JPS6231059B2 - - Google Patents

Info

Publication number
JPS6231059B2
JPS6231059B2 JP22101584A JP22101584A JPS6231059B2 JP S6231059 B2 JPS6231059 B2 JP S6231059B2 JP 22101584 A JP22101584 A JP 22101584A JP 22101584 A JP22101584 A JP 22101584A JP S6231059 B2 JPS6231059 B2 JP S6231059B2
Authority
JP
Japan
Prior art keywords
temperature
lead frame
frame material
content
annealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22101584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6199647A (ja
Inventor
Motohisa Myato
Yasuhiro Nakajima
Satoru Katayama
Takashi Matsui
Hidekazu Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP59221015A priority Critical patent/JPS6199647A/ja
Priority to US06/786,482 priority patent/US4656003A/en
Priority to DE8585307331T priority patent/DE3566904D1/de
Priority to EP85307331A priority patent/EP0189637B1/de
Priority to KR1019850007699A priority patent/KR900004109B1/ko
Publication of JPS6199647A publication Critical patent/JPS6199647A/ja
Priority to MYPI86000154A priority patent/MY100717A/en
Publication of JPS6231059B2 publication Critical patent/JPS6231059B2/ja
Priority to SG217/89A priority patent/SG21789G/en
Priority to HK402/92A priority patent/HK40292A/xx
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59221015A 1984-10-20 1984-10-20 半導体用リ−ドフレ−ム材およびその製造法 Granted JPS6199647A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP59221015A JPS6199647A (ja) 1984-10-20 1984-10-20 半導体用リ−ドフレ−ム材およびその製造法
US06/786,482 US4656003A (en) 1984-10-20 1985-10-11 Copper alloy and production of the same
DE8585307331T DE3566904D1 (en) 1984-10-20 1985-10-14 Copper alloy and production of the same
EP85307331A EP0189637B1 (de) 1984-10-20 1985-10-14 Kupferlegierung und deren Herstellung
KR1019850007699A KR900004109B1 (ko) 1984-10-20 1985-10-18 반도체의 리드프레임 재료 및, 단자와 코넥터용 동합금과 그 제조법
MYPI86000154A MY100717A (en) 1984-10-20 1986-11-28 Copper alloy and production of the same.
SG217/89A SG21789G (en) 1984-10-20 1989-04-08 Copper alloy and production of the same
HK402/92A HK40292A (en) 1984-10-20 1992-06-04 Copper alloy and production of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59221015A JPS6199647A (ja) 1984-10-20 1984-10-20 半導体用リ−ドフレ−ム材およびその製造法

Publications (2)

Publication Number Publication Date
JPS6199647A JPS6199647A (ja) 1986-05-17
JPS6231059B2 true JPS6231059B2 (de) 1987-07-06

Family

ID=16760139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59221015A Granted JPS6199647A (ja) 1984-10-20 1984-10-20 半導体用リ−ドフレ−ム材およびその製造法

Country Status (1)

Country Link
JP (1) JPS6199647A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396232A (ja) * 1986-10-09 1988-04-27 Kobe Steel Ltd プラスチツク．ピン・グリツド・アレイｉｃリ−ドピン用銅合金およびその製造方法
JPS63112003A (ja) * 1986-10-30 1988-05-17 Furukawa Electric Co Ltd:The 半導体用銅系リ−ド材の製造法
JPH01198441A (ja) * 1988-02-01 1989-08-10 Furukawa Electric Co Ltd:The プラスチック・ピン・グリット・アレイ用リード材
JP2514234B2 (ja) * 1988-08-05 1996-07-10 株式会社神戸製鋼所 強度と導電性に優れる端子・コネクタ―用銅合金
JP2709178B2 (ja) * 1990-05-10 1998-02-04 住友電気工業株式会社 ハーネス用電線導体
KR0157257B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법
DE112005001271T5 (de) * 2004-06-02 2007-05-03 The Furukawa Electric Co., Ltd., Kupferlegierung für elektrische und elektronische Geräte
JP4566048B2 (ja) * 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
CN112626371B (zh) * 2020-12-10 2022-07-29 中色奥博特铜铝业有限公司 一种高强中导铜镍硅锡镁合金箔材及其加工方法
CN114134364B (zh) * 2021-12-21 2022-12-02 有研工程技术研究院有限公司 一种铜合金材料及其制备方法
CN114752810B (zh) * 2022-03-24 2023-04-11 江苏恒盈电子科技有限公司 一种线路板用高强度半导体引线框架及其制备方法

Also Published As

Publication number Publication date
JPS6199647A (ja) 1986-05-17

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Legal Events

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