JPS6292348A - Semiconductor stacker - Google Patents
Semiconductor stackerInfo
- Publication number
- JPS6292348A JPS6292348A JP23266885A JP23266885A JPS6292348A JP S6292348 A JPS6292348 A JP S6292348A JP 23266885 A JP23266885 A JP 23266885A JP 23266885 A JP23266885 A JP 23266885A JP S6292348 A JPS6292348 A JP S6292348A
- Authority
- JP
- Japan
- Prior art keywords
- water
- fins
- water cooling
- semiconductor element
- leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体スタック装置に関し、特に電気絶縁
形水冷式スタック装置Ｃ：おける水冷フィンの改良に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor stack device, and particularly to an improvement of water cooling fins in an electrically insulated water-cooled stack device C:.
一般にこの種の半導体スタック装置においては、半導体
素子ｌ二対してその両面ないしは片面Ｉ：導電部と水流
部が電気的ζ二線縁されていない水冷フィンを用いてい
る。Generally, in this type of semiconductor stack device, a water cooling fin is used in which the conductive part and the water flow part are not electrically bordered by two lines.
この種の従来例による半導体スタック装置の構成の概要
を第３図に示す。すなわち第３図において１は半導体素
子、２および３はこの半導体素子１の外部電極と放熱の
ための冷却体とをかねるためにその上下両面から、これ
をはさみこむように位置させた水冷フィンであり、この
水冷フィンにはそれぞれホースニップル４．５が付属接
続されている。また６および７はこれらの上、下水冷フ
ィン２．３の上、下に位置する外部接続端子、８及び９
はさらに外部接続端子６．７の上、下に位置する絶縁座
、１０．１１はこれら各部材を上下からはさみこんだ金
属弾性体からなる押え板である。 □また１２は上
下各押え板１０．１１の四隅部で挿通された締付ボルト
、１３はこの締付ボルト１２に上下か □ら螺合さ
れたナツトである。これら押え板１０．１１締付ボルト
１２、ナツト１３により前記半導体素子１て接続され冷
却水の流路となるゴムホースである。FIG. 3 shows an outline of the configuration of a conventional semiconductor stack device of this type. That is, in FIG. 3, 1 is a semiconductor element, and 2 and 3 are water-cooling fins positioned to sandwich the semiconductor element 1 from both its upper and lower surfaces in order to function as an external electrode of the semiconductor element 1 and a cooling body for heat radiation. A hose nipple 4.5 is attached to each of the water cooling fins. In addition, 6 and 7 are external connection terminals located above these, above and below the sewage cooling fins 2.3, 8 and 9
Further, numerals 10 and 11 are insulating seats located above and below the external connection terminals 6.7, and 10.11 is a holding plate made of a metal elastic body that sandwiches these members from above and below. □ Numeral 12 is a tightening bolt inserted through the four corners of each of the upper and lower holding plates 10 and 11, and 13 is a nut screwed onto this tightening bolt 12 from above and below. These holding plates 10 and 11 are rubber hoses that are connected to the semiconductor element 1 by tightening bolts 12 and nuts 13 and serve as a flow path for cooling water.
そして、この構成の半導体スタック装置では、よく知ら
れているように、半導体素子１の動作１：際して生ずる
発熱を、それぞれの水冷フィン２゜３により効果的に放
熱させて、その動作の安定化を図っている。In the semiconductor stack device having this configuration, as is well known, the heat generated during the operation 1 of the semiconductor element 1 is effectively dissipated by the respective water cooling fins 2 and 3, thereby improving the operation. Efforts are being made to stabilize the situation.
しかるに、この半導体スタック装置を動作させると、半
導体素子１により、水冷フィン２．３の管には直流電圧
が印加される。このとき、上下の水冷フィン２．３を連
続して流れる、例えば水道水等の冷却流体を介して下、
下水冷フィン２．３間（二電位差が発生し、これＣ二よ
り一方の水冷フィン２の金属がイオン化して他方の水冷
フィン３へ移動するいわゆるメッキ現象が現われる。特
に水冷フィン２の先端にあるホースニップル４のイオン
化が著しく現われ、極端な場合には、数年でホースニッ
プル４が溶解し、ゴムホース１４の接続が不可能になり
、水漏れ等が発生し、ひいては半導体スタック装置の短
絡事故につながる場合がある。However, when this semiconductor stack device is operated, a DC voltage is applied by the semiconductor element 1 to the tubes of the water cooling fins 2.3. At this time, the lower water cooling fins 2.3 continuously flow through the cooling fluid such as tap water.
