JPS6227723B2 - - Google Patents
Info
- Publication number
- JPS6227723B2 JPS6227723B2 JP56056688A JP5668881A JPS6227723B2 JP S6227723 B2 JPS6227723 B2 JP S6227723B2 JP 56056688 A JP56056688 A JP 56056688A JP 5668881 A JP5668881 A JP 5668881A JP S6227723 B2 JPS6227723 B2 JP S6227723B2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- capacitor element
- external lead
- coating
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 72
- 229920005989 resin Polymers 0.000 claims description 71
- 239000011347 resin Substances 0.000 claims description 71
- 239000005871 repellent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000007654 immersion Methods 0.000 claims description 11
- 239000011247 coating layer Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000009974 thixotropic effect Effects 0.000 claims description 4
- 230000002940 repellent Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 57
- 239000007787 solid Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- VHHHONWQHHHLTI-UHFFFAOYSA-N hexachloroethane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)Cl VHHHONWQHHHLTI-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
本発明は電子部品の外装方法に関し、特に固体
電解コンデンサにおける外部リード部材への樹脂
材の這い上り付着を軽減させることを目的とする
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for packaging electronic components, and in particular, an object of the present invention is to reduce the creeping up and adhesion of a resin material to an external lead member in a solid electrolytic capacitor.
一般にこの種固体電解コンデンサは例えば第１
図に示すように、タンタル、ニオブ、アルミニウ
ムなどのように弁作用を有する金属粉末を円柱状
に加圧成形し焼結してなるコンデンサエレメント
Ａに予め弁作用を有する金属線を陽極リードＢと
して植立し、この陽極リードＢの導出部分に第１
の外部リード部材Ｃを溶接すると共に、第２の外
部リード部材ＤをコンデンサエレメントＡの周面
に形成された電極引出し層Ｅに半田付けし、然る
後、コンデンサエレメントＡを含む主要部分を樹
脂材Ｆにて被覆して構成されている。 Generally, this type of solid electrolytic capacitor is
As shown in the figure, a metal wire having a valve action is attached to a capacitor element A made by press-molding and sintering a metal powder having a valve action, such as tantalum, niobium, or aluminum, into a cylindrical shape and an anode lead B. The first
At the same time, the second external lead member D is soldered to the electrode lead layer E formed on the circumferential surface of the capacitor element A, and then the main part including the capacitor element A is covered with resin. It is covered with material F.
ところで、コンデンサエレメントＡの樹脂材Ｆ
による被覆は例えば第２図に示すように浸漬法に
よつて行われている。即ち、まず、同図ａに示す
ように、コンデンサエレメントＡをチクソトロピ
ツク性を有する樹脂材F′に、それが完全に浸漬
されるようなレベルにまで浸漬する。通常、この
樹脂材F′は粘度が例えば20000CPS以上と高く設
定されている関係で、浸漬直後においては樹脂材
F′のコンデンサエレメントＡに対する濡れ性が
悪く、それの頂面部には樹脂材F′が被着されな
い。従つて、引続いて同図ｂに示すように、コン
デンサエレメントＡの浸漬レベルをさらに深くす
る。すると、コンデンサエレメントＡの全周面は
樹脂材F′によつて完全に被覆される。そして、
コンデンサエレメントＡを引上げ加熱処理するこ
とによつて外装を完了する。 By the way, the resin material F of the capacitor element A
The coating is carried out, for example, by a dipping method as shown in FIG. That is, as shown in FIG. 1A, first, the capacitor element A is immersed in a thixotropic resin material F' to a level such that it is completely immersed. Normally, this resin material F′ has a high viscosity, for example, 20,000 CPS or more, so immediately after immersion, the resin material
The wettability of F' to the capacitor element A is poor, and the resin material F' is not coated on the top surface of the capacitor element A. Therefore, the immersion level of the capacitor element A is subsequently made deeper, as shown in FIG. Then, the entire circumferential surface of the capacitor element A is completely covered with the resin material F'. and,
The packaging is completed by pulling up the capacitor element A and subjecting it to heat treatment.
