JPS62286215A - Manufacture of electronic parts assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a method of manufacturing an electronic component assembly, which is an assembly of resistor chips or capacitor chips.

2. Prior Art An electronic component mounting machine for mounting electronic components such as resistor chips onto a substrate constituting an electronic circuit was developed using the
As shown in Japanese Patent No. 318 and Japanese Utility Model Publication No. 57-46637, a component supply method using an electronic component assembly has been adopted.

By the way, as shown in FIG. 22, a conventional electronic component assembly consists of an electronic component C stored in a component housing section of tape a, which is set in a component supply device e to feed tape a one frame at a time. In this way, the electronic component C is supplied to the component mounting section.

One type of electronic component C is housed in one electronic component assembly, and the resistance value, capacitance value, etc. of the electronic component C are standardized.

In manufacturing the electronic component assembly, standard chips (electronic components) C, which are mass-produced by ordinary printing methods, lamination methods, etc., are accommodated in the component storage section of tape a, and top tape d, etc. It was necessary to prevent the electronic component C from coming off by using

Problems to be Solved by the Invention The above-mentioned conventional tape-type electronic component assembly and its manufacturing method have the following problems.

■ Since only one type of electronic component can be accommodated in one electronic component assembly, an electronic component mounting machine that must mount multiple types of electronic components must accommodate at least the number of electronic component assemblies corresponding to the type. In addition, a component supply device must be used for each electronic component assembly. Therefore, the space of the component supply section in the electronic component mounting machine becomes large, which is disadvantageous to increasing the speed of component mounting, and it is necessary to provide a large number of component supply devices, which increases the equipment cost.

■ Standard chips are used as electronic components, which imposes restrictions on electronic circuit design and makes circuit design difficult. Further, it may not be possible to use a device having a resistance value and a capacitance value as designed in the circuit.

■ Tape-type electronic component assemblies have tapes, top tapes, etc. that are no longer needed after the electronic components are supplied.
The cost of materials and work for accommodating electronic components is required, leading to increased costs. Furthermore, the cost of electronic components themselves is increasing due to quality control and distribution costs. ■ When changing the type of electronic circuit board in an electronic component mounting machine, the tape-type electronic component assembly must be replaced, but this work is complicated and time consuming.

(2) The work of storing microelectronic components on tape is complicated, and it is difficult to take out microelectronic components from the tape during the pick-up operation during component mounting, so there is a problem in converting electronic components into microchips. For example 1. On+x
For the reasons mentioned above, it is difficult to use a microchip of 0.5 Ill in size for a tape-type electronic component assembly.

(2) In tape-type electronic component assemblies, static electricity is generated due to Y friction, and for example, electronic components may be attracted to the top tape, causing trouble in component mounting work. Additionally, paper fibers from the tape adhere to electronic components as fluff.

Means for Solving the Problems It is an object of the present invention to provide a method for manufacturing an electronic component assembly that can solve the problems of the above-mentioned conventional examples.
In order to achieve this purpose, a screen printing device and/or a thick film circuit drawing device is used to draw the extraction electrode portion and the electronic component functional portion into each section of the insulating plate whose surface is divided into a grid pattern. According to the method of the present invention, a lattice is formed on the surface of an insulating plate. An electronic component functional part and an extraction electrode part having a predetermined resistance value or a predetermined capacitance value are formed on each divided part divided into shapes using a screen printing device and/or a thick film circuit drawing device. Therefore, it is possible to obtain an electronic component assembly in which electronic components corresponding to each section are configured on one insulating plate.

These electronic components have a resistance value or a capacitance value set corresponding to the position of each section (hereinafter referred to as an address on the insulating plate).

The electronic component assembly is then placed in a component supply section of an electronic component mounting machine, divided and separated into sections by an appropriate method, and then mounted onto a substrate constituting an electronic circuit. At this time, each address of the electronic component assembly can be given to the electronic component mounting machine as data, and based on this, smooth component mounting work can be performed.

Therefore, according to the method of the present invention, it is possible to provide an electronic component assembly in which many types of electronic components having different resistance values or capacitance values are assembled on one insulating plate, so that the electronic components The space of the component supply section in the mounting machine can be significantly reduced, saving space, and it is advantageous for speeding up the component mounting work. Moreover, since the component supply device attached to each tape-type electronic component assembly as in the conventional example is not required, the equipment cost of the electronic component mounting machine can be reduced.

