JPS62279680A - Optical coupling element - Google Patents
Optical coupling elementInfo
- Publication number
- JPS62279680A JPS62279680A JP12520586A JP12520586A JPS62279680A JP S62279680 A JPS62279680 A JP S62279680A JP 12520586 A JP12520586 A JP 12520586A JP 12520586 A JP12520586 A JP 12520586A JP S62279680 A JPS62279680 A JP S62279680A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- optical coupling
- emitting element
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 28
- 230000008878 coupling Effects 0.000 title claims abstract description 26
- 238000010168 coupling process Methods 0.000 title claims abstract description 26
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 238000000465 moulding Methods 0.000 abstract description 11
- 230000005684 electric field Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001553014 Myrsine salicina Species 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〈産業上の利用分野〉
本発明は発光素子及び受光素子が対向配置された光結合
素子に関するもので、特に二重トランヌファモールド溝
造の光結合素子に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention <Industrial Application Field> The present invention relates to an optical coupling element in which a light emitting element and a light receiving element are arranged facing each other, and particularly relates to a double trannufa mold groove structure. The present invention relates to an optical coupling device.
〈発明の概要〉
アインンーターとしての光結合素子いわゆるホトカプラ
は、機器制御の電子化に伴い、需要が伸長している。一
方機器や部品の小型化とりわけ電子部品のチップ部品化
、面実装化に伴いホトカプラも面実装に適した小型、薄
型パッケージのものが要望されつつある。<Summary of the Invention> The demand for optical coupling elements, so-called photocouplers, as inverters is increasing as equipment control becomes electronic. On the other hand, with the miniaturization of devices and components, especially the use of chip components and surface mounting of electronic components, there is a growing demand for photocouplers with small and thin packages suitable for surface mounting.
本発明は、発光素子と受光素子を対向させ、これら素子
を透光性樹脂により光路を形成して結合し、更に外部周
辺を遮光性樹脂により外装モールドしてなる二重トラン
スファモールド構造の光結合素子において、前記透光性
樹脂部表面に、前記発光素子及び受光素子を搭載するリ
ードの取出し＄
方向と直交する溝状凹部を設けた構造として、透光性樹
脂の大畠力間沿面距離の確保、外装モールド時の樹脂流
れの安定化、樹脂量接着の機械的強度の向上を図るもの
である。The present invention provides optical coupling with a double transfer mold structure, in which a light emitting element and a light receiving element are faced to each other, these elements are connected by forming an optical path with a light-transmitting resin, and the outer periphery is externally molded with a light-shielding resin. In the device, a groove-like recess is provided on the surface of the translucent resin portion, which is perpendicular to the direction in which the leads for mounting the light-emitting element and the light-receiving element are taken out. This is aimed at stabilizing the resin flow during exterior molding and improving the mechanical strength of resin adhesion.
〈従来の技術〉
第９図はいわゆる二重トランスファモールド構造の光結
合素子の断面図である。発光素子（発光タイオード）１
と、受光素子２としてホトトランジスタあるいはホトダ
イオードと信号処理回路を集積化した素子を各々リード
３，４に搭載し、それぞれ金線５，５′によシワイヤボ
ンドを行ない発光素子１には応力緩和のためのグリコ−
トロを施した後、透光性樹脂７によりこれら全体を包む
ようにモールドし、さらに外部周辺を遮光性樹脂８で外
装モールドしたものである。<Prior Art> FIG. 9 is a sectional view of an optical coupling element having a so-called double transfer mold structure. Light emitting element (light emitting diode) 1
A phototransistor or a photodiode integrated with a signal processing circuit is mounted as the light-receiving element 2 on the leads 3 and 4, respectively, and wire-bonded with gold wires 5 and 5', respectively, and the light-emitting element 1 is connected to the light-emitting element 1 for stress relaxation. Glyco
After being coated, the whole is molded with a light-transmitting resin 7, and the outer periphery is further molded with a light-shielding resin 8.
なお発光素子１の搭載されるリードヘンダ一部は、プＩ
Ｊ ：２− トロの形状を安定化するため凹形状となっ
ている。Note that a part of the lead hender on which the light emitting element 1 is mounted is
J:2- It has a concave shape to stabilize the shape of the toro.