A potential difference occurs between the sewage cooling fins 2 and 3, and a so-called plating phenomenon occurs in which the metal of one of the water cooling fins 2 is ionized and moves to the other water cooling fin 3.Especially at the tip of the water cooling fin 2. Ionization of a certain hose nipple 4 may occur significantly, and in extreme cases, the hose nipple 4 may melt in a few years, making it impossible to connect the rubber hose 14, causing water leakage, and even short-circuit accidents in semiconductor stack equipment. It may lead to
また、この種の現象の発生を防止するためには冷却流体
に比抵抗の大きい純水を使用せねばならず、この場合該
純水の確保に多大の労力がかかることとなった。Further, in order to prevent the occurrence of this type of phenomenon, it is necessary to use pure water having a high specific resistance as the cooling fluid, and in this case, it takes a great deal of effort to secure the pure water.
本発明は上記のような問題点を解消するためになされた
もので、冷却流体に一般市水を使用できる高信頼性の半
導体スタック装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a highly reliable semiconductor stack device that can use ordinary city water as a cooling fluid.
この発明（二係る半導体スタック装置は水冷フィンの導
電部側面に外接する流路な電気絶縁体で構成したもので
ある。The semiconductor stack device according to the second aspect of the present invention is constructed of an electrical insulator in the form of a flow path circumscribing the side surface of a conductive portion of a water cooling fin.
この発明においては、水冷フィンの導電部と水流部を電
気的に絶縁したから、上、下の水冷フィン間には、冷却
流体を介して電位差が発生せず、よって水冷フィンやそ
のホースニップル部での溶解が起こりえないことになり
、その結果、水漏れやそれに起因する短絡事故がおこら
なくなる。In this invention, since the conductive part of the water cooling fin and the water flow part are electrically insulated, no potential difference is generated between the upper and lower water cooling fins via the cooling fluid, and therefore the water cooling fin and its hose nipple are electrically insulated. As a result, water leakage and short circuit accidents caused by it will not occur.
以下、この発明に係る半導体スタック装置の一実施例を
第１図ないし第２図を参照して詳細に説明する。Hereinafter, one embodiment of a semiconductor stack device according to the present invention will be described in detail with reference to FIGS. 1 and 2.
第１図はこの実施例の半導体スタック装置の概要を示す
全体構成図であり、また第２図（ａｌ（ｂｌは、この半
導体スタック装置に使用した水冷フィンの構成図である
。これらの図において、ｖＪＳ図と同一符号は同一また
は相当部分を示すものであり説明は省略する。１５は水
冷フィン（２１の水流部となる絶縁管であり、例えばエ
ポキシ樹脂からなるプラスチックで構成されてい。１５
は水冷フィン２の導電部となる水冷ブロックであり、鋼
材が用いられている。絶縁管１５と水冷ブロック２との
接合は、熱伝導性の良い接着剤によって行なわれている
。FIG. 1 is an overall configuration diagram showing an outline of the semiconductor stack device of this embodiment, and FIG. 2 (al (bl) is a configuration diagram of water cooling fins used in this semiconductor stack device. , vJS The same reference numerals as those in the drawings indicate the same or equivalent parts, and the explanation will be omitted. 15 is an insulating tube that becomes the water flow part of the water cooling fin (21), and is made of plastic made of epoxy resin, for example.
is a water cooling block which becomes a conductive part of the water cooling fin 2, and is made of steel. The insulating tube 15 and the water cooling block 2 are joined using an adhesive having good thermal conductivity.
このようにすれば、絶縁管１５と水冷ブロック２では良
好な熱的接合状態が得られ、半導体スタック装置の熱的
特性に悪影響を及ぼすことはない。In this way, a good thermal bonding state can be obtained between the insulating tube 15 and the water cooling block 2, and the thermal characteristics of the semiconductor stack device will not be adversely affected.
このような水冷フィンを用いた本実施例の組立はその構
成が前記従来のものと全く同様であり説明は省略する。The structure of the assembly of this embodiment using such water cooling fins is completely the same as that of the conventional one, and the explanation thereof will be omitted.