しかし乍ら、脂脂材F′よりコンデンサエレメ
ントＡを引上げる際に、コンデンサエレメントＡ
の樹脂材F′への浸漬レベルが必要以上に深いこ
とと、第１、第２の外部リード部材Ｃ，Ｄ間に存
在する樹脂材F′が垂れ下ることのために、第
１、第２の外部リード部材Ｃ，Ｄには樹脂材
F′が這い上つたように薄く被着されることにな
り、外観特性が著しく損なわれる。のみならず、
第３図に示すように、プリント板Ｈに実装する際
に、這い上り樹脂材Ｇがプリント板Ｈの裏面にま
で突出してしまうために、第１、第２の外部リー
ド部材Ｃ，Ｄとプリント導体との半田付けの確実
性をも損なわれる。 However, when pulling up capacitor element A from fat material F', capacitor element A
The immersion level in the resin material F' is deeper than necessary, and the resin material F' existing between the first and second external lead members C and D hangs down. The external lead members C and D are made of resin material.
F' is deposited thinly, as if it were creeping up, and the appearance characteristics are significantly impaired. As well,
As shown in FIG. 3, when mounting on the printed board H, the creeping resin material G protrudes to the back surface of the printed board H. The reliability of soldering with conductors is also impaired.
かといつて、第２図ａに示すように、コンデン
サエレメントＡの樹脂材F′への浸漬時間を充分
に長くすれば、樹脂材F′の液面は徐々に上昇
し、ついには図示点線位置まで復帰する。従つ
て、この時点においてコンデンサエレメントＡを
引上げれば、第１、第２の外部リード部材Ｃ，Ｄ
に対する樹脂材F′の這い上りを実用上支障のな
い程度に抑えることができ、上述のプリント板Ｈ
への実装時における問題を完全に解決できるもの
であるが、作業性が著しく低下するという欠点が
あり、未だ実用化されるに至つていない。 On the other hand, as shown in Figure 2a, if the immersion time of the capacitor element A into the resin material F' is made long enough, the liquid level of the resin material F' will gradually rise until it reaches the position indicated by the dotted line in the figure. Return until. Therefore, if the capacitor element A is pulled up at this point, the first and second external lead members C and D
The creeping up of the resin material F' against the printed board H can be suppressed to a level that does not pose a practical problem.
However, it has the disadvantage of significantly reducing workability, and has not yet been put into practical use.
このような問題の解決法とし、電子部品素子の
表面に水をはじくと同様に樹脂材をはじく性質
（以下撥水性と呼ぶ）を有する撥水性樹脂層を外
装に先立つて形成することを特開昭51−85461号
公報や特開昭55−145328号公報が開示する。例え
ば特開昭55−145328号公報には同一方向に延びる
複数の外部リード部材を具えた部品本体を樹脂材
にて浸漬外装するに先立つて、ワツクス、ステア
リン酸、パラフインなどで代表される鎖状炭化水
素もしくは高級脂肪酸を溶解させた塩素系炭化水
素溶液中に部品本体を、外部リード部材が浸漬さ
れるように浸漬することにより、部品本体及び外
部リード部材に鎖状炭化水素もしくは高級脂肪酸
の被膜を形成し、次いで、部品本体をトリクロル
エチレン、トリクロルエタンなどの溶剤に浸漬す
ることにより、不所望部分の被膜を除去するよう
にした電子部品の外装方法が開示されている。 As a solution to these problems, we have developed a method of forming a water-repellent resin layer on the surface of electronic components, which has the property of repelling resin materials in the same way that water is repelled (hereinafter referred to as water repellency), prior to the exterior packaging. This is disclosed in 1985-85461 and JP-A-55-145328. For example, in Japanese Patent Application Laid-Open No. 55-145328, prior to immersing a component body with a plurality of external lead members extending in the same direction in a resin material, a chain-like material such as wax, stearic acid, paraffin, etc. By immersing the component body in a chlorinated hydrocarbon solution in which a hydrocarbon or higher fatty acid is dissolved in such a way that the outer lead member is immersed, a coating of chain hydrocarbon or higher fatty acid is formed on the component body and the outer lead member. A method for packaging an electronic component is disclosed in which the coating is removed from undesired portions by forming a coating and then immersing the component body in a solvent such as trichloroethylene or trichloroethane.
この方法によれば、部品本体の樹脂材への浸漬
レベルを第２図ｂに示すように深くしても、引上
げ状態においては外部リード部材の所望部分には
鎖状炭化水素もしくは高級脂肪酸の被膜が形成さ
れている関係で、樹脂材がはじかれて不所望な這
い上り付着を効果的に抑制することができる。 According to this method, even if the immersion level of the component body into the resin material is deep as shown in FIG. , the resin material is repelled and undesirable creep-up and adhesion can be effectively suppressed.