In addition, since each electronic component functional section is formed by film formation using a screen printing device or a thick film circuit drawing device, electronic components with resistance and capacitance values that match the circuit design of the board are placed in each section on the surface of the insulating substrate. This makes it possible to eliminate the need for adjustment work such as semi-fixed volume adjustment, which is required in conventional electronic components. Further, circuit design becomes easier because it becomes possible to use resistance values and capacitance values of any value.

Additionally, attached parts such as tape that were required in tape-type electronic component assemblies are no longer required, and quality control can be performed on the entire electronic component assembly, resulting in a significant reduction in the manufacturing cost of electronic component assemblies. be able to.

Furthermore, the electronic component assembly obtained by the method of the present invention can be replaced extremely easily when changing the type of electronic circuit board in an electronic component mounting machine.

Furthermore, according to the method of the present invention, each electronic component is directly formed on the insulating plate, so there is no need for the tape storage work required in the conventional example, and there is no need to take out the electronic components from the component storage section of the tape when mounting the components. As a result, it is advantageous to miniaturize electronic components, for example, 1.0 mm x 0.5 mm.
ml of electronic components.

Furthermore, since the method of the present invention manufactures electronic component assemblies without using tape, it is possible to prevent troubles caused by static electricity and paper fiber fuzz.

Embodiment FIG. 1 shows the first method of manufacturing an electronic component assembly according to the present invention.
An example is shown. FIGS. 7 and 8 show an electronic component assembly obtained by this method.

In FIGS. 7 and 8, reference numeral 1 denotes an insulating plate made of alumina ceramics, the surface of which is divided by grooves 2 in a grid pattern. For example 100 nr x 10
The insulating plate 1 of 0 sn is divided by vertical V grooves 2 at 1.0 mm intervals, and the horizontal ■ grooves 2 are divided by Q, 5 mm intervals, and 1.0 H x 0.5 um divided sections 3 are divided into 2
We are trying to make 10,000 of them.

A pair of lead-out electrode parts 4 made of a conductive paste film are formed on each partition part 3 along both short sides thereof. A resistor part 5 electrically connected between a pair of lead-out electrode parts 4 is formed on each partition part 3 using a resistor paste film. The extraction electrode section 4 on each section 3 is formed of a common electrode, but the resistance section 5 on each section 3 is formed to have a resistance value set at each address. . Reference numeral 15 denotes a trimming groove that is laser-processed to make the resistance value exactly match the set value.

Through holes 7 are formed at equal intervals on the V7 thin film 2 in the vertical direction, and these through holes 7 are electrically connected to the extraction electrode portion 4 of each partition portion 3.

The divided section 3 of each address has a resistor section 5 having a resistance value corresponding to the respective address and its lead-out electrode section 4. Therefore, when divided along the groove 2, each becomes an independent resistor. The chip (electronic component) A becomes a chip (electronic component) A, and in the case of this embodiment, as shown in FIG. . These electronic components A are sequentially arranged on the insulating plate 1 in the order in which the electronic components were manufactured. That is, when addresses are attached as shown in Figure 10,
1.2, ---------, electronic components A for one board are sequentially arranged in the order in which the components are manufactured,
Electronic components A of exactly the same combination are n+1, r1+2,
--・, 2n address, 2n+1.2n+2, -1,
It is located at address 3n, .

Next, a method for manufacturing the above-mentioned electronic component assembly will be explained.

As shown in FIG. 11, the surface of the insulating plate 1 made of alumina ceramics has a VV formed by processing during or after molding.
A large number of grooves 2 are formed vertically and horizontally, and a large number of through-hole holes 6 are formed.

Next, the insulating plate 1 is carried into a film forming line shown in FIG. In this line, a position reading device 10, a screen printing device 20, a drying device 30, a baking device 40, a thick film circuit drawing device 50, a drying device 60, a baking bag τ 70, and a trimming device 80 are arranged in the order of steps.

The position reading device 10 is equipped with an image sensor 11 as shown in FIG.
The VWi 2 or the through-hole hole 6 on the surface of the section 3 is read to obtain positional data regarding the vertical and horizontal dimensions and arrangement position of each section 3 and the reference position of the insulating plate 1.