〈発明が解決しようとする問題点〉
上記従来の構造では、発光素子１及び受光素子２を包む
ように透光性樹脂７で大きくモールドし、光の伝達およ
び入出力間の電気的絶縁を行い、さらにその周囲を遮光
性樹脂で覆って外乱光を遮断している。したがって、絶
縁耐圧を生じうる界面はＡ、Ａ’の箇所となシ、透光性
樹脂７部の入出方間沿面距離を長くして、絶縁耐圧を比
較的大きくできる。<Problems to be Solved by the Invention> In the conventional structure described above, the light-emitting element 1 and the light-receiving element 2 are largely molded with a transparent resin 7 so as to transmit light and electrically insulate between input and output. Furthermore, the surrounding area is covered with a light-shielding resin to block external light. Therefore, the interfaces that can generate a dielectric strength voltage are the locations A and A', and the creepage distance between the entry and exit directions of the transparent resin 7 portion is increased, so that the dielectric strength voltage can be relatively increased.
ところで、光結合素子に要望される特性はｌ）変換効率
が大きいこと。２）入出力間の絶縁耐圧が高いこと。が
主たるものである。光結合素子に対する高性能、高品質
の要望が高まるに従い、さらに変換効率及び絶縁耐圧を
向上することが望まれる。By the way, the characteristics required of an optical coupling device are l) high conversion efficiency; 2) High insulation voltage between input and output. is the main thing. As demands for high performance and high quality for optical coupling devices increase, it is desired to further improve conversion efficiency and dielectric strength.
本発明は樹脂によって二重モールドされてなる光結合素
子において、絶縁耐圧を向上でき、より性能１品質を高
めることができる光結合素子の構造を提供するものであ
る。The present invention provides a structure of an optical coupling element double-molded with resin, which can improve dielectric strength and further improve performance and quality.
〈問題点を解決するための手段〉
本発明は発光素子と受光素子を対向させ、これら素子を
透光性樹脂によシ光路を形成して結合し、さらに、外周
を遮光性樹脂によシ外装モールドしてなる光結合素子に
おいて、前記透光性樹脂部表面に、前記発光素子及び受
光素子を搭載するリード、４也
の取出し方向と直交する溝状凹部を設けた構造とするも
のである。<Means for Solving the Problems> The present invention includes a light-emitting element and a light-receiving element facing each other, these elements being combined with a light-transmitting resin to form a light path, and furthermore, the outer periphery is covered with a light-shielding resin. In the optical coupling device formed by exterior molding, the surface of the light-transmitting resin portion is provided with a groove-like recessed portion perpendicular to the direction in which the lead and the wire for mounting the light-emitting device and the light-receiving device are taken out. .
〈作 用〉
本発明は、上記透光性樹脂部表面に、上記発光素子及び
受光素子を搭載するリードの取出し方向と直交して設け
られる溝状凹部により、透光性樹脂の入出方間沿面距離
をより長く確保できるので、絶縁［耐圧の向上が図れる
。また、この溝状凹部により外装モールド時の樹脂流れ
を容易にし、充填性を高め、透光性樹脂と遮光性樹脂間
の密着強度を機械的に向上し、信頼性を高める。<Function> The present invention provides a groove-like recess provided on the surface of the light-transmitting resin part orthogonally to the direction in which the leads in which the light-emitting element and the light-receiving element are mounted is provided, so that the creepage between the entry and exit directions of the light-transmitting resin is improved. Since a longer distance can be secured, insulation and withstand voltage can be improved. In addition, the groove-like recesses facilitate resin flow during exterior molding, improve filling performance, mechanically improve adhesion strength between the light-transmitting resin and the light-shielding resin, and improve reliability.
〈実施例〉
以下、本発明に係る光結合素子の実施例を詳細に説明す
る。<Example> Hereinafter, an example of the optical coupling device according to the present invention will be described in detail.
第１図は本発明に係る光結合素子の一実施例の断面図で
ある。FIG. 1 is a sectional view of one embodiment of the optical coupling device according to the present invention.
発光素子１は落しこみ加工の施されたリード３上に搭載
され、金線５によりワイヤボンドが行なわれた後、応力
緩和のためのグリコ−トロが施される。また、受光素子
２ば、もう一方のり−ド４上に搭載され、金線５′によ
りワイヤボンドが行なわれた後、前記リード３に搭載さ
れた発光素子１と対向させて配置される。この後、前記
画素子１．２を含め覆うように透光性樹脂７によ９１次
モールドされる。このとき、第１図に示す９．９′の如
き、リード３．４の取出し方向と直交した溝状凹部が、
透光性樹脂７のモールド部表面に、複数箇所形成される
。The light emitting element 1 is mounted on a recessed lead 3, and after wire bonding is performed with a gold wire 5, a glycotrode is applied to relieve stress. Further, the light receiving element 2 is mounted on the other lead 4, and after wire bonding is performed with the gold wire 5', it is placed facing the light emitting element 1 mounted on the lead 3. Thereafter, 91-order molding is performed with a light-transmitting resin 7 so as to cover the pixel element 1.2. At this time, a groove-like recess such as 9.9' shown in FIG.
They are formed at a plurality of locations on the surface of the molded portion of the translucent resin 7.
次に、透光性樹脂７による１次モールドが完了した状態
でパリとりがなされ、１次モールドよりひとまわシ大き
なキャビティをもつモールド金型を用いて、遮光性樹脂
８によυさらに外部周辺を覆うように外装モールドされ
る。Next, after the primary molding with the light-transmitting resin 7 has been completed, deburring is performed, and using a molding die with a cavity slightly larger than the primary mold, the light-blocking resin 8 is further molded around the outside. The exterior is molded to cover.
上記のような構成で、前記発光素子１及び受光素子２を
搭載するリードの取出し方向と直交した溝状凹部９，９
′ は、リード３，４間にかかる電界方向に対して直交
するように形成されることとなり、゛よシ沿面距離Ａ、
Ａ’ を長くして、入出方間絶縁耐圧を向上する。また
、外装モールド時にあっては、上記１次モールド、部表
面の溝状凹部によって、外装モールドの樹脂流れの安定
化が図れ、樹脂７．８間の接着強度を機械的に向上でき
る。With the above configuration, the groove-like recesses 9, 9 are perpendicular to the lead extraction direction in which the light emitting element 1 and the light receiving element 2 are mounted.
' is formed perpendicular to the direction of the electric field applied between the leads 3 and 4, and the creepage distance A,
Increase A' to improve insulation voltage between input and output. Furthermore, during the exterior molding, the groove-like recesses on the surface of the primary mold can stabilize the resin flow in the exterior mold, and mechanically improve the adhesive strength between the resins 7 and 8.
次に、本発明に係る光結合素子の他の実施例について説
明する。Next, other embodiments of the optical coupling device according to the present invention will be described.
第２図は本発明に係る光結合素子の他の実施例の断面図
、第３図乃至第５図は同実施例の製造峙の様子を示す斜
視図、第６図は第４図の状、態時においての断面図であ
る。FIG. 2 is a sectional view of another embodiment of the optical coupling device according to the present invention, FIGS. 3 to 5 are perspective views showing the manufacturing process of the same embodiment, and FIG. , is a cross-sectional view in the state.
上述したように同様に、各リード３，４のヘッダ一部１
０．１０’に搭載された発光素子１及び受光素子２を相
対向させて配置し、第４図及び第６図に示すように透光
性樹脂７で一体に１次モールドする。Similarly, as described above, the header part 1 of each lead 3, 4
The light-emitting element 1 and the light-receiving element 2 mounted at 0.10' are placed facing each other and are primary molded together with a translucent resin 7 as shown in FIGS. 4 and 6.
本実施例では、パッケージの小型化、とりわけ薄型化を
図るため、各素子１．２をそれぞれ搭載した各内部リー
ド３，４のヘッダ一部１０．１０’の裏側部分のみ露出
するようにして或いはごく薄い層をなすようにして透光
性樹脂７部を形成している。またこれと同時に、本発明
の特徴となる溝状凹部９，９′が、透光性樹脂７表面の
１次−２次間絶縁上の界面Ｂ、Ｂ’に形成される。なお
溝状凹部９，９′の方向は、第１の実施例と同様に、前
記発光素子ｌ及び受光素子２を搭載するリードの取出し
方向と直交する方向となっている。In this embodiment, in order to make the package smaller, especially thinner, only the back side of the header part 10.10' of each internal lead 3, 4 on which each element 1.2 is mounted is exposed. Seven parts of the translucent resin are formed in a very thin layer. At the same time, groove-like recesses 9 and 9', which are a feature of the present invention, are formed at the interfaces B and B' on the primary-secondary insulation on the surface of the transparent resin 7. Note that the direction of the groove-like recesses 9 and 9' is perpendicular to the direction in which the leads on which the light emitting element 1 and the light receiving element 2 are mounted are taken out, as in the first embodiment.
