JPS62291559A - Ultrasonic vibrator - Google Patents
Ultrasonic vibratorInfo
- Publication number
- JPS62291559A JPS62291559A JP61135407A JP13540786A JPS62291559A JP S62291559 A JPS62291559 A JP S62291559A JP 61135407 A JP61135407 A JP 61135407A JP 13540786 A JP13540786 A JP 13540786A JP S62291559 A JPS62291559 A JP S62291559A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed board
- adhered
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000012856 packing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000282326 Felis catus Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229940035289 tobi Drugs 0.000 description 1
- NLVFBUXFDBBNBW-PBSUHMDJSA-N tobramycin Chemical compound N[C@@H]1C[C@H](O)[C@@H](CN)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O[C@@H]2[C@@H]([C@@H](N)[C@H](O)[C@@H](CO)O2)O)[C@H](N)C[C@@H]1N NLVFBUXFDBBNBW-PBSUHMDJSA-N 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〈産業上の利用分野〉
この発明は、例えば医療その他の用途に供される垣音波
撮像装匠乙こ関連し、殊にこの発明はこの種装置に組込
まれるマトリクスアレイ型超音波振動子に関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention (Field of Industrial Application) The present invention relates to, for example, acoustic wave imaging devices used for medical and other purposes. The present invention relates to a matrix array type ultrasonic transducer incorporated into a seed device.
〈従来の技ｆネｊ〉
従来の７トリクスアレイ型協音波県勤子は、第４図に示
す如く、平板状の圧電体の片側面を、ダイシング／ム等
によりｖ′を横分割しでマトリクス状に配列された圧電
集合体７を形成し、この圧電集合体７の超音波送受波面
に共通電極をなす音響整合層７２を形成し、反対面の各
圧電体７１に取出電極をなすリード線７３を一本宛ハン
ダ付けにより取付け、多数リード線部分に樹脂モールド
によるバッキング材料７４を設けて、これを第５図、第
６図に示す如くケース８に装填し、リード線７３はケー
ブル８１にてケース８外へ引き出して信号処理回路基板
９に接続されろ。<Conventional Techniques> As shown in Figure 4, the conventional 7-trix array type Kyosonic Kenshi is made by horizontally dividing v' on one side of a flat piezoelectric material by dicing/mucking, etc. A piezoelectric assembly 7 arranged in a matrix is formed, an acoustic matching layer 72 serving as a common electrode is formed on the ultrasonic wave transmitting/receiving surface of the piezoelectric assembly 7, and a lead serving as an extraction electrode is formed on each piezoelectric body 71 on the opposite surface. The wires 73 are attached by soldering one by one, a backing material 74 made of resin mold is provided on the multiple lead wire portions, and this is loaded into the case 8 as shown in FIGS. 5 and 6. The lead wires 73 are attached to the cable 81. Pull it out of the case 8 and connect it to the signal processing circuit board 9.
〈発明が解決しようとする問題点〉
ところが、この種超音波振動子においては、例えばマト
リクス配列がｍ行、ｎ列の場合、ｍｘｎ本の多数の電極
を要し、この電極は圧電体の増加に比例して増力口する
ため、リード線のハンダ付は作業および外部の信号処理
回路基板との接続作業に時間と技トド１を要し、生産性
が低いという間四がある。<Problems to be Solved by the Invention> However, in this type of ultrasonic transducer, for example, when the matrix arrangement is m rows and n columns, a large number of m x n electrodes are required, and these electrodes require an increase in piezoelectric material. Since the power is multiplied in proportion to the power output, soldering the lead wires and connecting them to an external signal processing circuit board requires time and skill, resulting in low productivity.
そこで本発明は、多数電極の取出しを遵電パクーンを有
ｒ多層プリント十反にで行い、この多層プリント板にフ
レキシブルプリント板を設けて信号処理回路基板に接続
することにより、従来の諸問題を一挙に解消し、リード
線のハンダ付は作業を省き且つ誤配線を解消ずろと共に
、高密度配線によって小型化を実現し得る新規な超音波
振動子を提供することを目的とする。Therefore, the present invention solves the conventional problems by taking out a large number of electrodes using a multilayer printed circuit board, and by providing a flexible printed board on this multilayer printed board and connecting it to a signal processing circuit board. It is an object of the present invention to provide a new ultrasonic transducer which can solve the problems at once, eliminate the work of soldering lead wires, eliminate incorrect wiring, and realize miniaturization by high-density wiring.
〈問題点を解決するための手段〉
上記の目的を達成するための本発明の構成を、実施例に
対応する第１図〜第３図を用いて説明すると、本発明の
超音波振動子は、７１リクス状に配列された多数の圧電
体を有す超音′ｌ！Ｊ、振動子に対し各圧電体に接続し
た導電パターン３を有す多層プリント板２を配設し、こ
の多層プリント板２に、信号処理回路基板５に接続する
フレキシブルプリント板２ａを連設してなる。<Means for Solving the Problems> The configuration of the present invention for achieving the above object will be explained using FIGS. 1 to 3 corresponding to the embodiments. , 71 An ultrasonic 'l! having a large number of piezoelectric bodies arranged in a lix shape! J. A multilayer printed board 2 having a conductive pattern 3 connected to each piezoelectric body is arranged for the vibrator, and a flexible printed board 2a connected to a signal processing circuit board 5 is connected to this multilayer printed board 2. It becomes.