ところで、この方法を例えば上述の固体電解コ
ンデンサに適用した場合には第１、第２の外部リ
ード部材Ｃ，Ｄへの樹脂材Ｆの這い上り付着を効
果的に抑制することができるものの、樹脂材Ｆの
表面には多数のピンホールが形成され、外観特性
が著しく損なわれるという問題が生ずる。 By the way, when this method is applied to, for example, the solid electrolytic capacitor described above, it is possible to effectively suppress the resin material F from creeping up and adhering to the first and second external lead members C and D. A problem arises in that a large number of pinholes are formed on the surface of the material F, and the appearance characteristics are significantly impaired.
この点について詳述すれば、コンデンサエレメ
ントＡは多孔質に構成されているので、鎖状炭化
水素もしくは高級脂肪酸を溶解させた塩素系炭化
水素溶液に浸漬させると、その溶液はコンデンサ
エレメントＡの深層部における空孔部にまで含浸
される。しかし乍ら、コンデンサエレメントＡの
表層部に含浸された溶液はコンデンサエレメント
Ａを溶剤に短時間浸漬するだけで容易に除去でき
るものの、深層部のものは短時間で容易に除去す
ることはできない。従つて、ピンホールの発生防
止の目的で含浸剤を含浸させても、深層部には残
存する被膜の撥水作用のために充分に含浸させる
ことができない。このために、深層部の空孔部に
包蔵されている空気が樹脂材Ｆの加熱硬化時に熱
膨脹し、樹脂材Ｆを貫通して外部に放出されるこ
とによつて多数のピンホールが形成されるものと
考えられる。 To elaborate on this point, since capacitor element A has a porous structure, when it is immersed in a chlorinated hydrocarbon solution in which chain hydrocarbons or higher fatty acids are dissolved, the solution is absorbed into the deep layer of capacitor element A. Even the pores in the area are impregnated. However, although the solution impregnated in the surface layer of the capacitor element A can be easily removed by simply immersing the capacitor element A in a solvent for a short time, the solution impregnated in the deep layer cannot be easily removed in a short time. Therefore, even if the material is impregnated with an impregnating agent for the purpose of preventing the formation of pinholes, the deep layer cannot be sufficiently impregnated due to the water repellent effect of the remaining coating. For this reason, the air contained in the pores in the deep layer expands thermally when the resin material F is heated and hardened, penetrates the resin material F, and is released to the outside, resulting in the formation of many pinholes. It is considered that
一方、浸漬回数を増加したり、また、その場合
に浸漬する第１の樹脂材の粘度を低くしたりする
ことも特開昭51−107462号公報や特開昭55−
15257号公報に開示され、外部リード部材への樹
脂材の這い上がりを防ぐこととして知られている
ほか、コンデンサエレメントＡを長時間溶剤中に
浸漬して上述する深層部の溶液を除去してピンホ
ール対策とされることも提案される。 On the other hand, it is also possible to increase the number of times of immersion or to lower the viscosity of the first resin material to be immersed.
It is disclosed in Japanese Patent No. 15257, and is known to prevent the resin material from creeping up to the external lead member. In addition, it is possible to immerse the capacitor element A in a solvent for a long time to remove the solution in the deep layer. It is also proposed to be used as a countermeasure for holes.
しかし、こうした方法はそれぞれの期待効果に
反して、作業能率が著しく低下することになり、
量産工程への適用は極めて困難である。 However, contrary to their expected effects, these methods result in a significant decrease in work efficiency.
Application to mass production processes is extremely difficult.
