JPS62276516A - Photoelectronic device - Google Patents

Abstract

PURPOSE:To perform stable optical communication even if temperature variation takes place, by extending the optical fiber between a fiber guide and positioning and fixing body in a curved state. CONSTITUTION:The optical fiber 16 between a fiber guide 4 fitted to one end of a package main body 7 and the positioning and fixing body 17 of a sub- carrier 11 is extended in a gently curved state. Therefore, no repetitive stress is applied to the optical fiber and the solder fixing the optical fiber and no buckling takes place in the fiber and the solder is not fatigued, even if the two fixing sections fixing the optical fiber and the base sections supporting the fixing sections are made of a metal having a coefficient of thermal expansion which is far higher than that of the optical fiber and the distance between the two fixing points varies due to thermal contraction or thermal expansion, because the optical fiber between the two fixing points can cope with the change in distance by means of the curved section. Therefore, stable optical communication an be continued even if the temperature varies.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Industrial Application Field] The present invention is directed to an optoelectronic device, for example, a laser beam emitted from a chip built into a package, which is guided out of the package through an optical fiber. Structure of optoelectronic device.

[Conventional technology]

A semiconductor laser device is used as one of the light sources for optical communication. This optical communication laser module (semiconductor laser device) is described, for example, in "Hitachi Hyoron J, No. 10, 1983, October 25, 1983, published by Hitachi Hyoronsha, pages 39 to 44.

This semiconductor laser device is assembled in a so-called direct facing method in which the tip of an optical fiber faces the resonator end face of a semiconductor laser element, and is provided as a flat module with a box-shaped package. This semiconductor laser device has a structure in which the center of the main surface of a metal stem is sealed with a cap made of a metal plate, and has a semiconductor laser element (laser diode chip) inside and a resonator end face of this laser diode chip that emits light. It has a built-in light receiving element that detects the optical output of the laser beam. In addition, this semiconductor laser device has a built-in laser diode chip that generates laser light in the 1.3 μm band, and uses a single mode fiber as the optical fiber, making long-distance, high-capacity communication possible. It has become.

Regarding light emitting modules for optical communication, [NEC Technical Report JVo1.38, No. 2/1985, P84-P8
9.

This document describes a laser element that emits laser light, and a Ge
-PD (light receiving element), thermistor that monitors the temperature of the laser element, cooler for temperature adjustment (Peltier element)
are built into each package, and an optical fiber is provided to guide the laser beam to the outside of the package. Also, the leads that serve as external terminals are of a dual in-line type. Note that the laser element and thermistor are mounted on a block fixed on the Peltier element. Further, an optical fiber is fixed to the block. Further, the light receiving element is fixed on the Peltier element while being fixed to the block.

In addition, in the semiconductor laser device of any of the above-mentioned documents, the optical fiber whose tip faces the laser diode chip is fixed near the laser diode chip and on the package peripheral wall, and the optical fiber between these two fixed points is linear. It extends to

[Problem that the invention seeks to solve]

As described in the above-mentioned literature, in order to stably perform sufficient functions of a semiconductor laser device as an optical communication device, it is necessary to have a technology for highly precisely aligning the optical axis between the laser diode chip and the optical fiber. At the same time, a technology is required to maintain the positional relationship of each part that has been positioned with high precision over a long period of time.

By the way, in conventional semiconductor laser devices, as mentioned above, the optical fiber is fixed near the laser diode chip and on the peripheral wall of the pan cage, and the optical fiber between these two fixed points extends linearly. are doing.

However, the optical fiber that extends linearly in this way is only several meters long.
When the optical fiber is fixed at a position several tens of millimeters away from The optical fiber is made of quartz, etc., which has a significantly small coefficient of thermal expansion, so when temperature fluctuations occur and the distance between the fixed parts changes, the optical fiber cannot cope with this change. The inventor of the present invention has revealed that repeated stress acts on the solder that fixes the optical fiber, causing the solder to fatigue or the optical fiber to buckle and break. Breakage due to fatigue of the solder makes the fixation of the optical fiber incomplete, which shifts the position of the tip of the optical fiber, deteriorates the optical coupling state, and makes it impossible to continue optical communication. In addition, buckling of optical fibers will also result in no possibility of stopping optical communications.

SUMMARY OF THE INVENTION An object of the present invention is to provide an optoelectronic device whose optical coupling efficiency does not change even when temperature changes occur.

Another object of the present invention is to provide an optoelectronic device in which the optical fiber and the fixing portion of the optical fiber are not damaged even when temperature fluctuations occur.

SUMMARY OF THE INVENTION An object of the present invention is to provide an optoelectronic device that allows stable optical communication even when temperature fluctuations occur.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in the optoelectronic device for optical communication of the present invention, when the optical fiber whose tip faces the output surface of the laser diode chip is fixed at two places, the optical fiber between the fixed points is fixed non-linearly, that is, gently. It is extended to draw a curved line.

