JPS6231828B2 - - Google Patents

Info

Publication number
JPS6231828B2
JPS6231828B2 JP55125783A JP12578380A JPS6231828B2 JP S6231828 B2 JPS6231828 B2 JP S6231828B2 JP 55125783 A JP55125783 A JP 55125783A JP 12578380 A JP12578380 A JP 12578380A JP S6231828 B2 JPS6231828 B2 JP S6231828B2
Authority
JP
Japan
Prior art keywords
layer
insulating layer
substrate
heat
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55125783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5750455A (en
Inventor
Kenji Nagashima
Hiroshi Matsumoto
Hiroshi Oohira
Nobuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP12578380A priority Critical patent/JPS5750455A/ja
Publication of JPS5750455A publication Critical patent/JPS5750455A/ja
Publication of JPS6231828B2 publication Critical patent/JPS6231828B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12578380A 1980-09-10 1980-09-10 Hybrid integrated circuit Granted JPS5750455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12578380A JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12578380A JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS5750455A JPS5750455A (en) 1982-03-24
JPS6231828B2 true JPS6231828B2 (enrdf_load_stackoverflow) 1987-07-10

Family

ID=14918734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12578380A Granted JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5750455A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193547A (ja) * 1987-02-06 1988-08-10 Showa Denko Kk 回路用基板
JP5546889B2 (ja) 2010-02-09 2014-07-09 日本電産エレシス株式会社 電子部品ユニット及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced

Also Published As

Publication number Publication date
JPS5750455A (en) 1982-03-24

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