本発明はこのような点に鑑み、外部リード部材
への樹脂材の這い上り付着は勿論のこと、樹脂材
へのピンホールの発生をも効果的に改善できる電
子部品の外装方法を提供するものである。本発明
によれば、外部リードを有する部品本体の外装被
覆処理は、部品本体を低粘度の第１の樹脂材に浸
漬して被覆層を形成する工程、この本体を外部リ
ードを含めて弗素系撥水性部材に浸漬して外部リ
ードの所定部分に弗素系撥水性被膜を形成する工
程およびこの外部リードの被膜形成部分を浸漬レ
ベルにして第２の樹脂材に前記部品本体を含む主
要部分を浸漬して外装被覆する工程を含む電子部
品の外装方法が提示された。 In view of these points, the present invention provides a method for packaging electronic components that can effectively improve not only the creeping up of the resin material onto the external lead member but also the occurrence of pinholes in the resin material. It is. According to the present invention, the exterior coating treatment of a component body having an external lead includes a step of immersing the component body in a first low-viscosity resin material to form a coating layer, and a step of immersing the component body in a first resin material of low viscosity to form a coating layer. A step of forming a fluorine-based water-repellent coating on a predetermined portion of the external lead by immersing it in a water-repellent member, and immersing the main portion including the component body in a second resin material with the coating-forming portion of the external lead at the immersion level. A method for packaging an electronic component, which includes a step of packaging the electronic component with the exterior coating, has been proposed.
以下本発明に係る実施例として固体電解コンデ
ンサへの適用について第４図〜第８図を参照して
説明する。 The application to a solid electrolytic capacitor as an embodiment of the present invention will be described below with reference to FIGS. 4 to 8.
まず、第４図に示すように、弁作用を有する金
属粉末を円注状に加圧成形し焼結してなるコンデ
ンサエレメント（部品本体）１に予め弁作用を有
する金属線を陽極リード２として植立し、この陽
極リード２の導出部分２ａにＬ形に形成された第
１の外部リード部材３を、屈曲部３ａが交叉され
るように溶接する。そして、ストレート状に形成
された第２の外部リード部材４の一端４ａを、コ
ンデンサエレメント１の周面に酸化層、半導体
層、グラフアイト層を介して形成された電極引出
し層５に半田付けする。尚、第１、第２の外部リ
ード部材３，４は同一方向に導出されている。次
に、コンデンサエレメント１を低粘度の第１の樹
脂材に、ほぼコンデンサエレメント１のみが浸漬
されるように浸漬する。そして、引上げ後、加熱
処理することにより、コンデンサエレメント１は
第５図に示すように、第１の樹脂材６にて被覆さ
れる。次に、コンデンサエレメント１を例えば、
四弗化エチレン樹脂、三弗化塩化エチレン樹脂お
よび弗化ビニリデン樹脂などから選択される弗素
系撥水性部材に、第１、第２の外部リード部材
３，４の後述する第２の樹脂材に対する浸漬レベ
ルより深いレベルとなるように浸漬する。そし
て、引上げ後、加熱処理することにより、コンデ
ンサエレメント１の第１の樹脂材６及び第１、第
２の外部リード部材３，４には第６図に示すよう
に、撥水性被膜７が形成される。次に、第７図に
示すように、このコンデンサエレメント１をチク
ソトロピツク性を有する第２の樹脂材８′に、第
１、第２の外部リード部材３，４における撥水性
被膜７の上端が液面より若干突出する程度に充分
に深く浸漬する。すると、コンデンサエレメント
１の全周面には第２の樹脂材８′が短時間で濡れ
るのであるが、第１、第２の外部リード部材３，
４の液面近傍では第２の樹脂材８′がはじいた状
態となる。次に、コンデンサエレメント１を第２
の樹脂材８′より引上げると、第１、第２の外部
リード部材３，４間に存在する第２の樹脂材８′
は垂れ下ると同時に、第１、第２の外部リード部
材３，４に接触している第２の樹脂材８′も同様
に垂れる。然る後、加熱処理することにより、第
８図に示すように、第２の樹脂材による被覆層８
が形成され、外装を完了する。 First, as shown in Fig. 4, a metal wire having a valve action is attached to a capacitor element (component body) 1, which is made by press-molding and sintering metal powder having a valve action into a circular shape, and a metal wire having a valve action is attached to the anode lead 2. The first external lead member 3 formed in an L shape is welded to the lead-out portion 2a of the anode lead 2 so that the bent portions 3a intersect. Then, one end 4a of the second external lead member 4 formed in a straight shape is soldered to the electrode lead layer 5 formed on the circumferential surface of the capacitor element 1 via an oxide layer, a semiconductor layer, and a graphite layer. . Note that the first and second external lead members 3 and 4 are led out in the same direction. Next, the capacitor element 1 is immersed in a first resin material of low viscosity so that substantially only the capacitor element 1 is immersed. Then, after being pulled up, the capacitor element 1 is coated with the first resin material 6 by heat treatment, as shown in FIG. Next, for example, the capacitor element 1 is