く作用〉
上記の構成によると、この発明では、多数圧電体１の電
極取出しを多層プリント板２で行い、多層プリント板２
から処理回路までをフレキシブルプリント板２ａにて接
続したため、圧電体に個々にリート線をハンダ付けする
作業が省略され、且つリード線の誤配線を防止できる。Effects> According to the above configuration, in the present invention, the electrodes of the multiple piezoelectric bodies 1 are taken out on the multilayer printed board 2, and the multilayer printed board 2
Since the processing circuit is connected by the flexible printed board 2a, the work of individually soldering the lead wires to the piezoelectric body is omitted, and incorrect wiring of the lead wires can be prevented.
また、多層プリント板２およびフレキシブルプリント板
２ａの導電パターン３を高密度に設定できるため、超音
波振動子の大幅な小型化が可能となる等、発明目的を達
成した効果を奏する。Further, since the conductive patterns 3 of the multilayer printed board 2 and the flexible printed board 2a can be set at high density, the ultrasonic transducer can be significantly downsized, and the object of the invention is achieved.
〈実施例〉
第１図はこの発明の一実施例であるマトリクマ７レー型
、を召音波振動子を示Ｌ７てお幻、この・Ｉμ音波振動
子は、平板状圧電体の片面をダイヤモイトダイシング法
あるいはレーザダイシング法等により縦横ｍ行、ｎ列、
図示例ではｍ＝８、ｎ＝８に分割して圧電体１１がマト
リクス状に配列された圧電集合体ｌを形成している。こ
の圧電集合体１の片面には共通電極をなす音響整合層１
２が形成され、その反対面に、導電パターンを有す多層
プリント板２を導電接着している。〈Example〉 Figure 1 shows a matrix 7-ray type sound wave transducer L7, which is an embodiment of the present invention. By dicing method or laser dicing method, m rows and n columns,
In the illustrated example, a piezoelectric assembly 1 is formed in which piezoelectric bodies 11 are divided into m=8 and n=8 and arranged in a matrix. On one side of this piezoelectric assembly 1 is an acoustic matching layer 1 forming a common electrode.
2 is formed, and a multilayer printed board 2 having a conductive pattern is conductively bonded to the opposite surface thereof.
該多層プリント板２は、第３図に示す如く、可撓性プリ
ント板２１の４枚を積層した一例を示す。各プリント板
２１には、それぞれ下面に導電パターン３が設けられ、
各導電パターン３は、その端部をスルホール３１にて最
上層のプリント板２１に導き、各圧電体１１に対応して
電極３２を形成しており、圧電集合体１に多層プリント
板２を接着の後、バッキング材料４を接着して保持する
と共に、多層プリント板２に連続したフレキシブルプリ
ント板２ａに対し、信号処理回路基板５を第１図、第２
図に示す如く導電パターン３を合わせて接続する。As shown in FIG. 3, the multilayer printed board 2 is an example in which four flexible printed boards 21 are laminated. Each printed board 21 is provided with a conductive pattern 3 on its lower surface,
Each conductive pattern 3 leads its end to the uppermost printed board 21 through a through hole 31, and forms an electrode 32 corresponding to each piezoelectric body 11. A multilayer printed board 2 is bonded to the piezoelectric assembly 1. After that, the backing material 4 is adhered and held, and the signal processing circuit board 5 is attached to the flexible printed board 2a continuous to the multilayer printed board 2 as shown in FIGS.
The conductive patterns 3 are aligned and connected as shown in the figure.
この接続は、フレキシブルプリント板２ａの導電パター
ン３に予めハンダメッキを施こし、信号処理回路基板５
の電極パターン６との位置合わせの後、熱板を用いてフ
レキシブルプリント板２ａ側から加熱し、ハンダ付は接
着する。This connection is made by applying solder plating to the conductive pattern 3 of the flexible printed board 2a in advance, and by applying solder plating to the signal processing circuit board 5.
After alignment with the electrode pattern 6, heat is applied from the flexible printed board 2a side using a hot plate, and soldering is performed.
尚、多層プリント板２とフレキシブルプリント板２ａは
別々に製作して、これを接続するも可く、またフレキシ
ブルプリント板２ａは１枚に限定されず、且つ多層プリ
ント板２からの取出し方向も一方向に限定されない。Note that the multilayer printed board 2 and the flexible printed board 2a can be manufactured separately and then connected together, and the number of flexible printed boards 2a is not limited to one, and the direction in which they are taken out from the multilayer printed board 2 is also the same. Not limited to direction.
