming a large capacity capacitor.

In addition, the insulator materials used here include composite materials of alumina, magnesia, and Houkei VL lead-based glass, as well as materials such as cordierite ceramics and calcilite ceramics, which can be used by controlling the coefficient of thermal expansion. The dielectric constant of these insulating materials is about 5 to 10.

On the other hand, the metal bodies include Au, AQ, Pd, Pt, Cu,
A composition containing one or more types of N+ etc. is used.

Next, Ag-P is used for the dielectric ceramic green sheet piece.
d paste, print the electrode layer 3 of the capacitor, roughly drill a through hole in each piece of ceramic green sheet that requires a through hole, and then fill the through hole with Aq.
- Fill with Pd paste to form conductor 4. Similarly, an external pad electrode 6 is formed on a ceramic green sheet piece that forms the outermost insulating layer 2, and a conductor wiring layer 5 that connects the conductor 4 and the external pad electrode 6 is formed on the ceramic green sheet that becomes the insulating layer 2. Form into sheet pieces.

Next, they are laminated so as to have the structure shown in FIG. 1, and after being put into a press mold, a thermocompression press is performed. After cutting the press-bonded raw laminated ceramic body into a predetermined shape using a knife blade or the like, a binder removal process is performed at a temperature of about 500'C. Thereafter, by sintering at a temperature of about 850 to 1000'C, a composite multilayer ceramic component with a built-in capacitor is obtained.

Table 1 shows the material composition of the insulator layer when a composite laminated ceramic component is manufactured using the amounts of each component listed in the table.
It shows the difference in thermal expansion coefficient between an insulator material and a dielectric material and the presence or absence of cracks in parts.

As can be seen from the table, in the composite laminated ceramic component of the present invention, the difference in thermal expansion coefficient between the insulating layer and the dielectric layer is well controlled, and the stress caused by thermal stress is well controlled, thereby preventing the occurrence of cracks. .

(The following is a blank space) [Effects of the Invention] As explained above, in the composite laminated ceramic component of the present invention, by using predetermined materials for the insulating layer and the dielectric layer, the difference in thermal expansion coefficient between the two layers can be reduced. Control Zare,
Since the stress caused by thermal stress is controlled, cracks do not occur, and delamination due to subtle differences in shrinkage between different materials can be suppressed, resulting in improved quality stability and reliability. has.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a substrate before lamination molding, showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a substrate before lamination molding, showing an example of a conventional composite laminated ceramic component. 1... Dielectric layer 2... Insulator layer 3...
・Capacitor electrode layer 4...conductor 5,...conductor wiring layer 6
・・・External pad electrode

Claims (1)

[Claims] (1) Composite laminated ceramic consisting of an insulator layer, a dielectric layer provided with internal electrodes forming a capacitor, a conductor that leads the capacitor in the dielectric layer to the top of the insulator layer, and a conductor wiring layer. The component has a perovskite structure in which the insulating material forming the insulating layer is mainly composed of a three-component composition of aluminum oxide, magnesium oxide, and lead borosilicate glass, and the dielectric material forming the dielectric layer contains lead. The difference in thermal expansion coefficient between the insulating material and the dielectric material is 2.0×10^-^6/
A composite laminated ceramic component characterized by a temperature within ℃.