JPS62277759A - Clip terminal - Google Patents
Clip terminalInfo
- Publication number
- JPS62277759A JPS62277759A JP12153086A JP12153086A JPS62277759A JP S62277759 A JPS62277759 A JP S62277759A JP 12153086 A JP12153086 A JP 12153086A JP 12153086 A JP12153086 A JP 12153086A JP S62277759 A JPS62277759 A JP S62277759A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- clip terminal
- adhesives
- section
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 238000010292 electrical insulation Methods 0.000 description 4
- 238000009429 electrical wiring Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、プリント基板やハイブリッドＩＣ等の電気配
線回路基板に使用されるクリップ端子に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a clip terminal used for an electrical wiring circuit board such as a printed circuit board or a hybrid IC.
従来の技術
従来の電気配線回路基板に使用されるクリップ端子は、
第３図に示す様に、その先端部に二叉状に形成された２
つの弾性片である半田付部分４ａと基板固定部４ｂとに
より基板１を挾み込み、そのクリップ端子４０半田付部
分４ａと基板１の端子用導体部２ａを半田３によシ接合
し、電気的接続を行っていた。Conventional technology Clip terminals used in conventional electrical wiring circuit boards are
As shown in Figure 3, there are two forked shapes at the tip.
The board 1 is sandwiched between the soldering part 4a and the board fixing part 4b, which are two elastic pieces, and the soldering part 4a of the clip terminal 40 and the terminal conductor part 2a of the board 1 are joined with the solder 3, and the electrical connection was made.
発明が解決しようとする問題点
ところが、前述のような従来のクリップ端子では第４図
に示す様に、クリップ端子４を矢印の方向に引張ると、
クリップ端子の基板１の裏面に当接し、半田付けされて
いない基板固定部４ｂが基板から離れてしまい、この時
の基板１とクリップ端子４との接続強度は、端子用導体
部２ａの面積が小さいと著しく弱くなり端子強度や振動
試験の信頼性に問題があった。また、第５図に示す如く
、クリップ端子４の基板固定部４ｂと基板１０間に導体
回路部２ｂがあった場合、たとえその導体回路部２ｂの
上に導体保護層５が存在していても、通常のハイブリッ
ドＩＣの場合、この導体保護層５はガラスであり非常に
多くピンホールが存在する為に、クリップ端子４と導体
回路部２ｂの間での電気的絶縁性や耐電圧に問題があっ
た。Problems to be Solved by the Invention However, in the conventional clip terminal as described above, as shown in FIG. 4, when the clip terminal 4 is pulled in the direction of the arrow,
The board fixing part 4b of the clip terminal that is in contact with the back surface of the board 1 and is not soldered away from the board, and the connection strength between the board 1 and the clip terminal 4 at this time is determined by the area of the terminal conductor part 2a. If it is too small, it becomes extremely weak, causing problems with terminal strength and reliability of vibration tests. Further, as shown in FIG. 5, if there is a conductor circuit part 2b between the board fixing part 4b of the clip terminal 4 and the board 10, even if the conductor protection layer 5 is present on the conductor circuit part 2b. In the case of a normal hybrid IC, the conductor protective layer 5 is made of glass and has a large number of pinholes, which causes problems in electrical insulation and withstand voltage between the clip terminal 4 and the conductor circuit section 2b. there were.
本発明はこのような従来の問題点を解消するものであり
、簡単な構成でクリップ端子と基板を強固に接着させ、
しかもクリップ端子と基板の導体回路部の電気的絶縁性
を向上させるクリップ端子を提供するものである。The present invention solves these conventional problems by firmly adhering the clip terminal and the board with a simple structure.
Furthermore, the present invention provides a clip terminal that improves the electrical insulation between the clip terminal and the conductive circuit portion of the substrate.
問題点を解決するだめの手段
本発明のクリップ端子は、クリップ端子の先端に形成さ
れた２つの弾性片の内の基板の裏面に当接する基板固定
用部分に接着剤が半硬化の状態で塗布されているもので
ある。Means for Solving the Problems The clip terminal of the present invention has adhesive applied in a semi-hardened state to the board fixing part of the two elastic pieces formed at the tip of the clip terminal that comes into contact with the back surface of the board. This is what is being done.
作 用
上記構成によれば、クリップ端子を構成する弾性体の基
板固定用部分に接着剤が半硬化の状態で塗布されている
ことにより、接着剤で周辺を汚すことなく基板と強固に
接着し、しかもクリップ端子と基板の導体回路部の電気
的絶縁性をも向上させることができる。Function According to the above configuration, since the adhesive is applied in a semi-hardened state to the board fixing portion of the elastic body constituting the clip terminal, the adhesive can firmly adhere to the board without contaminating the surrounding area. Moreover, the electrical insulation between the clip terminal and the conductive circuit portion of the board can also be improved.
実施例
以下、本発明の一実施例のクリップ端子を図面を参照し
て説明する。本発明のクリップ端子は第２図に示すよう
に、従来と同様な形状に形成されたクリップ端子４の基
板固定周分４ｂにエポキシ系の熱硬化性の接着剤６を塗
布し、指で触ってもベトッキがない状態まで４０〜６ｏ
℃で半硬化を行っている。然る後、第１図に示したよう
に従来と同様に基板１を挾み込み、接着剤６を２００℃
で１分間の条件で硬化させ、さらに、クリップ端子の半
田付部分４ａと基板１の端子用導体部２ａを半田３によ
り接合する。EXAMPLE Hereinafter, a clip terminal according to an example of the present invention will be explained with reference to the drawings. As shown in FIG. 2, the clip terminal of the present invention is made by applying an epoxy thermosetting adhesive 6 to the board fixing circumference 4b of the clip terminal 4 formed in the same shape as the conventional one, and touching it with your finger. 40~6o until there is no stickiness
Semi-curing is performed at ℃. After that, as shown in FIG.