[Effect]

According to the above-mentioned means, the two fixing parts that fix the optical fiber and the majority of the base that supports these fixing parts are made of metal having a coefficient of thermal expansion that is much larger than that of the optical fiber. However, when the distance between two fixed points changes due to thermal contraction or thermal expansion, the optical fiber section between the two points changes the curvature of its extension. No repeated stress acts on the solder that fixes it, so buckling of the optical fiber and fatigue of the solder do not occur. Therefore, even if there are temperature fluctuations, optical communication can always be continued stably.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

Here, the drawings will be briefly explained. FIG. 1 is a plan view showing the main parts of an optoelectronic device according to an embodiment of the present invention, and FIG.
3 is a sectional view, FIG. 4 is a side sectional view, and 5 is a perspective view of the subcarrier. FIG. 7 is a cross-sectional view of the positioning fixing body on the subcarrier, and FIG. 8 is a perspective view showing the mounting state of the laser diode chip on the subcarrier.
Figure 9 is a perspective view showing the puff cage body, Figure 10 is the same (an enlarged perspective view showing the leads and a reinforcing body for reinforcing the leads, Figure 11 is the same) (the Vertier element and subcarrier are attached to the package body). A cross-sectional view showing the condition,
Figure 12 is a cross-sectional view showing the optical fiber fixed to the subcarrier, Figure 13 is a schematic diagram showing the optical fiber fixed, and Figure 14 is the optical axis alignment of the optical fiber and laser diode chip. A perspective view showing the state;
FIG. 15 is a schematic diagram showing the movable directions of the positioning fixing body that also holds the optical fiber.

In this example, the wavelength is 1.3 μm or 1°5 μm.
An optoelectronic device as a transmitting device in optical communication, which includes a built-in laser diode chip that emits laser light, will be described.

In the optoelectronic device of the present invention, as shown in FIGS. 1 to 4, a puff cage 1 has a box shape, and an attachment hole 2 for attaching the package 1 to one end of the package 1 is provided.
It has a flange 3 provided with a flange 3, and has a fiber guide 4 at the other end to guide an optical fiber cable 5. This optoelectronic device has two rows of leads 6 protruding from the bottom of the puff cage 1 to form a dual in-line structure. The package 1 consists of a box-shaped puff cage main body 7 having a flange 3 at one end and an open top, and a puff cage lid 8 that airtightly covers the opening of the puff cage main body 7.

Further, a pedestal 9 is fixed on the bottom of the pan cage main body 7, and a Vertier element 10 is mounted on the pedestal 9.
is fixed, and a subcarrier 11 is fixed on this Bertier element 10. This subcarrier 11 has a heat sink 14 having a mounting portion 12 and a supporting portion 13 on its main surface as a base member, and a laser diode chip 15 . A cylindrical positioning fixture 17 that guides the optical fiber 16 that takes in the laser light emitted from the laser diode chip 15 from its tip (inner end). A light receiving element 18 for monitoring the laser beam. a thermistor 1 for monitoring the temperature of the heat sink 13;
9 is 1. Each is fixed. The jacket of the optical fiber cable 5 in the package 1 is removed to become an optical fiber 16 consisting of a core and a cladding covering the core, and the positioning fixing body 1
7, and its tip faces one of the emission surfaces of the laser diode chip 15. Furthermore, the electrodes of each element and predetermined leads 6 are electrically connected by conductive wires 20. Note that this optoelectronic device does not contain resin or soldering flux in its pancake, and care has been taken to prevent characteristic deterioration due to these resins.

Such a photoelectronic device performs optical communication by emitting laser light from the laser diode chip 15 and transmitting the emitted laser light to a desired location via the optical fiber cable 5.

At this time, this optoelectronic device monitors the laser light using the light receiving element for one day, controls the output of the laser diode chip 15 based on this information, and performs stable optical communication. Also,
This optoelectronic device monitors the temperature of the heat sink 14 with the thermistor 19, and controls the Peltier element 10 with the thermistor 19 (based on this information) to constantly control the laser diode chip 15.
The system is designed to operate within a certain temperature range to stabilize optical communications.

