JPS6230333A - シリコンウエ−ハの研磨方法及び組成物 - Google Patents
シリコンウエ−ハの研磨方法及び組成物Info
- Publication number
- JPS6230333A JPS6230333A JP61113850A JP11385086A JPS6230333A JP S6230333 A JPS6230333 A JP S6230333A JP 61113850 A JP61113850 A JP 61113850A JP 11385086 A JP11385086 A JP 11385086A JP S6230333 A JPS6230333 A JP S6230333A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- piperazine
- weight
- sol
- colloidal silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 11
- 229910052710 silicon Inorganic materials 0.000 title claims description 11
- 239000010703 silicon Substances 0.000 title claims description 11
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 61
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 61
- 238000005498 polishing Methods 0.000 claims description 29
- 239000008119 colloidal silica Substances 0.000 claims description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229910021485 fumed silica Inorganic materials 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims description 2
- 239000011164 primary particle Substances 0.000 claims description 2
- 238000001246 colloidal dispersion Methods 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 description 12
- 150000001412 amines Chemical class 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000000499 gel Substances 0.000 description 5
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical class C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- -1 piperazine compound Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- JREWWYAIAKQOCO-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine 2-piperazin-1-ylethanamine Chemical compound NCCN1CCNCC1.NCCCN1CCN(CCCN)CC1 JREWWYAIAKQOCO-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Silicon Compounds (AREA)
- Weting (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US736056 | 1985-05-20 | ||
| US06/736,056 US4588421A (en) | 1984-10-15 | 1985-05-20 | Aqueous silica compositions for polishing silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6230333A true JPS6230333A (ja) | 1987-02-09 |
| JPH0515302B2 JPH0515302B2 (enrdf_load_stackoverflow) | 1993-03-01 |
Family
ID=24958334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61113850A Granted JPS6230333A (ja) | 1985-05-20 | 1986-05-20 | シリコンウエ−ハの研磨方法及び組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230333A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228925A (ja) * | 1988-07-19 | 1990-01-31 | Japan Silicon Co Ltd | ウェーハの製造方法 |
| JPH11302635A (ja) * | 1998-04-24 | 1999-11-02 | Hiroaki Tanaka | 研磨用組成物及びそれを使用した研磨方法 |
| JP2001003036A (ja) * | 1998-06-22 | 2001-01-09 | Fujimi Inc | 研磨用組成物および表面処理用組成物 |
| JP2002294223A (ja) * | 2001-03-28 | 2002-10-09 | Shin Etsu Handotai Co Ltd | 研磨剤及び研磨方法 |
| US7005382B2 (en) | 2002-10-31 | 2006-02-28 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing |
| US7192461B2 (en) | 2002-11-22 | 2007-03-20 | Nippon Aerosil Co., Ltd. | High concentration silica slurry |
| JP2011523207A (ja) * | 2008-05-23 | 2011-08-04 | キャボット マイクロエレクトロニクス コーポレイション | 安定な高濃度ケイ素スラリー |
| WO2016063505A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
-
1986
- 1986-05-20 JP JP61113850A patent/JPS6230333A/ja active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228925A (ja) * | 1988-07-19 | 1990-01-31 | Japan Silicon Co Ltd | ウェーハの製造方法 |
| JPH11302635A (ja) * | 1998-04-24 | 1999-11-02 | Hiroaki Tanaka | 研磨用組成物及びそれを使用した研磨方法 |
| JP2001003036A (ja) * | 1998-06-22 | 2001-01-09 | Fujimi Inc | 研磨用組成物および表面処理用組成物 |
| JP2002294223A (ja) * | 2001-03-28 | 2002-10-09 | Shin Etsu Handotai Co Ltd | 研磨剤及び研磨方法 |
| US7005382B2 (en) | 2002-10-31 | 2006-02-28 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing |
| US7192461B2 (en) | 2002-11-22 | 2007-03-20 | Nippon Aerosil Co., Ltd. | High concentration silica slurry |
| JP2011523207A (ja) * | 2008-05-23 | 2011-08-04 | キャボット マイクロエレクトロニクス コーポレイション | 安定な高濃度ケイ素スラリー |
| WO2016063505A1 (ja) * | 2014-10-22 | 2016-04-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2016084371A (ja) * | 2014-10-22 | 2016-05-19 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| KR20170074869A (ko) * | 2014-10-22 | 2017-06-30 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| US10190024B2 (en) | 2014-10-22 | 2019-01-29 | Fujimi Incorporated | Polishing composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515302B2 (enrdf_load_stackoverflow) | 1993-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |