CN215989689U - Heat dissipation device with good heat dissipation effect for voltage-stabilized power supply - Google Patents
Heat dissipation device with good heat dissipation effect for voltage-stabilized power supply Download PDFInfo
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- CN215989689U CN215989689U CN202122137911.7U CN202122137911U CN215989689U CN 215989689 U CN215989689 U CN 215989689U CN 202122137911 U CN202122137911 U CN 202122137911U CN 215989689 U CN215989689 U CN 215989689U
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Abstract
The utility model relates to the technical field of voltage-stabilized power supplies, in particular to a heat dissipation device with a good heat dissipation effect of a voltage-stabilized power supply. According to the utility model, the heat dissipation component operates to enable external air to enter the case through the four first dust screens, then, external air flow passes through the ventilation screen and the arrangement screen, so that heat at the bottom and the heat at the periphery of the stabilized voltage power supply body can be taken out of the heat dissipation pipe, when the temperature sensor senses higher temperature, the semiconductor refrigeration chip operates to generate cold air, the rotary cylinder operates to drive the sealing cover to be separated from the air inlet pipe, and then, the cold air is mixed with the external air flow to take away the heat and cool the stabilized voltage power supply body, so that the stabilized voltage power supply body is fully dissipated.
Description
Technical Field
The utility model relates to the technical field of voltage-stabilized power supplies, in particular to a heat dissipation device with a good heat dissipation effect for a voltage-stabilized power supply.
Background
The regulated power supply is an electronic device capable of providing stable alternating current or direct current for a load, and comprises an alternating current regulated power supply and a direct current regulated power supply.
Through retrieval, a patent with Chinese patent publication No. CN205726846U discloses a heat dissipation device of an alternating current stabilized voltage power supply, which comprises a heat dissipation device body, wherein the alternating current stabilized voltage power supply is positioned in the heat dissipation device body; the side wall of the heat dissipation device is provided with a heat dissipation window, the heat dissipation window is provided with heat dissipation holes, the bottom plate of the heat dissipation device body comprises a peripheral support plate and a central support plate, an opening is formed in the peripheral support plate, the central support plate is located on the peripheral support plate through a support column, and the alternating current stabilized voltage power supply is located on the central support plate. When the AC voltage-stabilized power supply generates heat, hot air flows to the outside of the heat dissipation device through the heat dissipation hole on the heat dissipation window from the inside of the heat dissipation device, and outside air enters the heat dissipation device from the heat dissipation hole, and the peripheral supporting plate is provided with an opening to form a heat exchange path with the heat dissipation hole, so that the technical problem that the heat dissipation effect of the AC voltage-stabilized power supply is not good in the prior art is solved, and the damage of the AC voltage-stabilized power supply caused by the poor heat dissipation effect is avoided.
The heat dissipation device for the alternating current stabilized power supply in the patent has the following defects: the structure is very simple, and the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a heat dissipation device with a good heat dissipation effect for a voltage-stabilized power supply.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a heat dissipation device with a good heat dissipation effect for a regulated power supply comprises a case and heat dissipation components, wherein a heat dissipation port is formed in the outer wall of the top of the case, the heat dissipation components are fixed on the inner wall of the heat dissipation port, a first partition plate is fixed to the middle upper portion inside the case, an arrangement port is formed in the middle of the outer wall of the top of the first partition plate, a ventilation net is fixed to the inner wall of the arrangement port, two symmetrically-distributed supporting columns are fixed to the outer walls of the tops of the first partition plate, which are located on two sides of the opening, the same arrangement net is fixed to the outer walls of the tops of the four supporting columns, a regulated power supply body is fixed to the outer walls of the tops of the four supporting columns, a temperature sensor is fixed to the top of the inner wall of one side of the case, and a signal end of the temperature sensor is connected with a microprocessor through a signal line;
a second partition plate is fixed at the middle lower part in the case, two symmetrically distributed ventilation openings are formed in the outer walls of two sides of the case, which are positioned between the first partition plate and the second partition plate, a first dust screen is fixed on the inner wall of each ventilation opening, an opening is formed in the middle of the outer wall of the top of the second partition plate, an air inlet pipe is fixed on the inner wall of each opening, a rotary cylinder is fixed on the outer wall of the top, which is positioned on one side of each opening, of the second partition plate, a piston rod of the rotary cylinder extends to the lower part of the second partition plate, an L-shaped rod is fixed at the bottom end of a piston rod of the rotary cylinder, a sealing cover is fixed at one end of each L-shaped rod, the sealing cover is in sliding fit with the bottom end of the air inlet pipe, and a baffle is fixed on one side of the outer wall of the bottom end of the air inlet pipe;
the refrigerator is characterized in that a mounting opening is formed in the bottom of the outer wall of one side of the cabinet, a semiconductor refrigeration chip is fixed on the inner wall of the mounting opening, the refrigeration end of the semiconductor refrigeration chip is located inside the cabinet, and auxiliary heat dissipation components are fixed on the bottom of the outer wall of one side of the cabinet, which is located around the heat dissipation end of the semiconductor refrigeration chip.