By the way, a characteristic feature of this optoelectronic device is that the optical fiber 16 extending between the fiber guide 4 attached to one end of the package body 7 and the positioning fixed body 17 of the subcarrier 11 is As shown in the figure and FIG. 13, it extends in a gentle curve. This will be explained in detail later, but if the optical fibers 16 fixed at the inner end of the subcarrier 11 and the inner end of the fiber guide 4 are held straight and taut, the distance between refixing changes due to temperature fluctuations. if you did this,
The re-fixing part and the members supporting these fixing parts are made of metal such as Kovar, and the optical fiber 16 is made of quartz glass which is warmer than metal and has a smaller coefficient of thermal expansion. 16 becomes unable to sufficiently follow the distance fluctuation, stress is repeatedly applied to the optical fiber 16 and the solder that fixes the optical fiber 16, and as a result, the optical fiber 16 may buckle or the solder may undergo fatigue failure. This is to prevent stable optical transmission from becoming impossible. That is, if the optical fiber 16 is gently bent and extended between two fixed points, one fixed part of the optical fiber 16 can be extended from point A to point B, as shown in FIG.
When the optical fiber 16 is extended to a point or contracted from point A to point 0, the optical fiber 16 bends as shown by a dashed line or a dashed double dotted line to accommodate the change, so that no unreasonable stress is applied to the optical fiber 16, and the light Damage to the fiber 16 can now be prevented. Therefore, since stress is not repeatedly applied to the optical fiber 16, fatigue failure of the solder that fixes the optical fiber 16 does not occur.

Next, each part of such a photoelectronic device will be explained. Prior to final assembly of the optoelectronic device, several subassembly parts are prepared. For example, the subassembly parts include the puff cage body 7. subcarrier 1
There is a first prize. After describing these subassembly parts, the overall structure of the optoelectronic device will now be described by describing the assembly of the optoelectronic device.

The package 1 has a box-structured package body 7 as described above.
The package main body 7 and the package lid 8 are made of Kovar made of islemo iron-nickel-Kover (Fe-Ni-Co) alloy.

As shown in FIG. 9, the package body sub-assembly parts including the puff cage body 7 as a main component include the puff cage body 7. Flange 3. Fiber guide 4. It consists of 6 leads and 9 pedestals.

As shown in FIG. 9, the pan cage main body 7 has a structure in which a flange 3 having a mounting hole 2 is attached to one end thereof. Further, as shown in FIG. 10, seven glue rods 6 are arranged in two rows at the bottom of the puff cage main body 7.

Each lead 6 passes through the bottom plate of the package body 7 and is insulatively fixed to the package body 7 by an insulating bonded body 21 made of borosilicate glass whose coefficient of thermal expansion is substantially equal to that of Kovar constituting the bottom plate. For example, as shown in FIGS. 1 and 2, the left end nodes 6 of the front and rear lead rows serve as external terminals of the light-receiving element 18, and the front terminal The second and third leads 6 from the left in the lead row become external terminals of the laser diode chip 15, and the fourth and fifth leads 6 from the left in the lead row on the front side
becomes an external terminal of the thermistor 19. Further, the leads 6 at the right ends of the front and rear lead rows serve as external terminals of the Peltier element 10, respectively. The other leads 6 are empty leads that are not used in this embodiment.

The wire 20 connected to the Peltier element 10 is connected to the lead 6 by welding or the like without using resin or flux, but the other wires 20 are connected to the lead 6 by ultrasonic wire bonding. Ultrasonic wire bonding uses ultrasonic vibration to perform wire bonding, so a wire 20 is attached to the upper end of the long lead 6 as shown in the figure.
When connecting, the leads 6 vibrate and bonding cannot be performed reliably. Therefore, in this embodiment, the leads 6 to which the wires 20 are connected by ultrasonic wire bonding are connected by a reinforcing plate 22 to prevent the leads 6 from vibrating during ultrasonic wire bonding.

Moreover, the reinforcing plate 22 also plays the role of stabilizing the use of the optoelectronic device in a high frequency range by adopting the following structure. That is, the reinforcing plate 22 is made of an insulating ceramic plate, and the connection surface with the lead 6 is
Each piece is partially metallized. The metallized layer is made of, for example, a Ni plating film 23.

Then, the lead 6 is attached to each Ni plating film 23 by a wire 24.
is firmly fixed by. Due to this strong fixation, the adjacent leads 6 become integral, and ultrasonic wire bonding is reliably performed as described above. Since the lead 6 is provided in the lead 6, the area through which the current flows increases, the parasitic inductance is reduced, and optical communication in a high frequency range of up to 565 Mbit/sec can be performed stably. For example, if the diameter of the rib portion 6 is φ0.45 mm and the length is 7 mm,
The parasitic inductance of about 6nH can be reduced to 3nH by creating a structure with a gold plating film 23 of a desired width.
It can be reduced to H.