次いで、遮光性樹脂８により外装モールドする。Next, the exterior is molded with a light-shielding resin 8.
この場合、透光性樹脂７で発光素子１及び受光素子２対
をモールドしたものを、複数個、第５図に示すように一
体に外装モールドし、樹脂硬化後これを切断してリード
フォーミングすれば、第７図に示すような単体の光結合
素子の完成品となシ、或いは、複数個連ねたまま完成品
とすることができる。第８図に２組の発光素子１及び受
光素子２対を一体パッケージとした場合の完成図を示す
。In this case, a plurality of light-emitting elements 1 and two pairs of light-receiving elements are molded with translucent resin 7, and as shown in FIG. For example, a single optical coupling device as shown in FIG. 7 may be used as a completed product, or a plurality of optical coupling devices may be connected together to form a completed product. FIG. 8 shows a completed diagram in which two sets of light emitting elements 1 and two pairs of light receiving elements are integrated into an integrated package.
このように多連一体成形を行なう場合、透光性樹脂７に
よるモールド部表面に設けた溝状凹部９゜９′は樹脂の
ランナーの役割を果たし、成形性を向上できる。When carrying out multiple integral molding in this manner, the groove-shaped recesses 9° 9' formed on the surface of the molded portion made of the transparent resin 7 serve as runners for the resin, thereby improving moldability.
なお、１１は極性判別のだめの溝である。Note that 11 is a groove for determining polarity.
ところで、上記実施例に関連して、二重トランスファモ
ールド構造の光結合素子において、前記透光性樹脂を、
前記発光素子及び受光素子をそれぞれ搭載した各内部リ
ードの裏側部分のみ露出するように或いはごく薄い層を
なすように形成して構成したものを、昭和６１年４月１
８日付特許願（２）「光結合素子」で提案している。こ
の先願のものは、リードヘッダ一部を透光性樹脂部から
露出させることにより小型化、とりわけ薄型化を図って
いるが、溝進上、絶縁破壊を生じうる界面は、第９図の
場合よシ短かくならざるをえない。また外装モールドの
樹脂層を薄くしているため、外装モールド（２次モール
ド）時の樹脂流れに不安定を生じ充填性を損なう恐れが
ある。さらに外部からの機械的衝撃等に対して１次モー
ルドと２次モールド樹脂間の密着強度が第９図のものよ
り劣っている。By the way, in relation to the above embodiment, in an optical coupling element having a double transfer mold structure, the light-transmitting resin is
On April 1, 1988, the light-emitting element and the light-receiving element were mounted so that only the back side of each internal lead was exposed or a very thin layer was formed.
This is proposed in the patent application dated August 8th (2) "Optical coupling device". In this prior application, a part of the lead header is exposed from the translucent resin part to make it smaller, especially thinner. I have no choice but to keep it short. Furthermore, since the resin layer of the exterior mold is made thin, there is a risk that the flow of the resin during the exterior mold (secondary mold) may become unstable and the filling performance may be impaired. Furthermore, the adhesion strength between the primary mold and the secondary mold resin against mechanical shock from the outside is inferior to that shown in FIG. 9.
しかし本実施例によれば、第２図に示す９，９′の如き
溝を透光性樹脂表面の１次・２次間絶縁上の界面Ｂ、Ｂ
’の間に設けた構造として、樹脂界面の距離を長く確保
して絶縁耐圧を向上できる。However, according to this embodiment, grooves such as 9 and 9' shown in FIG.
By providing a structure between the two layers, the distance between the resin interfaces can be increased and the dielectric strength can be improved.
また外装モールドの樹脂８層が薄いにもかかわらず、上
記溝状凹部９．９’によって２次モールド時における樹
脂流れを容易にし、成形性の安定が図れ、この効果によ
り多連構造の小型、薄型の光結合素子が生産可能となり
、また１次モールドと２次モールド炭脂間の密着強度を
機械的に向上させて信頼性に河ら問題のないようにでき
る。In addition, although the eight resin layers of the exterior mold are thin, the groove-like recesses 9 and 9' facilitate resin flow during secondary molding and stabilize moldability. It becomes possible to produce a thin optical coupling device, and the adhesion strength between the primary mold and the secondary mold carbon resin can be mechanically improved so that there are no problems with reliability.
