JPS62287637A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS62287637A
JPS62287637A JP13035186A JP13035186A JPS62287637A JP S62287637 A JPS62287637 A JP S62287637A JP 13035186 A JP13035186 A JP 13035186A JP 13035186 A JP13035186 A JP 13035186A JP S62287637 A JPS62287637 A JP S62287637A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
circuit
test mode
pad
commanding
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13035186A
Inventor
Tadashi Kamata
Seiichiro Otake
Original Assignee
Nippon Denso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To enable a semiconductor wafer to be screened as it is by means of providing an input pad for commanding test mode setting.
CONSTITUTION: A power supply 14 is connected to a power supply pad 11 by mounting a semiconductor wafer 12 on an electrode plate 13. When a pad 15 for commanding test mode setting is impressed with a negative voltage using a jig 16, a transistor 171 on a test mode throwing circuit 17 is turned on. Then, the level of an output signal line 172 from said circuit 17 is lowered to set up a burn-in mode; an input.output processing circuit 19 is actuated; a clock signal is transmitted by an oscillating circuit 21 to be inputted in an inner circuit (a). Thus, respective clips are screened before they are packaged.
COPYRIGHT: (C)1987,JPO&Japio
JP13035186A 1986-06-06 1986-06-06 Semiconductor integrated circuit device Pending JPS62287637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13035186A JPS62287637A (en) 1986-06-06 1986-06-06 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13035186A JPS62287637A (en) 1986-06-06 1986-06-06 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS62287637A true true JPS62287637A (en) 1987-12-14

Family

ID=15032314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13035186A Pending JPS62287637A (en) 1986-06-06 1986-06-06 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS62287637A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358953A (en) * 1986-08-29 1988-03-14 Fujitsu Ltd Integrated circuit
US5219765A (en) * 1990-09-12 1993-06-15 Hitachi, Ltd. Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358953A (en) * 1986-08-29 1988-03-14 Fujitsu Ltd Integrated circuit
US5219765A (en) * 1990-09-12 1993-06-15 Hitachi, Ltd. Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process

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