Further, in the package main body subassembly component, a fiber guide 4 is attached to an end face of the puff cage main body 7 opposite to the flange 3. This fiber guide 4 is
An outer guide 25 each made of a cylindrical body, and an inner guide 26 fitted into the inner end of the outer guide 25.
It consists of The outer guide 25 has its inner end penetrated and hermetically brazed to the end of the puff cage body 7. Further, the outer end of the outer guide 25 has a thin-walled tube structure and is easily crushed by caulking. Further, the inner guide 26 has a structure in which the outer end is fitted into the inner end of the outer guide 25, and the inner end extends thinly and has an inclined surface at the tip. In such a fiber guide 4, before the optical fiber cable 5 is inserted into the fiber guide 4, the jacket is removed from the distal end side over a certain length; The optical fiber 16 portion extends over the entire area of the inner guide 26 and a part of the outer guide 25, and the jacketed portion extends to the outer end portion of the outer guide 25.

Further, a pedestal 9 is fixed on the bottom of the package main body subassembly component. This pedestal 9 is fixed to the bottom surface of the package body 7 on the side of the flange 3 with a solder material. Since the Bertier element 10 is fixed on the pedestal 9 via solder, it is desired that the element has good thermal conductivity for heat dissipation. The pedestal 9 is made of alumina ceramic with a coefficient of thermal expansion of about 6.7XIO-6/'C. If copper or the like with good thermal conductivity is used as the pedestal 9, Since the solder that joins the pedestal 9 and the electrode plate 27 is subject to fatigue failure, in order to avoid this, the pedestal 9 has a coefficient of thermal expansion of, for example, 6.0 to 7.
．． 0XIO-”/'C1 Heat conduction furnace conductivity 5-0.
It is made of copper tungsten (CuW) having a molecular weight of 67 ca I/am-sec-'c. Also,
One end of the pedestal 9 contacts the peripheral wall of the package body 7 on the flange 3 side, so that heat is transmitted from the pedestal 9 to the flange 3 via the peripheral wall. The thermal expansion coefficient of Kovar forming the bottom of the pan cage body 7 is 5.3X10-'
/'C. Moreover, as a material that can be used as the pedestal 9, there is SiC or the like.

The subcarrier 11 as a subassembly part is the fifth
The structure is as shown in the figure.

As shown in FIGS. 5 and 6, this subcarrier 11 has a heat sink 14 made of a rectangular plate as its main component. The heat sink 14 has a mounting portion 12 and a support portion 13 on its main surface. These mounting parts 1
2 and the support portion 13 have a convex shape. The mounting section 12 is arranged to cross the central region of the main surface of the heat sink 14, and the support section 13 extends parallel to the mounting section 12 at one end side. Furthermore, the mounting portion 12 and the support portion 13 are arranged at an angle of θ with respect to the center line of the heat sink 14.
The end extends in a direction perpendicular to the tilt axis of the tilt. Further, a cylindrical positioning fixing body 17 is fixed through the support portion 13 . This positioning fixing body 17 serves as a guide shaft for guiding the optical fiber 16, and also serves as an adjustable shaft that can adjust the position of the tip of the optical fiber 16.

Therefore, the positioning fixing body 17 is made of a material that is easily plastically deformed.
For example, it is made of cupronickel, and as shown in FIG. It consists of a guide shaft 29 with a diameter. Also,
The hole at the outer end of the guide shaft 29 is tapered to allow easy insertion of the optical fiber 16. The inner diameter of the positioning fixing body 17 is φ125, which is the diameter of the optical fiber 16.
The diameter is slightly larger than μm.

Further, as will be described later, the tip of the adjustment shaft 28 is cut into a bevel and has an inclined surface in order to increase the solder joint area for fixing the optical fiber 16 to the adjustment shaft 28. There is. Further, as shown in FIG. 7, solder 30 to which no flux is attached is preliminarily attached to this cross-cut portion. Said solder 30
First, a dummy 31 slightly thicker than the φ125 μm optical fiber 16, for example, a φ150 μm piano wire, is inserted into the positioning fixture 17, and in this state, solder is applied to the tip of the adjustment shaft 28 of the positioning fixture 17. Thereafter, as shown in FIG. 7, the piano wire serving as the dummy 31 is removed, and the attached flux and the like are removed by ultrasonic cleaning or the like.

Further, on the distal end of the positioning fixing body 17, that is, on the mounting portion 12 on the extension line of the distal end of the adjustment shaft 28, a submount 32 is soldered with fluxless low melting point solder, for example, Pb.
It is fixed with solder made of -3n-In. The submount 32 is made of insulating 5iC (α1.7
O-"/"C). Further, as shown in FIG. 8, a conductive metallized layer 33 is provided on the main surface of the submount 32. Then, on this metallized layer 33, there are Au- and Sn eutectic layers 3, respectively.
A laser diode chip 15 and a pedestal 36 made of Au are fixed independently through 4.35. This eutectic layer 34.35 is pb or Pb-3n
You may also use Therefore, the lower electrode of the laser diode chip 15 is electrically connected to the pedestal 36 via the metallized layer 33. As shown in FIG. 8, the laser diode chip 15 is mounted on the submount 3 in a so-called p-up state in which the resonator 38 that emits the laser beam 37 is far away from the submount 32.
It is fixed at 2.