更に、フレキシブルプリント板２ａと信号処理回路基板
５の接続は、ハンダ付けに限らず、例えば異方渾電性接
着剤を用いて接続する等、選択実施する。Furthermore, the connection between the flexible printed board 2a and the signal processing circuit board 5 is not limited to soldering, but may be selectively performed, such as using an anisotropic electrostatic adhesive.
〈発明の効果〉
本発明は上記の如く、マトリクス状に配列された多数の
■電体を有す超音波振動子に対し、各圧電体１１に接続
した導電パターン３を有す多層プリント板２を配設して
、この多層プリント板２に、信号処理回路基板５に接続
するフレキシブルプリント板２ａを連設したから、多数
の圧電体１１に対し個々にリード線をハンダ付けする作
業が省略され、誤配線を確実に防止できると共に、リー
ド線によるセンサの共振周波数変化が防止される。また
、多層プリント板２およびフレキシブルプリント板２ａ
の導電パターン３は、高密度に設定できるため、超音波
振動子の大幅な小型化を実現できる等、構成節易にして
発明目的を達成した効果を有す。<Effects of the Invention> As described above, the present invention provides a multilayer printed board 2 having a conductive pattern 3 connected to each piezoelectric body 11 for an ultrasonic transducer having a large number of electric bodies arranged in a matrix. Since the flexible printed board 2a connected to the signal processing circuit board 5 is connected to the multilayer printed board 2, the work of individually soldering lead wires to a large number of piezoelectric bodies 11 is omitted. , erroneous wiring can be reliably prevented, and changes in the resonance frequency of the sensor due to the lead wires can be prevented. In addition, the multilayer printed board 2 and the flexible printed board 2a
Since the conductive pattern 3 can be set at a high density, the ultrasonic transducer can be significantly miniaturized, which has the effect of simplifying the structure and achieving the purpose of the invention.
第１図はこの発明にかかる超音波振動子の要部の斜視図
、第２図はフレキシブルプリント板と信号処理回路基板
との接続状況を示す図、第３図は多層プリント板の断面
図、第４図〜第６図は従来例を示す図である。
１・・・・圧電集合体 １１・・・・圧電体１２・・
・・音響整合層 ２・・・・多層プリント板３・・・
・導電パターン
５・・・・信号処理回路基板
特許出願人 立石電機株式会社
代理人 弁理士 鈴 木 由 充：・、′。
→ご１１）二；［） イねｌ・ｊｌ、鳶「）二と３
→６）図 Ｊ材ダ−Ｊ ｉ ＝イｊ２
＼−−ゴ
≠＋ ム）ｅ］１ 従染イ４．序示、ｆ＋２）１］
りンｔフ・す・ト技のＪ斤ｉ＋２１２−一 多♂
テフＯリー２ト４及
ａ −４橿じバク−／FIG. 1 is a perspective view of the main parts of the ultrasonic transducer according to the present invention, FIG. 2 is a diagram showing the connection between the flexible printed board and the signal processing circuit board, and FIG. 3 is a cross-sectional view of the multilayer printed board. FIGS. 4 to 6 are diagrams showing conventional examples. 1...Piezoelectric assembly 11...Piezoelectric body 12...
...Acoustic matching layer 2...Multilayer printed board 3...
・Conductive pattern 5...Signal processing circuit board patent applicant Yoshimitsu Suzuki, patent attorney and representative of Tateishi Electric Co., Ltd.:・、'. →Go11) 2; [) Ine l・jl, Tobi ``) 2 and 3
→6) Figure J material dar-J i = i j2 ＼--go≠+ mu) e] 1 Vertical dyeing a 4. Introduction, f+2)1]
Rin tfu・su・to technique J cat i+212−1 multi♂
Tef O Lee 2t 4 and a -4 Kashiji Baku-/
Claims (1)
動子であって、該振動子には、各圧電体に接続した導電
パターンを有す多層プリント板を配設し、この多層プリ
ント板には、信号処理回路基板に接続するフレキシブル
プリント板を連設して成るを特徴とする超音波振動子。An ultrasonic vibrator having a large number of piezoelectric bodies arranged in a matrix, the vibrator is provided with a multilayer printed board having a conductive pattern connected to each piezoelectric body, and the multilayer printed board An ultrasonic transducer comprising a flexible printed board connected to a signal processing circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61135407A JPS62291559A (en) | 1986-06-10 | 1986-06-10 | Ultrasonic vibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61135407A JPS62291559A (en) | 1986-06-10 | 1986-06-10 | Ultrasonic vibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62291559A true JPS62291559A (en) | 1987-12-18 |
Family
ID=15151003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61135407A Pending JPS62291559A (en) | 1986-06-10 | 1986-06-10 | Ultrasonic vibrator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62291559A (en) |
-
1986
- 1986-06-10 JP JP61135407A patent/JPS62291559A/en active Pending
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