A fluorine-based water-repellent member selected from tetrafluoroethylene resin, trifluorochloroethylene resin, vinylidene fluoride resin, etc., and a second resin material to be described later in the first and second external lead members 3 and 4. Immerse to a deeper level than the immersion level. After pulling up, heat treatment is performed to form a water-repellent coating 7 on the first resin material 6 and the first and second external lead members 3 and 4 of the capacitor element 1, as shown in FIG. be done. Next, as shown in FIG. 7, this capacitor element 1 is coated with a second resin material 8' having thixotropic properties so that the upper ends of the water-repellent coatings 7 on the first and second external lead members 3 and 4 are coated with liquid. Immerse it deep enough so that it slightly protrudes from the surface. Then, the second resin material 8' gets wet on the entire circumferential surface of the capacitor element 1 in a short time, but the first and second external lead members 3,
4, the second resin material 8' is in a repelled state. Next, the capacitor element 1 is
When pulled up from the resin material 8', the second resin material 8' existing between the first and second external lead members 3 and 4
At the same time, the second resin material 8', which is in contact with the first and second external lead members 3 and 4, also sag. Thereafter, by heat treatment, as shown in FIG. 8, a coating layer 8 made of the second resin material is formed.
is formed to complete the exterior.
このように第１、第２の外部リード部材３，４
の所望部分には浸漬法によつて撥水性被膜７が形
成されているので、コンデンサエレメント１を第
２の樹脂材８′に浸漬し引上げた際に、第１、第
２の外部リード部材３，４の不所望部分に付着し
た第２の樹脂材８′は第１、第２の外部リード部
材間に存在する第２の樹脂材８′と共に適当量垂
れ下る。このために、第１、第２の外部リード部
材３，４に対する第２の樹脂材８′の這い上り付
着をほぼ解消でき、プリント板への実装の際の、
第１、第２の外部リード部材３，４のプリント導
体に対する半田付け不良を著しく減少できる。 In this way, the first and second external lead members 3, 4
Since the water-repellent coating 7 is formed on desired portions of the capacitor element 1 by the dipping method, when the capacitor element 1 is dipped in the second resin material 8' and pulled up, the first and second external lead members 3 , 4 hangs down by an appropriate amount together with the second resin material 8' existing between the first and second external lead members. Therefore, it is possible to almost eliminate the second resin material 8' from creeping up and adhering to the first and second external lead members 3 and 4, and when mounting it on a printed board,
Failures in soldering of the first and second external lead members 3 and 4 to the printed conductor can be significantly reduced.
又、コンデンサエレメント１には撥水性被膜７
の形成に先立つて、第１の樹脂材６が含浸されて
いるので、コンデンサエレメント１の表層部は勿
論のこと、深層部に包蔵されている空気も第１の
樹脂材６にて置換されている。このために、コン
デンサエレメント１を第２の樹脂材による被覆層
８を形成する際に、コンデンサエレメント１が加
熱されても、包蔵空気が極めて少ないこともあつ
て、それが第２の樹脂材を貫通して外部に放出さ
れることは著しく減少し、従つて、ピンホールの
発生も減少して優れた外観特性を得ることができ
る。 In addition, the capacitor element 1 is coated with a water-repellent coating 7.
Since the first resin material 6 is impregnated prior to the formation of the capacitor element 1, not only the surface layer of the capacitor element 1 but also the air contained in the deep layer is replaced by the first resin material 6. There is. For this reason, even if the capacitor element 1 is heated when forming the coating layer 8 of the second resin material on the capacitor element 1, there may be an extremely small amount of air contained therein, which may cause the second resin material to coat the capacitor element 1. Penetration to the outside is significantly reduced, and therefore the occurrence of pinholes is also reduced, resulting in excellent appearance characteristics.
ここで弗素系化合物から成る撥水性部材は第１
の樹脂材６に対し充分の接着性が得られる関係
で、第２の樹脂材によるコンデンサエレメント１
の被覆操作を能率的に行うことができる上、外装
形態も良好ならしめることができる。 Here, the water-repellent member made of a fluorine-based compound is the first water-repellent member.