In the screen printing apparatus 20, the insulating plate 1 is centered at a reference position based on the position data. In this device 20, the conductor paste 4a is printed along the short side of each partition 3 to form the extraction electrode part 4, and at the same time, the conductor paste 4a is vacuum-sucked into the through-hole hole 6 to form the through-hole 7. is formed. FIG. 3 shows an example of this device 20. A vacuum for forming a film of the extraction electrode portion 4 along the vertical V-groove 2 is formed on the screen 21, and the conductor paste 4a is applied with a squeegee 2.
2 on the insulating plate 1. Further, vacuum pressure is applied to the suction chamber 23, and the conductive paste 4a is inserted into the through-hole hole 6.
Through holes 7 are formed by adhering to the .

The extraction electrode portion 4 and the through hole 7 can also be formed using a thick film circuit drawing device 29 as shown in FIG.

The drying device 30 is configured using a series drying furnace that irradiates far infrared rays or near infrared rays, and dries the extraction electrode portion 4 and the through hole 7 by passing it through the insulating plate 1.

Like the drying device 30, the baking device 40 is configured using a continuous baking furnace that irradiates far infrared rays, etc., and burns the extraction electrode portion 4 and the through hole 7 by passing it through the insulating plate 1. This baking device 40 is not essential, and after drying the insulating plate 1, the process may proceed to the next thick film circuit drawing step. In this case, the firing is performed in the subsequent firing device 70.

In the thick film circuit drawing apparatus 50, the insulating plate 1 is set at a reference position based on the position data. Also, this device 50
The resistance value for each address is given as data. Therefore, when the nozzle 41 for drawing is placed in the divided section 3 of the address based on the position data, the resistance value of the resistor section 5 to be drawn at the same time is also given by the resistance value data. Resistance part 5
The resistance value ranges over a wide range, for example, from 10Ω to IMΩ, but it can be adjusted depending on the type of resistive paste 5a, the thickness of the thick film, and the width. In the apparatus 50 of this embodiment, as shown in FIG. 4, a multi-head type nozzle 41 is used, and these can be switched for use. Each nozzle 41 discharges resistance paste 5a having different resistance characteristics. Then, as shown in FIG. 5, using the device 50, a film of resistance paste 5a is formed on each section 3 so as to connect both lead-out electrode sections 4, thereby forming a resistance section 5.

Insulating plate 1 on which resistor base) 5a is formed as a film as described above.
is dried in the drying device 60 and then in the baking device 7
0, the resistive portion 5 is fired.

The trimming device 80 performs laser trimming of the resistor section 5 using a laser beam 61, as shown in FIG.

Resistance value data corresponding to each address is given to this device 80, and based on this data, the resistor portion 5 having an extremely accurate resistance value can be formed. Moreover, it is very advantageous in that the resistor section 5 can be formed to have any resistance value required by the electronic circuit. This trimming device 8
0 also has a measurement function that accurately detects the resistance value of the resistance section 5 at each address, so there is no need to measure the resistance value using another means.

As described above, the position reading process by the position reading device 10,
Extraction electrode part forming process by screen printing device 20 (
through-hole formation step), an extraction electrode part drying and baking process using the drying device 30 and the baking device 40, a resistor portion forming process using the thick film circuit drawing device 50, a resistor portion drying and baking process using the drying device 60 and the baking device 70, and Through the resistor trimming step using the trimming device 80, an electronic component assembly as shown in FIG. 7 can be obtained, and each of the above steps can be performed rationally and efficiently in conjunction with electronic circuit design. . In other words, once the electronic circuit design for the resistor chip (electronic component) to be mounted on the electronic circuit board of the model is determined, the design data (for example, CA
D data), an insulating plate 1 with partitions 3 of a size suitable for this is manufactured, and data obtained by adding address information to the design data is printed on a screen printing device 20.
．． By providing the information to the thick film circuit drawing device 50, the trimming device 80, etc., and adding the position information from the position reading device 10, it is possible to produce an electronic component assembly conforming to the electronic circuit with high efficiency.

Next, how to use the electronic component assembly will be explained.

As shown in FIG. 12, the electronic component assembly is divided into sections 3 along the grooves 2 using a dividing knife 90. Next, as shown in FIG. 13, the divided electronic component assemblies are adhered onto an expansion sheet 91, and by expanding this, the distance between each divided body (resistance chip) is increased. The electronic component assembly separated into such a state is set together with the expand sheet 91 in the component supply section of the electronic component mounting machine, and is mounted there. Each divided body (resistance chip) A is sequentially attached to a substrate constituting an electronic circuit.

FIG. 14 shows an electronic component assembly manufactured according to a second embodiment of the present invention. This electronic component assembly has lead-out electrode portions 4 formed on each corresponding partition portion 3 on both sides of the electronic component assembly.
are electrically connected by through holes 7, and flow resistance chips B are assembled as shown in FIG. The resistance portion 5 is formed only on one surface of the insulating plate 1.

