JPS62275149A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPS62275149A
JPS62275149A JP11614186A JP11614186A JPS62275149A JP S62275149 A JPS62275149 A JP S62275149A JP 11614186 A JP11614186 A JP 11614186A JP 11614186 A JP11614186 A JP 11614186A JP S62275149 A JPS62275149 A JP S62275149A
Authority
JP
Japan
Prior art keywords
parts
epoxy resin
resin
acrylate
vinyl polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11614186A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588864B2 (enExample
Inventor
Mikio Kitahara
北原　幹夫
Kazuya Shinoda
新小田　一弥
Takayuki Kubo
久保　隆幸
Yuji Okitsu
興津　雄二
Koichi Machida
町田　貢一
Motoyuki Torikai
基之 鳥飼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Publication of JPS62275149A publication Critical patent/JPS62275149A/ja
Publication of JPH0588864B2 publication Critical patent/JPH0588864B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11614186A 1986-02-10 1986-05-22 半導体封止用樹脂組成物 Granted JPS62275149A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2603086 1986-02-10
JP61-26030 1986-02-10

Publications (2)

Publication Number Publication Date
JPS62275149A true JPS62275149A (ja) 1987-11-30
JPH0588864B2 JPH0588864B2 (enExample) 1993-12-24

Family

ID=12182305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11614186A Granted JPS62275149A (ja) 1986-02-10 1986-05-22 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62275149A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691416A (en) * 1992-11-05 1997-11-25 Nippon Shokubai Co., Ltd. (Meth)acrylate polymer particles dispersed in epoxy resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691416A (en) * 1992-11-05 1997-11-25 Nippon Shokubai Co., Ltd. (Meth)acrylate polymer particles dispersed in epoxy resin

Also Published As

Publication number Publication date
JPH0588864B2 (enExample) 1993-12-24

Similar Documents

Publication Publication Date Title
JPS62270617A (ja) 半導体封止用樹脂組成物
JP2815413B2 (ja) 半導体封止用樹脂組成物
KR930003695B1 (ko) 반도체밀봉용 수지조성물
JP2023119908A (ja) 硬化性樹脂組成物及び電気電子部品
JPS62275149A (ja) 半導体封止用樹脂組成物
JP2815408B2 (ja) 半導体封止用樹脂組成物
JPS62273222A (ja) 半導体封止用樹脂組成物
JPH0241353A (ja) 半導体封止用樹脂組成物
JPH02212554A (ja) 半導体封止用樹脂組成物
JPH02209916A (ja) 半導体封止用樹脂組成物
JPH0238413A (ja) 半導体封止用樹脂組成物
JPH0236219A (ja) 半導体封止用樹脂組成物
KR100587453B1 (ko) 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치
KR930002436B1 (ko) 반도체밀봉용수지조성물
JPH0531885B2 (enExample)
JPH0232117A (ja) 半導体封止用樹脂組成物
JPH02302422A (ja) 半導体封止用樹脂組成物
JP3821461B2 (ja) 半導体の樹脂封止方法
JPS6250361A (ja) エポキシ樹脂組成物及びその製法
JPH0234623A (ja) 半導体封止用樹脂組成物
JP2001139667A (ja) マイクロカプセル型リン系硬化促進剤、エポキシ樹脂組成物及び半導体装置
WO2024024213A1 (ja) 熱硬化性樹脂組成物、及び成形品
JPS63196620A (ja) 熱硬化性エポキシ樹脂組成物
JPS63241020A (ja) 電子部品封止用エポキシ樹脂成形材料
JPH02209964A (ja) 半導体封止用樹脂組成物

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees