JPS62274644A - Cooling apparatus - Google Patents
Cooling apparatusInfo
- Publication number
- JPS62274644A JPS62274644A JP11785186A JP11785186A JPS62274644A JP S62274644 A JPS62274644 A JP S62274644A JP 11785186 A JP11785186 A JP 11785186A JP 11785186 A JP11785186 A JP 11785186A JP S62274644 A JPS62274644 A JP S62274644A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- air
- fan
- cabinet
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title abstract description 15
- 238000009423 ventilation Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、筐体内に発熱する電子部品を有する電子機器
を冷却するだめの冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a cooling device for cooling an electronic device having electronic components that generate heat within a housing.
従来の技術
第３図及び第４図は従来の冷却装置を構成を示している
。第３図は装置全体の斜視図であり、２１は上カバーで
あり両側面に通風孔２７がおいており、ンヤーシ２３に
ビス２９で固定されている。２２は放熱板であり、筐体
上部ととりつけられ、／ヤーン２３にビス３０にて固定
されている。２４は電源トランスであり、２５はファン
モータであり、筐体の後面に取り付けられており、これ
により空気を筐体に取り入れる。２６はこのファン２５
にて取り入れられた空気の流れを示すものである。２８
はフロントパネルである。第４図は第３図のファン２５
によって取り入れだ空気２６が放熱板２２のフィンの間
を通りぬけ、上カバー２１にもうけた通風孔２７からで
るところを示したものである。BACKGROUND ART FIGS. 3 and 4 show the configuration of a conventional cooling device. FIG. 3 is a perspective view of the entire apparatus. Reference numeral 21 denotes an upper cover, which has ventilation holes 27 on both sides, and is fixed to the cover 23 with screws 29. Reference numeral 22 denotes a heat sink, which is attached to the upper part of the housing and fixed to /yarn 23 with screws 30. 24 is a power transformer, and 25 is a fan motor, which is attached to the rear surface of the housing, thereby drawing air into the housing. 26 is this fan 25
This shows the flow of air taken in. 28
is the front panel. Figure 4 shows the fan 25 in Figure 3.
This figure shows the air 26 taken in by the heat sink passing between the fins of the heat sink 22 and coming out from the ventilation holes 27 provided in the upper cover 21.
第３図、第４図の様に、筐体後面から空気を取り入れ、
トランス２４を冷却すると伴に、筐体上部についている
放熱板２２のフィンの間に空気を通し冷却しながら、上
カバー２１においている通風孔２７より筐体外へ出す。As shown in Figures 3 and 4, air is taken in from the rear of the housing.
While cooling the transformer 24, air is passed between the fins of the heat radiating plate 22 attached to the upper part of the casing to cool it and exit the casing from the ventilation hole 27 in the upper cover 21.
この場合のファン２５の回転数は常に一定であシ、電源
投入時より高速回転していた。In this case, the rotation speed of the fan 25 was always constant and was rotating at a higher speed than when the power was turned on.
発明が解決しようとする問題点
しかしながら、上記従来の冷却装置では、後面にファン
がついているため、ラックマウント時には新鮮な空気を
通り入れることが出来ず、また、放熱板のフィンを通る
空気の流れが水平になっているため、熱エネルギーをも
った空気が上昇する力を利用できず、ファンの風圧だけ
で空気を外に掃き出すことになり、効率的な冷却ができ
ないという問題があった。また、ファンのスピードが常
に一定で高速回転するため、設備使用などにおいて騒音
の問題があった。Problems to be Solved by the Invention However, in the conventional cooling device described above, since the fan is attached to the rear side, fresh air cannot pass through when mounted in a rack, and the air flow through the fins of the heat sink is limited. Because the space is horizontal, the power of the air carrying thermal energy to rise cannot be used, and the air is swept outside using only the wind pressure of the fan, resulting in an inability to achieve efficient cooling. Furthermore, since the speed of the fan is always constant and rotates at high speed, there is a problem with noise when using the equipment.
