JPS62287654A - Semiconductor stacking device - Google Patents

Abstract

PURPOSE:To realize a insulation-provided water-cooled stacking device capable of an output not lower than that of a water cooled stacking unit free of insulation of an equal size by a method wherein an insulator tube serving as a coolant path is screwed into the outside of a cooling fin electroconductive portion. CONSTITUTION:An insulator tube 18 serving as a water path for a watercooled fin 15 is constituted of such a synthetic resin as epoxy resin. A water-cooled block 19 to be the electroconductive section of the watercooled fin 15 is made of steel. The inner wall of the insulator tube and the outer wall of the water- cooled block 19 are respectively provided with threaded sections 20, to be screwed together. In this way, a sufficiently good thermal connection is established between the insulator tube 18 and water-cooled block 19. The heat generated by a semiconductor element 1 is first transferred to the water-cooled block 19 of the water cooled fin 15, then to the coolant after travelling through the screwed sections 20 and the insulator tube 18. With the screwed sections 20 contributing to the enlargement of the contact area between the water-cooled block 19 and insulator tube 18, there is an increase in heat conductivity, which enables the semiconductor element 1 to adequately radiate the heat it generates.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a semiconductor stack device, and particularly to an improvement of water cooling fins in an electrically insulated water-cooled stack device.

[Conventional technology]

In conventional non-insulated water-cooled semiconductor stack equipment,
Water cooling fins are used on both sides or one side of a semiconductor element, in which a conductive part and a water flow part are not electrically insulated.

FIG. 3 shows an outline of the configuration of this type of semiconductor stack device. That is, in FIG. 3, 1 is a semiconductor element, and 2 and 3 are water cooling fins arranged to sandwich the semiconductor element 1 from its upper and lower surfaces in order to function as an external electrode of the semiconductor element 1 and a cooling body for heat radiation. Shi, this water cooling fin 2
, 3 are attached with hose nipples 4, 5, respectively.

Also, 6 and 7 are above these, sewage cooling fins 2゜3
The external connection terminals 8 and 9 located above and below are further insulated by the insulating seats 10 disposed above and below the external connection terminals 6 and 7.
．． Reference numeral 11 denotes a presser plate made of an elastic metal body which holds each of these members from above and below.

Further, 12 is a tightening bolt inserted through the four corners of each of the upper and lower holding plates 10 and 11, and 13 is a nut screwed onto this tightening bolt 12 from above and below. These holding plates 10.11 and tightening bolts 12. The semiconductor element 1 is held under constant pressure by a nut 13. Also, 1
Reference numeral 4 denotes a rubber hose that is connected to the water cooling fins 2 and 3 via hose nipples 4 and 5 and serves as a flow path for cooling water. In the semiconductor stack device configured in this way, as is well known, the heat generated during the operation of the semiconductor element 1 is effectively dissipated through the respective water cooling fins 2 and 3 to stabilize its operation. ing.

However, when this type of semiconductor stack device is operated, a DC voltage is applied to the semiconductor element 1 between the upper and lower water cooling fins 2 and 3; During this time, a potential difference is generated through the cooling fluid, for example tap water, which continuously flows through the water cooling fins 2.3, which causes the metal of one of the water cooling fins 2 to ionize and the metal of the other water cooling fin 3 to ionize. A phenomenon of movement appears. In particular, the ionization of the hose nipple 4 at the tip of the water cooling fin 2 is significant, and in extreme cases, the hose nipple 4 will melt in a few years, making it impossible to connect the rubber hose 14), causing water leakage, etc. This may lead to a short circuit accident in the semiconductor stack device.

Furthermore, in order to prevent this type of phenomenon from occurring, it is necessary to use pure water with a high specific resistance as the cooling fluid, and in this case, it may take a great deal of effort to secure the pure water.

By the way, in order to solve the above-mentioned problems, an electrically insulated water-cooled semiconductor stack device using an insulated water-cooled fin in which the conductive part and the water flow part of the water-cooled fin are electrically insulated has been proposed. The outline of the configuration of this type of semiconductor stack device is shown in Fig. 4(m), (b) and Fig. 5(a).
, (b) K is shown. That is, FIG.

In FIG. 5, 15 is an insulated water cooling fin, and 16 is an insulating tube that becomes the water flow part of the water cooling fin 15.
6 is made of synthetic resin such as epoxy resin. Reference numeral 17 designates a water-cooled plotter that serves as a conductive portion of the water-cooled fins 15, and is made of steel. The insulating tube 16 and the water cooling block 1T are bonded using a silicone resin adhesive having good thermal conductivity, for example. FIG. 4 shows an example in which the insulating tube penetrates the inside of the water cooling block. Moreover, FIG. 5 shows an example in which the insulating tube is circumscribed on the side surface of the water cooling block.