Further, the electrode on the upper surface of the laser diode chip 7 15 is electrically connected to the mounting part 12 by two wires 20, and the pedestal 36 and the electrode 6 are connected as shown in FIGS. 1 and 2. As shown, two wires 20
electrically connected.

In this optoelectronic device, the connection between the upper electrode of the laser diode chip 15 and the mounting portion 12, and the connection between the pedestal 36 and the lead 6 by the wire 20, are connected to the side that drives the laser diode chip 15 at high speed. This is to change the polarity so that it can be used as a negative voltage due to the nature of the transistor. Note that the laser diode chip 15 is mounted on the submount 32 in the mounting section 12.
fixed on top.

Further, in the optoelectronic device of this embodiment, the laser diode chip 15 is offset from the center line of the heat sink 14 and biased to one side. This is to shorten the length of the wire 20 stretched between the pedestal 36 and the lead 6. By shortening the length of the wire 20, parasitic inductance is reduced, and the optoelectronic device is operated in a high frequency range. However, this is to ensure stable driving.

Furthermore, since the laser diode chip 15 is off the center line of the heat sink 14 and the positioning fixture 17 that guides the optical fiber 16 is off the center line,
Fiber guide 4 of puff cage main body subassembly parts
The positioning fixing body 17 is no longer located on the extension line.

As a result, if the optical fiber 16 extending from the fiber guide 4 to the positioning fixture 17 is arranged so that no excessive force is applied, the optical fiber 16 will be It will extend in a curved line. In this way, the fact that the optical fiber 16 extends in a curved line between two fixed points means that the fixed point
Even if the distance between points changes, no unreasonable force will be applied to the optical fiber 16, and communication will not be hindered.

In other words, if the optical fiber 16 is stretched linearly between two fixed points, if the relative positional relationship between the two points of the optical fiber 16 changes due to thermal expansion or contraction, the light A force is applied to the fiber 16 or the optical fiber 16 is broken, but as shown in FIG. 13, since the optical fiber 16 extends in a curved manner, the When the distance between the two points increases from point A in a normal temperature state to point B in a high temperature state, or decreases from point A to point 0 in a low temperature state, the optical fiber 16 bends and changes as shown by a dashed line or a dashed double dotted line. Therefore, no excessive stress is applied to the optical fiber 16, and damage to the optical fiber 16 can be prevented.

Note that the minimum inclination angle θ of the positioning fixed body 17 is
To ensure that the optical fiber 16 extending between the fiber guide 4 and the positioning fixture 17 bends easily and does not interfere with optical communication such as distortion when the distance between two points changes due to temperature fluctuations. Determined by taking into consideration. Moreover, if θ is made too large, the length of the optical fiber 16 between the two points becomes too long, making assembly work difficult. Therefore, in the case of this example, θ was set to 100.

Further, a chip carrier 39 to which a light receiving element 18 is attached is fixed to the main surface of the heat sink 14 via an Au-3n eutectic layer. The chip carrier 39 is made of a ceramic block, and its -side (main surface)
A metallized layer 40 for element fixing and a metallized layer 41 for wire fixation are provided over the upper surface. The light receiving element 18 is fixed on the element fixing metallized layer 40 via an Au-5n layer. Further, the electrode on the upper surface of the light receiving element 18 and the wire fixing metallized layer 41 are electrically connected by a wire 42. Note that the chip carrier 39 is
Since it is fixed to the heat sink 14 so that one side of the rectangle coincides with one side of the heat sink 14, the light receiving surface of the light receiving element 18 is not perpendicular to the laser beam 37 (it is oblique).

Therefore, since the light reflected from the light receiving surface of the light receiving element 18 does not return to the output surface of the laser diode chip 15, generation of noise due to the returned light can be prevented.

Further, on the upper surface of the support portion 13 of the heat sink 14,
A thermistor 19 that monitors the temperature of the heat sink 14
is fixed via a thermistor support chip 43.

The thermistor support chip 43 is made of a ceramic block and has metallized layers (not shown) on its front and back surfaces.

The thermistor 19 is fixed to the upper surface of the thermistor support chip 43 by the Au-3n eutectic layer. As a result, the exposed metallized layer portion of the thermistor support chip 43 becomes electrically connected to the lower electrode of the thermistor 19. Therefore, in order to establish conduction with the electrode lead 6 of the thermistor 19, as shown in FIGS.
0, and the two wires 20 connect the predetermined glue 6 and the metallized layer of the thermistor support chip 43.

Further, as shown in FIG. 5, the heat sink 14 is provided with a recessed portion used when moving and adjusting the tip position of the adjusting shaft 28 of the positioning fixing body 17.