The capacitor element 1 made of the second resin material has sufficient adhesion to the resin material 6 of the second resin material.
Not only can the coating operation be performed efficiently, but also the exterior form can be made good.
さらには第１、第２の外部リード部材３，４へ
の撥水性被膜７の形成は弗素系撥水性部材にコン
デンサエレメント１と共に第１、第２の外部リー
ド部材３，４も浸漬することによつて行われてお
り、その上、コンデンサエレメント上の撥水性被
膜７は全く除去することなく、そのまま使用され
る関係で、従来の外装方法に比し、作業性を著し
く改善できる。 Furthermore, the formation of the water-repellent coating 7 on the first and second external lead members 3 and 4 involves immersing the first and second external lead members 3 and 4 together with the capacitor element 1 in a fluorine-based water-repellent member. Moreover, since the water-repellent coating 7 on the capacitor element is used as it is without being removed at all, workability can be significantly improved compared to conventional packaging methods.
次に具体的実施例について説明する。タンタル
粉末を直径が３mm、高さが４mmの円注状に加圧成
形し焼結してなるコンデンサエレメントに予め
0.5φmmのタンタル線（陽極リード）を植立し、
Ｌ形に屈曲された線径が0.5φmmの第１の外部リ
ード部材を陽極リードに、コンデンサエレメント
頂面部より1.5mm離隔するように溶接すると共
に、線径が0.5φmmで、かつストレート状に形成
された第２の外部リード部材を電極引出し層に、
第１の外部リード部材との間隔が５mmとなるよう
に半田付けする。次に、このコンデンサエレメン
トを粘度が500CPSのエポキシ樹脂（第１の樹脂
材）に、コンデンサエレメント頂面部が１mmの深
さで浸漬されるように浸漬し、内部に充分に含浸
させる。そして、引上げ後、加熱処理する。次
に、コンデンサエレメントをポリパーフルオロア
クリレートを離型剤ジクロロテトラクロロエタン
の溶媒に溶解したダイキン(株)より市販の商品名ダ
イフリー（FS−126）の弗素系撥水性部材に、第
１の外部リード部材の屈曲部より５mm離隔した上
方部分が浸漬レベルとなるように浸漬し、引上げ
後、加熱処理して弗素系化合物の撥水性被膜を形
成する。次に、コンデンサエレメントを粘度が
40000CPSでかつチクソトロピツク性を有するエ
ポキシ樹脂（第２の樹脂材）に、第１の外部リー
ド部材の屈曲部より４mm離隔した上方部分が浸漬
レベルとなるように浸漬し、引上げ後、加熱処理
してタンタル固体電解コンデンサを得る。 Next, specific examples will be described. A capacitor element is made by pressure-molding tantalum powder into a circular shape with a diameter of 3 mm and a height of 4 mm and sintering it.
Plant a 0.5φmm tantalum wire (anode lead),
The first external lead member bent into an L shape and having a wire diameter of 0.5φmm is welded to the anode lead at a distance of 1.5mm from the top surface of the capacitor element, and the wire diameter is 0.5φmm and is formed into a straight shape. The second external lead member is attached to the electrode lead layer,
Solder it so that the distance from the first external lead member is 5 mm. Next, this capacitor element is immersed in an epoxy resin (first resin material) having a viscosity of 500 CPS so that the top surface of the capacitor element is immersed to a depth of 1 mm, so that the inside is sufficiently impregnated. After pulling, heat treatment is performed. Next, the capacitor element was coated with a fluorine-based water-repellent material, commercially available from Daikin Corporation under the trade name Daifree (FS-126), in which polyperfluoroacrylate was dissolved in a solvent of dichlorotetrachloroethane as a mold release agent. The lead member is immersed so that the upper part 5 mm apart from the bent part is at the immersion level, and after being pulled up, it is heated and treated to form a water-repellent coating of a fluorine-based compound. Next, the condenser element is
The first external lead member was immersed in an epoxy resin (second resin material) having thixotropic properties at 40,000 CPS so that the upper part 4 mm away from the bent part was at the immersion level, and after being pulled up, it was heated. Obtain a tantalum solid electrolytic capacitor.