The solder portion 4a of the clip terminal and the terminal conductor portion 2a of the board 1 are then bonded using the solder 3.
このように基板１に取付けられたクリップ端子４を第１
図に示すように矢印の方向に引張シ、端子強度を測定し
た。従来のクリップ端子を使用した場合には０．６７Ｋ
１１／−であったが、本発明のクリップ端子では２．２
に９／−の約３倍の端子強度が得られた。また、アルミ
ナ基板１上に導体回路部２ｂとしてＡ ｑ／Ｐ ｄペー
ストを印刷・焼成し、その上に回路保護層６としてガラ
スペーストを印刷・焼成を行った回路基板にクリップ端
子４を取付け、然る後にクリップ端子４と基板１の導体
回路部節との耐電圧を試料数ｎ＝２０ケ測定したところ
、従来のクリップ端子では最小値で３００ｖ以下のサン
プルが５ケあったが、本発明のクリップ端子では全て５
ｏｏＶ以上の値を示した。The clip terminal 4 attached to the board 1 in this way is
As shown in the figure, the terminal strength was measured by pulling in the direction of the arrow. 0.67K when using conventional clip terminals
11/-, but with the clip terminal of the present invention, it was 2.2
A terminal strength approximately three times higher than that of 9/- was obtained. Further, the clip terminal 4 is attached to the circuit board on which Aq/Pd paste is printed and fired as the conductor circuit part 2b on the alumina substrate 1, and glass paste is printed and fired as the circuit protection layer 6 thereon. After that, when we measured the withstand voltage between the clip terminal 4 and the conductor circuit section of the board 1 on 20 samples (n = 20 samples), there were 5 samples with a minimum value of 300 V or less with the conventional clip terminal, but with the present invention. All clip terminals are 5
It showed a value of ooV or more.
発明の効果
以上のように本発明のクリップ端子は、基板固定用部分
に接着剤を半硬化の状態で塗布するだけの簡単な構成で
、しかもその接着剤は半硬化させである為に接着剤で周
辺を汚すことなく基板との接着強度を著しく向上させ、
かつクリップ端子と基板の導体回路部の電気的絶縁性を
向上させることが出来る実用上きわめて有用なものであ
る。Effects of the Invention As described above, the clip terminal of the present invention has a simple structure that requires applying semi-cured adhesive to the board fixing part, and since the adhesive is semi-cured, significantly improves the adhesive strength with the substrate without contaminating the surrounding area.
Moreover, it is extremely useful in practical terms because it can improve the electrical insulation between the clip terminal and the conductive circuit portion of the board.
第１図は本発明の一実施例のクリップ端子を回路基板に
取付けた状態を示す側断面図、第２図は同クリップ端子
の側面図、第３図、第４図及び第５図はそれぞれ従来の
クリップ端子を回路基板に取付けた状態を示す側断面図
である。
１・・・・・・基板、２ａ、２ｂ・・・・・・導体、３
・・・・・・半田、４、＋ａ、 ４ｂ・・・・・・クリ
ップ端子、６・・・・・・導体保護層、６・・・・・・
接着剤。
３− 半田
第２図−第３図Fig. 1 is a side cross-sectional view showing a state in which a clip terminal according to an embodiment of the present invention is attached to a circuit board, Fig. 2 is a side view of the same clip terminal, and Figs. 3, 4, and 5 are respectively FIG. 2 is a side sectional view showing a state in which a conventional clip terminal is attached to a circuit board. 1...Substrate, 2a, 2b...Conductor, 3
...Solder, 4, +a, 4b...Clip terminal, 6...Conductor protective layer, 6...
glue. 3- Solder Figures 2-3
Claims (1)
た電極パターンに接するように複数の弾性片により前記
回路基板の表裏を弾性的に挾持するように構成され、前
記回路基板の裏面に接する弾性片の少なくとも前記回路
基板との接触面に半硬化の状態の接着剤を塗布したこと
を特徴とするクリップ端子。The plurality of elastic pieces are configured to elastically sandwich the front and back sides of the circuit board such that at least one elastic piece is in contact with an electrode pattern formed on the surface of the circuit board, and the elastic piece is in contact with the back side of the circuit board. A clip terminal characterized in that a semi-cured adhesive is applied to at least the contact surface with the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153086A JPS62277759A (en) | 1986-05-27 | 1986-05-27 | Clip terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153086A JPS62277759A (en) | 1986-05-27 | 1986-05-27 | Clip terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62277759A true JPS62277759A (en) | 1987-12-02 |
Family
ID=14813514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12153086A Pending JPS62277759A (en) | 1986-05-27 | 1986-05-27 | Clip terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62277759A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995010115A1 (en) * | 1993-10-04 | 1995-04-13 | Raychem Corporation | Electrical assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522282A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-05-27 JP JP12153086A patent/JPS62277759A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522282A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995010115A1 (en) * | 1993-10-04 | 1995-04-13 | Raychem Corporation | Electrical assembly |
| EP1263001A2 (en) * | 1993-10-04 | 2002-12-04 | Tyco Electronics Corporation | Electrical assembly |
| EP1263001A3 (en) * | 1993-10-04 | 2004-01-14 | Tyco Electronics Corporation | Electrical assembly |
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