This recess is provided, for example, as a recess 44 in the main surface portion of the heat sink 14 corresponding to the tip portion of the fixed fixing body 17, and a hole 44 is provided in the side surface of the support portion 13.
It is set as 5. These depressions 44 and holes 4
5 is a position adjustment lever 4 as shown in FIG.
6, etc., and a part of the circumferential wall of the recess 44 or hole 45 serves as a fulcrum for the position adjustment lever 46, so that the adjustment shaft 2 of the positioning fixing body 17 can be moved up, down, left or right at the other end of the lever. 15th step to move the adjustment shaft 28 by plastically deforming it to
(see figure), adjust the tip position of the optical fiber 16 and align the optical axes of the laser diode chip 15 and the optical fiber 16. Unless the optical axis alignment is performed using such a position adjustment lever 46, delicate optical axis alignment work that requires high precision within 1 μm cannot be performed efficiently.

Subassembly of the subcarrier 11 having such a structure is performed in the following steps. First, the thermistor support chip 43 on which the thermistor 19 is mounted is fixed onto the support portion 13 of the heat sink 14 by the fi, u-Sn eutectic layer. Next, the chip carrier 39 carrying the light receiving element 18 is fixed to the heat sink 14 by the Au-3n eutectic layer. And finally the laser diode chip 15
The submount 32 carrying the heat sink 14 is fixed to the mounting portion 12 of the heat sink 14, and the subcarrier 11 as shown in FIG. 5 is manufactured.

Next, assembly of the optoelectronic device will be explained.

First, the subassembly parts and Peltier element 10. as described above. Fiber optic cable5. Individual parts such as the package body are prepared.

Thereafter, as shown in FIG. 11, the Vertier element 10 is fixed with fluxless solder onto the pedestal 9 fixed to the bottom of the package body 7 of the package body subassembly component. Next, the lead 20 of the Beltier element 10
Connect to main body lead 6. Next, this Peltier element 1
A subcarrier 11 is fixed onto the top of the subcarrier 11 with fluxless solder.

Next, as shown in FIG. 12, an optical fiber cable 5 is prepared with the jacket removed over a predetermined length from the tip, and the optical fiber cable 5 is inserted into the fiber guide 4 from the tip. The tip of the optical fiber 16 that has entered the package body 7 by this insertion operation of the optical fiber cable 5 is adjusted with a jig or manually and inserted into the guide shaft 29 of the positioning fixture 17. Thereafter, the optical fiber cable 5 is held by a manipulator or the like and gradually pushed in. Then, the tip of the optical fiber 16 protrudes from the inner end of the positioning fixture 17 and extends approximately 20μ in front of the emission surface of the laser diode chip 15.
When it reaches position m, it is stopped. In this state, the optical fiber 16 extends in a gentle curve due to the rigidity of the optical fiber 16, as shown in FIG. Next, in this stationary state, the thin portion at the outer end of the fiber guide 4 is caulked. As a result, the optical fiber cable 5 is temporarily fixed because the jacket portion is crushed by this caulking.

Next, the optical fiber 16 is fixed to the inner end of the adjustment shaft 28 of the positioning fixture 17 by remelting the preliminary solder 30. Next, the optical fiber 16 at the inner end of the fiber guide 4
The parts are fixed with fluxless solder. This solder may be provided in advance by the same method as the preliminary solder 30 on the tip of the adjustment shaft 28 in the subcarrier 11 described above.

Next, laser diode chip 15. Light receiving element 18.
The electrode of the thermistor 19 and the lead 6 are electrically connected using a wire 20. At this time, the wire 20 is connected by ultrasonic wire bonding, but when the wire 20 is connected to the upper end of the lead 6, since the lead 6 is reinforced with the reinforcing plate 22, the lead 6 is connected to the ultrasonic wire bonding. There is no vibration due to vibration during bonding, and reliable wire bonding can be performed.

Next, the laser diode chip 15 is driven to emit a laser beam 37, and this laser beam 37 is connected to the optical fiber 1.
6 and detects the light intensity of the laser beam 37 at the other end of the optical fiber, and then aligns the optical axes of the laser diode chip 15 and the optical fiber 16. When aligning the optical axis, as shown in FIG. 14, the adjusting shaft 28 of the positioning fixture 17 is two-dimensionally plastically deformed by the position adjusting lever 46 to align the optical axis. After aligning the optical axis,
Since the adjustment shaft 28 is plastically deformed, there is no return etc.
The high optical coupling state at the time of setting will be maintained for a long time.

Next, the package lid 8 is airtightly attached to the opening of the pan cage body 7 by soldering or the like.
An optoelectronic device as shown is assembled.

According to such an embodiment, the following effects can be obtained.