In this second embodiment, the partitions 3 are arranged such that those having the same resistance value are placed in the vertical direction, and are sequentially arranged in the electronic component assembly in the horizontal direction. That is, in FIG. 16, addresses (1, 1), (12)
, . . . (1, m) have the same resistance value, and similarly address (n, l), (n, 2) , --
--- (n, m) also have the same resistance value. In the electronic component mounting machine, addresses (1,'1), (2,1), ---(n, 1) are sent to the first board.
For the next board, addresses (1, 2), (2, 2), -----(n, 2) are used in order, and the same goes for the next board. is repeated.

The method of manufacturing the electronic component assembly in this second embodiment can be basically the same as that in the first embodiment.

However, there are the following differences. That is, in manufacturing the insulating plate 1, among the partition lines (in this case, it is an assumed line and does not have the grooves as in the first embodiment),
Only a large number of through-hole holes 6 are formed at equal intervals on each horizontal partition line. This hole 6 is located at the center of the short side of each partition 3. Using this hole 6, the position reading device 10 can obtain the position data of the insulation mechanic.

Further, the extraction electrode portions 4 are formed on both sides of the insulating plate 1 by the screen printing device 20, and these extraction electrode portions 4 are formed on both sides of the insulating plate 1.
are electrically connected through the through hole 7.

The electronic component assembly obtained as described above is set in the component supply section of the electronic component mounting machine, and is divided into each section 3 using a dividing means such as a diamond grindstone or a cutter using a laser beam. FIG. 17 shows an electronic component assembly manufactured according to a third embodiment of the present invention, which is mounted on a board constituting an electronic circuit. The third embodiment is similar to the first embodiment except that no through holes are formed. When the electronic component assembly is divided, it becomes as shown in FIG. 18.
FIG. 19, in which C is obtained, shows that the electronic component assembly is printed on screen printing equipment 110 and 140 without using a thick film circuit drawing equipment.
This figure shows a fourth embodiment in which the main manufacturing process is as follows.

Forming the extraction electrode portion 4 into a film using the position reading device 100, screen printing device 110, drying device 120, and baking device 130 is the same as in the first embodiment.

Regarding the formation of the resistive portion 5, it is necessary to form a film having a set resistance value for each address of the insulating plate 1. This resistance value can be selected within a small range by selecting various widths of the thick film of the screen-printed resistive paste 5a, and this can be accommodated by the screen pattern. On the other hand, in order to vary the resistance value over a wide range, it is necessary to change the type of resistor paste 5a, and to accommodate this, screen printing must be performed multiple times. For this reason, as shown in FIG.
The film formation is repeated N times (for example, 3 times). still,
As a final step, firing is performed using a firing device 160 and trimming is performed using a trimming device 170.

Although the above explanation relates to a method for manufacturing a resistor chip assembly, a capacitor chip assembly (IT electronic component assembly) can be manufactured in the same manner.

FIG. 20 shows a cross-sectional view of a capacitor chip assembly obtained by the manufacturing method of the fifth embodiment shown in FIG. 21. A capacitor portion 8 having a predetermined capacitance value and lead-out electrode portions 9a and 9b are formed in each partition portion 3 of the insulating plate 1 as a film. The capacitor section 8 consists of counter electrode sections 8a and 8c formed with a conductive paste and a dielectric section 8b formed with a dielectric paste, and the extraction electrode sections 9a and 9b are integrated with the counter electrode sections 8a and 8c. is formed.

The capacitance value of each section 3 is a value set separately, but this is the value for the counter electrode parts 8a, 8C and the dielectric part 8b.
This can be done by changing the shape (mainly the width) and the type of dielectric paste.

FIG. 21 shows the manufacturing process. According to this manufacturing method, first, the position of the insulating plate 1 is read by the position reading device 200, and then the thick film circuit drawing device 210 and the drying device 220 are used.
A first electrode portion (the counter electrode portion 8a and the extraction electrode portion 9a are integrated) is formed into a film using a baking device 230 using a conductor paste. Next, thick film circuit drawing device 24
0. Using a drying device 250 and a baking device 260, a dielectric portion 8b is formed using a dielectric paste. Finally, a thick film circuit drawing device 270, a drying device 280, and a baking device 290
The second electrode part (counter electrode part 8
b and the extraction electrode portion 9b are integrated. ) After forming a film, laser trimming is performed by a trimming device 300 to obtain the electronic component assembly (capacitor chip assembly).