[Problem that the invention seeks to solve]

However, this type of water cooling fin has poorer heat dissipation characteristics than non-insulated water cooling fins, and with the same dimensions as the non-insulated water cooling fin, the output characteristics of the semiconductor stack device will be lower than that of a non-insulated stack device. do. Additionally, in order to obtain the same output characteristics as a non-insulated stack, the shape of the insulated water cooling fins used in the insulated stack device is extremely large compared to the non-insulated water cooling fins. . This is due to the fact that the thermal characteristics such as thermal conductivity of the insulating tube material used in the insulated water cooling fin are inferior to those of non-insulated water cooling fins.

The present invention has been made to solve the above-mentioned problems, and its purpose is to obtain an insulated water-cooled stack device whose output characteristics are not inferior to those of non-insulated water-cooled stack devices of the same size. do.

[Failure to solve the problem]

The semiconductor stack device according to the present invention is constructed by screwing an insulating tube serving as a cooling body flow path onto the outer surface of the conductive portion of the water cooling fin.

[Effect]

In this invention, since the insulating tube serving as the cooling body flow path is screwed onto the outer surface of the conductive part of the water cooling fin, the contact area between the conductive part and the insulating tube, that is, the heat conduction area is increased. In particular, its thermal characteristics are improved, and as a result, the output characteristics of the stack device are improved, and it comes to have output characteristics comparable to those of non-insulated stack devices.

〔Example〕

Hereinafter, one embodiment of a semiconductor stack device according to the present invention will be described in detail with reference to FIGS. 1 and 2.

FIG. 1 is an overall configuration diagram showing an outline of the semiconductor stack device of this embodiment, and FIGS. 2-) and 2) are configuration diagrams of water cooling fins used in this semiconductor stack device.

In these figures, the same reference numerals as in FIG. 3 indicate the same or corresponding parts, and their explanation will be omitted. Reference numeral 18 denotes an insulating tube serving as a water flow section of the water cooling fin 15, and is made of synthetic resin such as epoxy resin. 1g is a water cooling block serving as a conductive part of the water cooling fins 15, and is made of steel. The inner surface of the insulating tube 18, the outer surface of the water cooling block 19, and K each have threaded portions 20, so that they are screwed into each other. It is clear that due to this screw engagement, the mutual contact area has been expanded compared to the cases shown in FIGS. 4 and 5. Further, it goes without saying that if this threaded portion is filled with silicone resin or the like having good thermal conductivity, an even better thermal bonding state can be obtained.

With this configuration, the insulating tube 18 and the water cooling block 19
With this, a sufficiently good thermal bonding state can be obtained, and the thermal characteristics of the semiconductor stack device will not be adversely affected in any way.

The structure of the assembly of this embodiment using such water cooling fins is exactly the same as that of the conventional one, so the explanation will be omitted.

In such a configuration, the heat generated by the semiconductor element 1 is transmitted to the water cooling block 19 of the water cooling fin 15, and further to the threaded portion 20. The heat is transmitted to the cooling body via the insulating tube 18, and since the contact area between the water cooling block 19 and the insulating tube 18 is expanded by the threaded portion 20, the heat conductivity is improved, and the heat conductivity of the semiconductor element 1 is improved. Generated heat is sufficiently dissipated.

〔Effect of the invention〕

As explained above, according to the present invention, the cooling fin is composed of a conductive part serving as an external electrode and a cooling body passage insulated from the conductive part, and this cooling body passage is screwed onto the outer surface side of the conductive part. By configuring them together, the contact area between the conductive part and the cooling body flow path increases, and the heat conduction area is expanded, so the heat generated by the semiconductor element is sufficiently dissipated, and the output characteristics of the stack device are improved. An extremely excellent effect can be obtained in that the amount is sufficiently increased.

[Brief explanation of drawings]

FIG. 1 is a block diagram of an insulated semiconductor stack device according to an embodiment of the present invention, FIGS. 2(m) and (b) are a plan view and a front sectional view of the water cooling fin of the above embodiment, respectively, and FIG. Partial cross-sectional configuration diagrams of conventional non-insulated conductor devices, FIGS. 4(a) and 5(b), and FIGS. 5(a) and 5(b) respectively show water-cooled fins used in conventional insulated semiconductor conductor devices. FIG. 2 is a plan view and a front sectional view of 1... Semiconductor element, 2, 3... Water cooling fin, 4
．． 5... Hose nipple, 6, 7... External connection terminal, 8.9-... Insulation seat, 10° 11... Pressing plate, 12... Tightening bolt, 13... Repair φ number nut, 1
4...Working rubber hose, 15...Insulated water cooling fin, 16...Insulating tube, 17...Water cooling block, 1
8...Insulation tube, 19...Water cooling block, 20...
・φ・Threaded part.

Claims (1)

[Claims] In a semiconductor stack device comprising water cooling fins provided in pressurized contact with both surfaces of a semiconductor element and serving as external electrodes of the semiconductor element, the water cooling fins have a conductive part as the external electrode and a conductive part insulated from the conductive part. 1. A semiconductor stack device comprising a cooling body flow path, the cooling body flow path being screwed onto the outer surface of the conductive portion.