本発明はこのような従来の問題を解決するものであり、
前面から新鮮な空気をとり入れ、効果的に放熱板を冷却
するように構成すると共にファンの動作を温度検知によ
り、高速回転と低速回転の２段階に分け、騒音の問題を
解決し得る冷却装置を提供することを目的とするもので
ある。The present invention solves these conventional problems,
The cooling system takes in fresh air from the front and is configured to effectively cool the heat sink, and uses temperature detection to divide the fan operation into two stages: high-speed rotation and low-speed rotation, which solves the noise problem. The purpose is to provide
問題点を解決するだめの手段
本発明は上記目的を達成するために、前面に取り付けた
ファンにより筐体内に新鮮な空気を取り入れ、トランス
を冷却すると供に、その空気をシャーシ、カバー、放熱
板でつくった空気の通り道に導き、放熱板のフィンに沿
って空気を上昇させながら、天面と側面上方に設けた通
風孔より掃き出すようになし、更に、筐体内で、最も温
度の高くなるトランジスタの表面に温度センサーを設け
この温度検知により、ファンのスピードをコントロール
し、トランジスタに負荷がかからず温度の低い時は、フ
ァンは低速で静かに回転し、トランジスタに大きな負荷
がかかり筐体内の温度が上昇した場合には、ファンが高
速に回転するように構成したものである。Means to Solve the Problems In order to achieve the above object, the present invention takes in fresh air into the case using a fan attached to the front, cools the transformer, and directs the air to the chassis, cover, and heat sink. The air is guided through the air passage created by the heat dissipation plate, and while it rises along the fins of the heat sink, it is swept out through the ventilation holes provided on the top and sides. A temperature sensor is installed on the surface of the device, and this temperature detection controls the speed of the fan. When there is no load on the transistor and the temperature is low, the fan rotates quietly at a low speed, and when there is a heavy load on the transistor and the temperature inside the case is low, the fan rotates quietly. The fan is configured to rotate at high speed when the temperature rises.
作用
本発明は上記のような構造により次のような作用を有す
る。すなわち、ファンにより取入れた空気を筐体底面に
つくったシャーシと放熱板との隙間を通す。ここで、熱
エネルギーをもった空気が上昇する原理を利用し、放熱
板のフィンとカバーで造った空気の通り道を上昇させ放
熱板を効率良く冷却でき、その上、トランジスタの表面
に取シ付けられた温度センサーにより、筐体内の温度を
検知しファンのスピードを高速から低速、低速から高速
へ自在にコントロールできるという作用を有する。Effects The present invention has the following effects due to the above structure. In other words, the air taken in by the fan passes through the gap between the chassis and the heat sink, which are formed on the bottom of the housing. Here, by utilizing the principle that air with thermal energy rises, the air passage created by the fins and cover of the heat sink can be raised to efficiently cool the heat sink, and in addition, it can be mounted on the surface of the transistor. The built-in temperature sensor detects the temperature inside the case and allows you to freely control the fan speed from high to low, or from low to high.
実施例
第１図及び第２図は本発明の一実施例の構成を示すもの
である。第１図、第２図において、１は筐体の天面及び
側面を覆う上カバーであり、両側面には通風孔７があり
、また天面には通風孔８がおいている。２は筐体の側板
を兼ている放熱板であり、筐体内側の面にはトランジス
タ１１とその温度検知をするセンサ１２が取りついてい
る。また放熱板２はシャーシ３にビス１０でシャーシ３
の底面から浮かされて固定されている。 （詳細第２図
）４は電源トランスであり、筐体前面のフロントパネル
９の中央に取りつけられているのがファン５である。こ
のファン５により、筐体内に吸いこまれ、そして筐体外
へ出される空気の流れを示したのが空気の流れ６である
。Embodiment FIGS. 1 and 2 show the structure of an embodiment of the present invention. In FIGS. 1 and 2, reference numeral 1 denotes an upper cover that covers the top and side surfaces of the casing, with ventilation holes 7 on both sides and ventilation holes 8 on the top. Reference numeral 2 denotes a heat dissipation plate which also serves as a side plate of the housing, and a transistor 11 and a sensor 12 for detecting the temperature thereof are attached to the inside surface of the housing. Also, attach the heat sink 2 to the chassis 3 with screws 10.
It is suspended from the bottom and fixed. (Details in Fig. 2) 4 is a power transformer, and a fan 5 is attached to the center of the front panel 9 on the front of the housing. Air flow 6 shows the flow of air that is sucked into the housing by the fan 5 and then taken out of the housing.