Note that this electronic component assembly can also be obtained by a manufacturing method that mainly uses a screen printing device.

The present invention can be configured in various ways other than those shown in the above embodiments.

For example, it is possible to manufacture an electronic component assembly in which the electronic component function section 5.8 and the extraction electrode sections 4.9a and 9b are formed as films in corresponding compartments on both sides of the insulating plate l. Further, the arrangement of each section is not limited to that shown in the above embodiment.

Effects of the Invention According to the present invention, it is possible to assemble electronic components in a high density, contributing to space saving and speeding up of the electronic component mounting machine, and making it possible to adapt to the circuit design of the board constituting the electronic circuit. Advantageous electronic component assemblies can be produced.

Further, according to the present invention, it is possible to manufacture an electronic component assembly that is advantageous for miniaturization at low cost.

Furthermore, it is possible to prevent the generation of static electricity and the harmful effects of fiber fluff in conventional tape-type electronic component assemblies, and to manufacture electronic component assemblies that can be easily replaced using an electronic component mounting machine.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing the manufacturing process of the first embodiment of the present invention, FIG. 2 is a perspective view showing the operation of the position reading device, and FIG.
The figure is a cross-sectional view showing work with a screen printing device, FIG. 4 is a perspective view showing work with a thick film circuit drawing device, FIG. 5 is a cross-sectional view thereof, and FIG. 6 is a perspective view showing work with a trimming device. 7 is a perspective view of an electronic component assembly obtained by the method of the first embodiment of the present invention, FIG. 8 is an enlarged perspective view of a portion thereof, and FIG. 9 is a perspective view of the electronic component assembly obtained by the method of the first embodiment of the present invention. ), FIG. 10 is a plan view conceptually showing the arrangement of each section, FIG. 11 is a plan view of the insulating plate used in the first embodiment, and FIG.
2 and 13 are perspective views showing a method of dividing and separating an electronic component assembly, respectively, FIG. 14 is a perspective view of an electronic component assembly obtained by the method of the second embodiment of the present invention, and FIG. 15 is a cross-sectional view showing the divided body (electronic components), FIG. 16 is a plan view conceptually showing the arrangement of each section, and FIG. 17 is an electronic component assembly obtained by the method of the third embodiment of the present invention. FIG. 18 is a perspective view showing the divided body (electronic components), FIG. 19 is a block diagram showing the manufacturing process of the fourth embodiment of the present invention, and FIG. 20 is a fifth embodiment of the present invention. FIG. 21 is a block diagram showing the manufacturing process of the fifth embodiment, and FIG. 22 is a sectional view of a conventional electronic component assembly. i-・--1---------------
...---1111---Insulating plate 3-1------
−−−−−−・−・−・−・−・・−・−・−・−
...--Divided portions 4.9a, 9b--1-----
・−・−・−・−1−−−−・Takeout electrode part 5.8・−
−1−−−−−−−−・−・・−・・・・・・−・−・
−・−Electronic component function department. 20.110.140・・・・・・・・・・・・・・・・・・
1. Screen printing device 29.50.210.240
．． 270・-Thick film circuit drawing device. Agent: Patent attorney Toshio Nakao (1 person) Figure 1 1° Figure 1. -WAtJi

Claims (5)

[Claims] (1) In each compartment of the insulating plate whose surface is divided into a grid pattern,
Using a screen printing device and/or a thick film circuit drawing device, the extraction electrode portion and the electronic component functional portion are formed into a film, and the resistance value or capacitance value of the electronic component functional portion in each section is determined. A method of manufacturing an electronic component assembly, characterized in that each section is set separately. (2) The electronic component assembly according to claim 1, wherein the resistance value or capacitance value of the electronic component functional part in each section is set variously by changing the type of resistance paste or dielectric paste. manufacturing method. (3) The method for manufacturing an electronic component assembly according to claim 1 or 2, wherein the electronic component function section and the extraction electrode section are formed as a film in each compartment on only one side of the insulating plate. (4) Claim 1, in which the electronic component function part and the extraction electrode part are formed as a film in each corresponding compartment on both sides of the insulating plate.
A method for manufacturing an electronic component assembly according to item 1 or 2. (5) Manufacture of an electronic component assembly according to claim 1, 2, 3, or 4, in which through holes electrically connected to the extraction electrode portion are formed on the partition line of each partition. Method.