(1) In the optoelectronic device of the present invention, the optical fiber whose tip faces the output surface of the laser diode chip is fixed at two points in the middle, and the optical fiber is extended between the two fixed points. Since existing optical fibers are arranged in advance to avoid curves, even if the distance between two fixed points changes due to temperature fluctuations, the optical fiber can cope with the change by changing its extended shape. This has the effect that a large force is not applied to the optical fiber, and damage such as buckling of the optical fiber can be prevented.

(2) According to (1) above, in the optoelectronic device of the present invention, no force is applied to the optical fiber even if there is a temperature change;
Since the solder that fixes the optical fiber does not undergo fatigue failure, it is possible to maintain the high optical coupling state between the laser diode chip and the optical fiber at the time of setting.

(3) Due to the above (1) and (2), the optoelectronic device of the present invention has the effect that optical communication can be performed stably.

(4) In the optoelectronic device of the present invention, the parts that require time-consuming and high-precision assembly are subassembly parts, so that assembly is facilitated.

(5) According to the above (4), according to the present invention, the laser diode chip 5 light receiving element, thermistor, and the positioning fixing body for guiding the optical fiber are integrated into the heat sink and serve as a subcarrier. Therefore, in assembling an optoelectronic device, it is necessary to fix this subcarrier on the Vertier element fixed to the pancage body subassembly part, and to connect the optical fiber and laser diode chip fixed to the positioning fixture of the subcarrier. By aligning the optical axes, the assembly of important parts is completed, resulting in the effect that highly accurate assembly becomes possible.

(6) According to the above (4), according to the present invention, since the assembly is performed using two subassembly parts and several individual parts, it is possible to obtain the effect of increasing productivity.

(7) During the assembly of the optoelectronic device of the present invention, the optical axis alignment between the laser diode chip and the optical fiber is performed by oscillating position adjustment of the positioning fixing body of the subcarrier, resulting in highly accurate optical axis alignment. Since this can be done, the effect of high quality can be obtained.

(8) The optoelectronic device of the present invention changes the position of the positioning fixture when aligning the optical axes of the laser diode chip and the optical fiber, but this positional variation is performed by plastic deformation of the positioning fixture. After this, the optical coupling state does not return to its original state, so the optical coupling state at the time of setting can always be maintained, resulting in the effect of stable reliability.

(9) Since the optoelectronic device of the present invention does not use resin or flux in its package, it has the effect that components are less likely to deteriorate and reliability is increased.

(10) In the optoelectronic device of the present invention, since the laser diode chip is arranged biased to one side, the length of the wire stretched between the laser diode chip and the lead is shortened, and the high frequency It is also stable for use in the area.

(11) Since the subcarrier of the present invention is provided with a recess that supports the positioning lever used when plastically deforming the positioning fixing body that guides the optical fiber, the plasticity of the positioning fixing body The effect of easy deformation can be obtained.

(12) According to (1) to (11) above, according to the present invention, the optical coupling between the laser diode chip and the optical fiber can be easily and accurately set, and the highly accurate optical coupling state can be maintained for a long time. A synergistic effect is obtained in that the device can be provided at low cost.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, if the fiber guide 4 and the positioning fixture 17 extend on the same axis, the optical fiber extending from the inner end of the fiber guide 4 to the outer end of the positioning fixture 17 By extending the optical fiber 16 spirally, the optical fiber 16 can flexibly deform in response to temperature fluctuations. Moreover, as shown in FIG. 16,
The optoelectronic device has a structure in which the optical fiber 16 extending from the inner end of the fiber guide 4 into the puff cage 1 is fixed with a position adjustment pin 48 implanted in the pedestal part 47 of the puff cage main body (stem) 7. Although not particularly shown, the optical fiber 16 between the position adjustment bin 48 and the fiber guide 4 may be bent and extended or spirally extended as shown in FIG. Therefore, even if the distance between the two fixed points of the optical fiber 16 changes due to temperature fluctuations,
Since the optical fiber 16 changes its extension shape,
No repeated stress is applied to the optical fiber 16, allowing stable optical transmission.

Incidentally, the optoelectronic device having the structure shown in FIG. 16 will be briefly explained. This optoelectronic device has a puff cage main body (stem) 7 made of metal with a flat structure, and has a structure in which a laser diode chip 15 is fixed to a pedestal section 47 at the center of the recessed bottom of the package main body 7 via a submount 32. It has become. Further, the optical fiber cable 5 is guided by a fiber guide 4 attached to pass through a side wall at one end of the package body 7. Optical fiber 1 revealed by removing the jacket at the tip of optical fiber cable 5
6 is fixed in a penetrating state to a position adjustment bin 48 installed in front of the laser diode chip 15, and its tip faces one emission surface of the laser diode chip 15. Further, the other output surface of the laser diode chip 15 faces the tip of a monitor fiber 49 for detecting laser light intensity. The monitor fiber 49 is guided by a cylindrical monitor fiber guide 50 that is attached to the side wall of the other end of the package body 7 in a penetrating manner. The fiber guide 4 and the monitor fiber guide 50 are both fixed to the pancage body 7 with solders 51 and 52, and the optical fiber 16
is fiber guide 4 and monitor fiber guide 50
is fixed by solder 30.