なお、二重トランヌファモールド構造の光結合素子にお
いて、透光性樹脂７及び遮光性樹脂８は、同一ベースの
樹脂を用い、かつ透光性樹脂７にもフィシ等の充填剤を
添加して遮光性樹脂８との熱膨張係数の近似を図ること
は、光結合素子の信頼性を高めるうえでより有効である
。In addition, in the optical coupling device with the double trannufa mold structure, the light-transmitting resin 7 and the light-shielding resin 8 are made of the same base resin, and the light-transmitting resin 7 is also added with a filler such as fisi. It is more effective to approximate the coefficient of thermal expansion with the light-shielding resin 8 by increasing the reliability of the optical coupling element.
〈発明の効果〉
以上述べてきたように本発明によれば、氏めて簡単々構
成を付加するのみで、二重トランスファモールド構造の
光結合素子において、透光性樹脂の入出方間沿面距離を
長く確保して絶縁耐圧の向上が図れるものである。また
外装モールド時における樹脂流れの安定化及び樹脂間の
接着強度の向上が図れるものである。<Effects of the Invention> As described above, according to the present invention, the creepage distance between the input and output directions of the light-transmitting resin can be reduced in an optical coupling element with a double transfer mold structure by simply adding a new configuration. It is possible to improve the dielectric strength by ensuring a long period of time. Furthermore, it is possible to stabilize the resin flow during exterior molding and to improve the adhesive strength between resins.
特に、本発明は、リードヘッダ一部の裏側部分のみ透光
性樹脂部より露出された構造の光結合素子に適用して有
効である。In particular, the present invention is effective when applied to an optical coupling element having a structure in which only the back side of a part of the lead header is exposed from the translucent resin part.
は同実施例の製造時の様子を示す斜視図、第６図は第４
図の状態時における断面図、第７図及び第８図は本発明
による完成品の外観斜視図、第９図 ・は従来例の断面
図である。
１：発光素子、 ２：受光素子、 ３，４：リード、
７：透光性樹脂、 ８：遮光性樹脂、９．９’：溝状
凹部。
代理人 弁理士 杉 山 毅 至（他１名）′４１
図
第２囚6 is a perspective view showing the manufacturing state of the same example, and FIG.
7 and 8 are external perspective views of a finished product according to the present invention, and FIG. 9 is a sectional view of a conventional example. 1: Light emitting element, 2: Light receiving element, 3, 4: Lead,
7: Translucent resin, 8: Light-shielding resin, 9.9': Groove-shaped recess. Agent: Patent attorney Takeshi Sugiyama (and 1 other person) '41
Figure 2nd prisoner
Claims (1)
性樹脂により光路を形成して結合し、さらに外部周辺を
遮光性樹脂により外装モールドしてなる二重トランスフ
ァモールド構造の光結合素子において、前記透光性樹脂
部表面に、前記発光素子及び受光素子を搭載するリード
の取出し方向と直交する方向に溝状凹部を設けたことを
特徴とする光結合素子。1. In an optical coupling element with a double transfer mold structure, in which a light emitting element and a light receiving element are placed facing each other, these elements are connected by forming an optical path with a light-transmitting resin, and the outer periphery is externally molded with a light-shielding resin. . An optical coupling device, characterized in that a groove-like recess is provided on the surface of the light-transmitting resin portion in a direction perpendicular to a direction in which leads are taken out in which the light-emitting element and the light-receiving element are mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12520586A JPS62279680A (en) | 1986-05-28 | 1986-05-28 | Optical coupling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12520586A JPS62279680A (en) | 1986-05-28 | 1986-05-28 | Optical coupling element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62279680A true JPS62279680A (en) | 1987-12-04 |
Family
ID=14904500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12520586A Pending JPS62279680A (en) | 1986-05-28 | 1986-05-28 | Optical coupling element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62279680A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125564A1 (en) * | 2014-02-18 | 2015-08-27 | セイコーインスツル株式会社 | Light sensor |
-
1986
- 1986-05-28 JP JP12520586A patent/JPS62279680A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125564A1 (en) * | 2014-02-18 | 2015-08-27 | セイコーインスツル株式会社 | Light sensor |
| JP2015173254A (en) * | 2014-02-18 | 2015-10-01 | セイコーインスツル株式会社 | Optical sensor device |
| US9773926B2 (en) | 2014-02-18 | 2017-09-26 | Sii Semiconductor Corporation | Optical sensor device |
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