このように、上記実施例によれば、ファン５によって筐
体内におくりこまれた空気６が、またトランス４を冷却
した後、第２図に示すように、筐体底面を通シ、上カバ
ー１と放熱板２のフィンの谷部でつくったトンネル内を
上昇しながら、トランジスタ１１で熱せられた放熱板２
を冷却しながら、上カバー１にもうけた通風孔７．８よ
り筐体外へ出る。In this way, according to the above embodiment, the air 6 drawn into the housing by the fan 5 cools the transformer 4, and then passes through the bottom of the housing to the upper cover, as shown in FIG. The heat sink 2 heated by the transistor 11 rises inside the tunnel created by the valleys of the fins of the heat sink 1 and the heat sink 2.
While cooling the air, it exits from the housing through the ventilation holes 7.8 provided in the upper cover 1.
また、トランジスタ１１の表面に温度センサ１２を取り
つけることによシ、筐体内の温度を検知し、これにより
ファン５のスピードをコントロールする。Furthermore, by attaching a temperature sensor 12 to the surface of the transistor 11, the temperature inside the housing is detected, and the speed of the fan 5 is controlled thereby.
発明の効果
本発明は上記実施例より明らかなように、電子部品を冷
却するための放熱板を空気の通り道に置く構造を取り、
ファンモーターで取入れた空気で効率良く冷やすことに
より、放熱板のコストダウンと電子部品の信頼性向上に
つながるという利点を有する。Effects of the Invention As is clear from the above embodiments, the present invention has a structure in which a heat sink for cooling electronic components is placed in the air passage,
By efficiently cooling the air taken in by the fan motor, it has the advantage of reducing the cost of heat sinks and improving the reliability of electronic components.
また、ファンを温度により低速、高速の２段階にするこ
とにより、その使用状況にあった回転をさせ、設備使用
等だおける騒音の問題を解決できる。Furthermore, by setting the fan at two speeds, low speed and high speed, depending on the temperature, the fan can rotate according to the usage conditions, and the problem of noise caused by equipment usage can be solved.
第１図は本発明の一実施例における冷却装置の一部切欠
斜視図、第２図は第１図におけるＡ部断面図、第３図は
従来の冷却装置の一部切欠斜視図、第４図は第３図にお
けるＢ部断面図である。
１・・上カバー、２・・・放熱板、３・・・シャーシ、
５・ファン、７．８・・・通風孔、９・・フロントハネ
ル１２・温度センサ。
代理人の氏名 弁理士 中 尾 敏 男ほか１名第２図FIG. 1 is a partially cutaway perspective view of a cooling device according to an embodiment of the present invention, FIG. 2 is a sectional view of section A in FIG. 1, FIG. 3 is a partially cutaway perspective view of a conventional cooling device, and FIG. The figure is a sectional view of section B in FIG. 3. 1... Upper cover, 2... Heat sink, 3... Chassis,
5. Fan, 7.8... Ventilation hole, 9. Front panel 12. Temperature sensor. Name of agent: Patent attorney Satoshi Nakao and one other person Figure 2
Claims (1)
面及び側面に通気孔を有する上カバーと、前記カバーの
側面において底面から浮かされ、かつフィンを前記上カ
バー側に向けて固定された放熱板と、前記ファンのスピ
ードを前記筐体内の温度に応じて制御する温度センサと
からなる冷却装置。A fan provided on the front panel on the front of the housing, an upper cover having ventilation holes on the top and side surfaces, and a heat sink that is suspended from the bottom surface on the side of the cover and fixed with fins facing the upper cover side. and a temperature sensor that controls the speed of the fan according to the temperature inside the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785186A JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785186A JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62274644A true JPS62274644A (en) | 1987-11-28 |
| JPH079958B2 JPH079958B2 (en) | 1995-02-01 |
Family
ID=14721853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11785186A Expired - Lifetime JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079958B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02238195A (en) * | 1989-03-10 | 1990-09-20 | Fujitsu Ltd | Forced cooling by air |
| CN113946170A (en) * | 2021-10-14 | 2022-01-18 | 云南电网有限责任公司电力科学研究院 | Self-adaptive control method and system of transformer cooling device |
-
1986
- 1986-05-22 JP JP11785186A patent/JPH079958B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02238195A (en) * | 1989-03-10 | 1990-09-20 | Fujitsu Ltd | Forced cooling by air |
| CN113946170A (en) * | 2021-10-14 | 2022-01-18 | 云南电网有限责任公司电力科学研究院 | Self-adaptive control method and system of transformer cooling device |
| CN113946170B (en) * | 2021-10-14 | 2022-11-04 | 云南电网有限责任公司电力科学研究院 | Self-adaptive control method and system of transformer cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079958B2 (en) | 1995-02-01 |
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