次に作用効果について述べる。Next, we will discuss the effects.
この半導体スタック装置を動作させると、半導体素子１
ｃ二より水冷フィン２．３の間には直流電圧が印加され
るが、該水冷フィン２．３の導電部と水流部とが上記絶
縁管１５により電気的に絶縁されているため、該水冷フ
ィン２．３の間に電位差が発生することはなく、従って
、ホースニップル４．５の溶解による水漏れやそれに起
因する短絡事故を防止でき、その信頼性を向上できる。When this semiconductor stack device is operated, the semiconductor element 1
DC voltage is applied between the water cooling fins 2.3 from c2, but since the conductive part of the water cooling fins 2.3 and the water flow part are electrically insulated by the insulating tube 15, the water cooling No potential difference is generated between the fins 2.3, and therefore water leakage due to dissolution of the hose nipple 4.5 and short circuit accidents caused by this can be prevented, and its reliability can be improved.
また冷却流体に一般市水を使用することも可能になる。It also becomes possible to use general city water as the cooling fluid.
以上のように、この発明によれば、半導体素子の水冷フ
ィンの導電部と水流部を絶縁管（二より電気的に絶縁し
たので、ホースニップルの溶解による水漏れや、それに
起因する短絡事故がおこることはなくなり、信頼度の高
い半導体スタック装置を提供することができる。また、
冷却流体に一般市水を使用することができる効果もある
。As described above, according to the present invention, the conductive part and the water flow part of the water cooling fin of the semiconductor element are electrically insulated by the insulating tube (two tubes), thereby preventing water leakage due to melting of the hose nipple and short circuit accidents caused by this. This will no longer occur, and a highly reliable semiconductor stack device can be provided.
Another advantage is that municipal water can be used as the cooling fluid.
第１図はこの発明の一実施例による半導体スタック装置
の部分断面構成図、第２図（ａ）、（ｂ）はそれぞれ上
記実施例の水冷フィンの平面図及び正面半断面図、第３
図は従来の半導体装置の部分断面構成図である。
■・・・半導体素子、２．３・・・水冷フィン、４．５
・・・ホースニップル、６．７・・・外部接続端子、８
゜９・・・絶縁座、１０．１１・・・押え板、１２・・
・締付ボルト、１３・・・ナツト、１４・・・ゴムホー
ス、１５・・・絶縁管、１６・・・水冷ブロック。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a partial cross-sectional configuration diagram of a semiconductor stack device according to an embodiment of the present invention, FIGS.
The figure is a partial cross-sectional configuration diagram of a conventional semiconductor device. ■...Semiconductor element, 2.3...Water cooling fin, 4.5
...Hose nipple, 6.7...External connection terminal, 8
゜9... Insulation seat, 10.11... Holding plate, 12...
- Tightening bolt, 13... Nut, 14... Rubber hose, 15... Insulating tube, 16... Water cooling block. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
素子の外部電極を兼ねる水冷フィンを備えたものにおい
て、上部水冷フィンは上記外部電極として作用する導電
部と、該導電部側面に外接して設けられ、該導電部と絶
縁された冷却体流路とからなることを特徴とする半導体
スタック装置。In a device including a water cooling fin that also serves as an external electrode of an upper semiconductor element that is provided in pressurized contact with both sides of a semiconductor element, the upper water cooling fin has a conductive part that acts as the external electrode, and a conductive part that is in circumscribed contact with the side surface of the conductive part. What is claimed is: 1. A semiconductor stack device comprising: a cooling body channel provided in a conductive section and insulated from the conductive section;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23266885A JPS6292348A (en) | 1985-10-17 | 1985-10-17 | Semiconductor stacker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23266885A JPS6292348A (en) | 1985-10-17 | 1985-10-17 | Semiconductor stacker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292348A true JPS6292348A (en) | 1987-04-27 |
Family
ID=16942920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23266885A Pending JPS6292348A (en) | 1985-10-17 | 1985-10-17 | Semiconductor stacker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292348A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4965658A (en) * | 1988-12-29 | 1990-10-23 | York International Corporation | System for mounting and cooling power semiconductor devices |
-
1985
- 1985-10-17 JP JP23266885A patent/JPS6292348A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4965658A (en) * | 1988-12-29 | 1990-10-23 | York International Corporation | System for mounting and cooling power semiconductor devices |
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