このコンデンサにおいて、第２の樹脂材の第
１、第２の外部リード部材への這い上り高さ（第
１、第２の外部リード部材間に存在する樹脂材の
最下位置からの高さ）は平均的に０mm（0.2〜−
0.3mm）であり、プリント板への実装の際のトラ
ブルは全く発生しなかつた。しかし乍ら、撥水性
被膜を形成しない従来例では１〜３mmの這い上り
付着が発生し、半田付け不良が発生した。 In this capacitor, the height of the second resin material rising to the first and second external lead members (height from the lowest position of the resin material existing between the first and second external lead members) is on average 0mm (0.2~-
0.3 mm), and no trouble occurred during mounting on the printed board. However, in the conventional example in which no water-repellent coating was formed, creeping adhesion of 1 to 3 mm occurred, resulting in poor soldering.
又、第２の樹脂材による被覆層には全くピンホ
ールの発生は認められなかつた。これはダイフリ
ーへの浸漬に先立つて、コンデンサエレメントに
第１の樹脂材が含浸されているためと考えられ
る。 Furthermore, no pinholes were observed in the coating layer made of the second resin material. This is considered to be because the capacitor element is impregnated with the first resin material prior to being immersed in the die-free.
又、撥水性被膜をシリコーンオイル並びにステ
アリン酸（高級脂肪酸）にて形成したものについ
ても検討した処、いずれも第１の樹脂材に対する
接着性に乏しく、耐湿性が損なわれる傾向が認め
られた。 Furthermore, we also investigated water-repellent coatings formed from silicone oil and stearic acid (higher fatty acid), and found that both had poor adhesion to the first resin material and tended to have impaired moisture resistance.
尚、本発明において、電子部品は固体電解コン
デンサの他、バリスタ、抵抗、積層セラミツクコ
ンデンサなどにも適用できる。又、第１、第２の
樹脂材はエポキシ樹脂にのみ限定されない。 Incidentally, in the present invention, the electronic components can be applied not only to solid electrolytic capacitors but also to varistors, resistors, laminated ceramic capacitors, and the like. Further, the first and second resin materials are not limited to epoxy resin.
以上のように本発明によれば、簡単な方法によ
つて外部リード部材への樹脂材の這い上り付着を
実用上支障のない程度に抑制できる上、第２の樹
脂材による被覆層へのピンホールの発生をも著し
く減少でき、外観特性を改善できる。 As described above, according to the present invention, it is possible to suppress the creeping up and adhesion of the resin material to the external lead member by a simple method to the extent that there is no practical problem, and the pin to the coating layer made of the second resin material can be suppressed. The occurrence of holes can also be significantly reduced, and the appearance characteristics can be improved.
第１図は従来の固体電解コンデンサの側断面
図、第２図は外装方法を説明するための側断面
図、第３図はプリント板への実装状態を示す側断
面図、第４図〜第８図は本発明方法の説明図であ
つて、第４図はコンデンサエレメントの側断面
図、第５図は第１の樹脂材による被覆層を形成し
た状態を示す側断面図、第６図は撥水性被膜を形
成した状態を示す側断面図、第７図はコンデンサ
エレメントの第２の樹脂材への浸漬状態を示す側
断面図、第８図は外装完了状態を示す側断面図で
ある。
図中、１は部品本体（コンデンサエレメン
ト）、３，４は外部リード部材、６は第１の樹脂
材、７は撥水性被膜、８′は第２の樹脂材、８は
被覆層である。
Fig. 1 is a side sectional view of a conventional solid electrolytic capacitor, Fig. 2 is a side sectional view for explaining the packaging method, Fig. 3 is a side sectional view showing how it is mounted on a printed board, and Figs. FIG. 8 is an explanatory diagram of the method of the present invention, in which FIG. 4 is a side sectional view of a capacitor element, FIG. 5 is a side sectional view showing a state in which a coating layer of the first resin material is formed, and FIG. FIG. 7 is a side sectional view showing the state in which the water-repellent coating is formed, FIG. 7 is a side sectional view showing the state in which the capacitor element is immersed in the second resin material, and FIG. 8 is a side sectional view showing the state in which the exterior is completed. In the figure, 1 is a component body (capacitor element), 3 and 4 are external lead members, 6 is a first resin material, 7 is a water-repellent coating, 8' is a second resin material, and 8 is a coating layer.
