JPS6229334B2 - - Google Patents

Info

Publication number
JPS6229334B2
JPS6229334B2 JP56195002A JP19500281A JPS6229334B2 JP S6229334 B2 JPS6229334 B2 JP S6229334B2 JP 56195002 A JP56195002 A JP 56195002A JP 19500281 A JP19500281 A JP 19500281A JP S6229334 B2 JPS6229334 B2 JP S6229334B2
Authority
JP
Japan
Prior art keywords
carrier
rotating shaft
arm
semiconductor substrates
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56195002A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5896749A (ja
Inventor
Yukihisa Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP19500281A priority Critical patent/JPS5896749A/ja
Publication of JPS5896749A publication Critical patent/JPS5896749A/ja
Publication of JPS6229334B2 publication Critical patent/JPS6229334B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • De-Stacking Of Articles (AREA)
JP19500281A 1981-12-03 1981-12-03 半導体基板の製造装置 Granted JPS5896749A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19500281A JPS5896749A (ja) 1981-12-03 1981-12-03 半導体基板の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19500281A JPS5896749A (ja) 1981-12-03 1981-12-03 半導体基板の製造装置

Publications (2)

Publication Number Publication Date
JPS5896749A JPS5896749A (ja) 1983-06-08
JPS6229334B2 true JPS6229334B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-25

Family

ID=16333893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19500281A Granted JPS5896749A (ja) 1981-12-03 1981-12-03 半導体基板の製造装置

Country Status (1)

Country Link
JP (1) JPS5896749A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453941A (en) * 1987-08-25 1989-03-01 Nec Corp Housing device for sheet

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
CN102969262B (zh) * 2012-12-07 2017-03-01 上海集成电路研发中心有限公司 硅片倒片装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453941A (en) * 1987-08-25 1989-03-01 Nec Corp Housing device for sheet

Also Published As

Publication number Publication date
JPS5896749A (ja) 1983-06-08

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