In the above description, the invention made by the present inventor is mainly applied to the manufacturing technology of optoelectronic devices for optical communication, which is the background field of application, but the invention is not limited thereto.

The present invention can be applied to at least a technique for fixing an optical fiber at two adjacent points.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions among the inventions disclosed in this application is as follows.

In the optoelectronic device of the present invention, when the optical fiber whose tip faces the output surface of the laser diode chip is fixed at two locations, the optical fiber between the two locations is fixed in a non-linear manner, that is, in a gentle curve. It is extended to For this reason, even if the two fixing parts that fix the optical fiber and the base part that supports these fixing parts are made of metal that has a thermal expansion coefficient warmer than that of the optical fiber, thermal shrinkage or thermal expansion When the distance between two fixing points changes due to expansion, the optical fiber between the two points changes its curvature to cope with the change, which causes repeated stress not only on the optical fiber but also on the solder that fixes the optical fiber. does not occur, and buckling of the optical fiber and fatigue of the solder do not occur. Therefore, even if there are temperature fluctuations, optical communication can always be continued stably.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the main parts of an optoelectronic device according to an embodiment of the present invention, FIG. 2 is the same (perspective view), FIG. 3 is a sectional view, FIG. 4 is a side sectional view, and FIG. 6 is a perspective view of the subcarrier, FIG. 6 is a plan view of the heat sink in the subcarrier, FIG. 7 is a sectional view of the positioning fixing body in the subcarrier, and FIG. FIG. 9 is a perspective view showing the package body, FIG. 10 is an enlarged perspective view showing the leads and a reinforcing body for reinforcing the leads, and FIG. 11 is a perspective view showing the package body with a Vertier element and Figure 12 is a cross-sectional view showing the state in which the subcarrier is attached, Figure 12 is a cross-sectional view showing the state in which the optical fiber is fixed to the subcarrier, Figure 13 is a schematic diagram showing the state in which the optical fiber is fixed, and Figure 14 is the same. FIG. 15 is a perspective view showing how the optical axes of an optical fiber and a laser diode chip are aligned, FIG. 15 is a schematic diagram showing the movable directions of the positioning fixing body that holds the optical fiber, and FIG. 16 is another embodiment of the present invention. It is a cross-sectional view showing the main parts of the optoelectronic device according to 1. Puff cage, 2. Mounting hole, 3. Flange, 4. Fiber guide, 5. Optical fiber cable, 6.・Lead, 7...Pan cage body, 8・
...Puff cage lid, 9...Pedestal, 10...Beltier element, 11...Subcarrier, 12...Mounting section, 1
3... Support part, 14... Heat sink, 15...
Laser diode chip, 16... optical fiber, 17
... Positioning fixed body, 18... Light receiving element, 19...
・Thermistor, 20... Wire, 21... Insulating bonded body, 22... Reinforcement plate, 23... Ni plating film, 2
4...1 艮鞞、25...Outer guide、26...
- Inner guide, 27... Electrode plate, 28... Adjustment shaft, 29... Guide shaft, 30... Solder, 31...
Dummy, 32... Submount, 33... Metallized layer, 34.35-Au-3n eutectic layer, 36... Pedestal, 37... Laser light, 38... Resonator, 39
...Chip carrier, 40...Metallized layer for element fixing, 41...Metallized layer for wire fixing, 42...
・Wire, 43... Thermistor support chip, 44...
・Recess, 45...hole, 46...position adjustment lever,
47... Pedestal part, 48... Position adjustment pin, 49...
・Monitor fiber, 50...Monitor fiber 1st Figure 5-busy] Y Iha 7゛Hano 13th Figure 5AC Figure 14 6-1 stitch 1! 5- し、j、／'、、゛さ■粁tte、72、...-th
15 Figure 16 Figure 4 Goo 411 goes! 2° terminal 2nd terminal 2nd floor 1. 'Hai

Claims (1)

[Claims] 1. An optoelectronic device having an optical fiber fixed at a plurality of locations, the optoelectronic device characterized in that the optical fiber extending between the fixed locations extends non-linearly. . 2. The optoelectronic device according to claim 1, wherein one of the fixed portions of the optical fiber is not on an extension line in the extending direction of the optical fiber to the other fixed portion. 3. The optoelectronic device according to claim 1, wherein the optical fiber is made of quartz. 4. The optoelectronic device according to claim 1, wherein the optical fiber is fixed to each part of a metal body.