Claims (1)
４を具えた部品本体１を約500CPSの低粘度の第
１の樹脂材に浸漬して第１の樹脂材の被覆層６を
形成する工程と、前記部品本体１をその外部リー
ド部材を含めて弗素系撥水性部材に浸漬し外部リ
ード部材の所望部分に撥水性被膜７を形成する工
程と、この外部リード部材の被膜形成部分を浸漬
レベルとして、前記部品本体１をチクソトロピツ
ク性を有する第２の樹脂材８′に浸漬して部品本
体１を含む主要部分に被覆層８で外装する工程と
を含むことを特徴とする電子部品の外装方法。1 a plurality of external lead members 3 extending in the same direction;
A step of immersing the component body 1 including the component body 4 in a first resin material with a low viscosity of about 500 CPS to form a coating layer 6 of the first resin material, A step of immersing the outer lead member in a fluorine-based water repellent member to form a water repellent coating 7 on a desired portion of the outer lead member, and using the coat forming portion of the outer lead member as the immersion level, the component body 1 is soaked in a second layer having thixotropic properties. A method for packaging an electronic component, comprising the step of immersing it in a resin material 8' and covering the main part including the component body 1 with a coating layer 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56056688A JPS57170515A (en) | 1981-04-15 | 1981-04-15 | Method of sheathing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56056688A JPS57170515A (en) | 1981-04-15 | 1981-04-15 | Method of sheathing electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57170515A JPS57170515A (en) | 1982-10-20 |
| JPS6227723B2 true JPS6227723B2 (en) | 1987-06-16 |
Family
ID=13034376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56056688A Granted JPS57170515A (en) | 1981-04-15 | 1981-04-15 | Method of sheathing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57170515A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08339942A (en) * | 1995-06-09 | 1996-12-24 | Nec Kansai Ltd | Electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5185461A (en) * | 1975-01-24 | 1976-07-27 | Nippon Electric Co | DENSHIBUHINNOGAISOHOHO |
| JPS51107462A (en) * | 1975-03-17 | 1976-09-24 | New Nippon Electric Co | Denshibuhinno gaisohoho |
| JPS5515257A (en) * | 1978-07-19 | 1980-02-02 | Nippon Electric Co | Method of sheathing electronic part |
-
1981
- 1981-04-15 JP JP56056688A patent/JPS57170515A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5185461A (en) * | 1975-01-24 | 1976-07-27 | Nippon Electric Co | DENSHIBUHINNOGAISOHOHO |
| JPS51107462A (en) * | 1975-03-17 | 1976-09-24 | New Nippon Electric Co | Denshibuhinno gaisohoho |
| JPS5515257A (en) * | 1978-07-19 | 1980-02-02 | Nippon Electric Co | Method of sheathing electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57170515A (en) | 1982-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5036434A (en) | Chip-type solid electrolytic capacitor and method of manufacturing the same | |
| JPS6227723B2 (en) | ||
| KR20240058163A (en) | Multilayer ceramic capacitor and method for manufacturing same | |
| JPS6251492B2 (en) | ||
| JPS6122452B2 (en) | ||
| JPS6246056B2 (en) | ||
| JPS6132806B2 (en) | ||
| JP3550232B2 (en) | Method of manufacturing tab terminal for electrolytic capacitor | |
| JP2002270468A (en) | Capacitor manufacturing method and capacitor | |
| JPH0729773A (en) | Terminal electrode forming method of chip type electronic part | |
| JPS6135691B2 (en) | ||
| JP3243943B2 (en) | Manufacturing method of ceramic electronic components | |
| JP3502778B2 (en) | Method for manufacturing solid electrolytic capacitor and conductive polymer solid electrolytic capacitor | |
| JPS5834912A (en) | Method of sheathing solid electrolytic condenser | |
| JPS58154224A (en) | Method of producing solid electrolytic condenser | |
| JPS5917968B2 (en) | How to package electronic parts | |
| JP2784124B2 (en) | Liquid insulation coating method for lead wire | |
| JPS6127891B2 (en) | ||
| JPS6220684B2 (en) | ||
| JPS5874031A (en) | Method of producing solid electrolytic condenser | |
| JPH08124786A (en) | Manufacture of ceramic electronic component | |
| JPS626333B2 (en) | ||
| JPS589318A (en) | Method of sheathing electronic part | |
| JPS5871613A (en) | Method of producing solid electrolytic condenser | |
| JPS603769B2 (en) | Manufacturing method of electrolytic capacitor |