Preferably, the heat dissipation part includes the cooling tube, and the cooling tube is fixed in the inner wall of thermovent, and the inner wall bottom of cooling tube is fixed with the cross plate, and the top outer wall middle part of cross plate is fixed with first radiator fan, and the clearance between cross plate and the cooling tube is fixed with the filter screen.
Preferably, the auxiliary heat dissipation part comprises a fixed pipe, the fixed pipe is fixed to the bottom of the outer wall of one side of the case, a second heat dissipation fan is fixed to the inner wall, away from the case, of the fixed pipe, an inlet is formed in the outer wall, close to the top of the case, of the fixed pipe, a ventilation pipe is fixed to the inner wall of the inlet, and a second dust screen is fixed to the inner wall of an air inlet of the ventilation pipe.
Preferably, the heat dissipation end of the semiconductor refrigeration chip is positioned inside the fixed pipe, and the specification of the sealing cover is matched with that of the air inlet pipe.
Preferably, an opening is formed in the top of the outer wall of one side of the case, and a case door is hinged to one side of the outer wall of one side of the case.
Preferably, the box door is fixedly connected with the case through a hasp lock, and a handle is fixed on the outer wall of one side of the box door.
Preferably, the rotary cylinder, the semiconductor refrigeration chip, the first cooling fan and the second cooling fan are all connected with a switch through wires, and the switch is connected with the microprocessor through a wire.
The utility model has the beneficial effects that:
1. this heat abstractor that the radiating effect of constant voltage power supply is good, during normal heat dissipation, the radiating part operation gets into quick-witted incasement with the outside air through four first dust screens, then outside air current is through ventilation net and arrangement net, can take away constant voltage power supply body bottom heat and heat all around from the cooling tube, when temperature sensor perception temperature is higher, semiconductor refrigeration chip operation produces air conditioning, revolving cylinder operation drives sealed lid and air-supply line separation, then the mixed outside air current of air conditioning takes away the heat and cools down the constant voltage power supply body, fully dispel the heat to the constant voltage power supply body.
2. This constant voltage power supply's heat abstractor that the radiating effect is good has set up supplementary radiating part and has dispelled the heat to semiconductor refrigeration chip, and guarantee semiconductor refrigeration chip normal operating has set up first dust screen, second dust screen, ventilation net and filter screen and filters external dust, avoids the dust to cause the influence to constant voltage power supply body.
Drawings
Fig. 1 is a schematic perspective view of a heat dissipation device with a good heat dissipation effect for a regulated power supply according to the present invention;
FIG. 2 is a schematic diagram of a vertical cross-sectional structure of a heat dissipation device with a good heat dissipation effect for a regulated power supply according to the present invention;
FIG. 3 is a schematic structural diagram of a heat dissipating device with a good heat dissipating effect for a regulated power supply according to the present invention;
fig. 4 is a schematic view of a connection structure between a baffle plate and an air inlet pipe of a heat dissipation device with a good heat dissipation effect for a regulated power supply according to the present invention.
In the figure: the device comprises a case 1, a first partition plate 2, a ventilation net 3, a placement net 4, a voltage-stabilized power supply body 5, a radiating pipe 6, a first radiating fan 7, a filter screen 8, a second partition plate 9, a first dust-proof net 10, an air inlet pipe 11, a rotary cylinder 12, an L-shaped rod 13, a sealing cover 14, a baffle 15, a semiconductor refrigerating chip 16, a fixing pipe 17, a second radiating fan 18, a ventilation pipe 19, a second dust-proof net 20, a temperature sensor 21 and a box door 22.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a heat dissipation device with good heat dissipation effect for a regulated power supply comprises a case 1 and a heat dissipation component, wherein a heat dissipation port is formed in the outer wall of the top of the case 1, the heat dissipation component is fixed on the inner wall of the heat dissipation port, a first partition plate 2 is fixed on the middle upper portion inside the case 1, an installation port is formed in the middle of the outer wall of the top of the first partition plate 2, a ventilation net 3 is fixed on the inner wall of the installation port, two symmetrically distributed pillars are fixed on the outer wall of the top of the first partition plate 2 on two sides of an opening, the same installation net 4 is fixed on the outer walls of the tops of the four pillars, a regulated power supply body 5 is fixed on the outer wall of the top of the installation net 4, a temperature sensor 21 is fixed on the top of the inner wall on one side of the case 1, and a signal end of the temperature sensor 21 is connected with a microprocessor through a signal line;
a second partition plate 9 is fixed at the middle lower part in the case 1, two symmetrically distributed ventilation openings are formed in the outer walls of two sides of the case 1 between the first partition plate 2 and the second partition plate 9, a first dustproof net 10 is fixed on the inner wall of each ventilation opening, an opening is formed in the middle of the outer wall of the top of the second partition plate 9, an air inlet pipe 11 is fixed on the inner wall of each opening, a rotary air cylinder 12 is fixed on the outer wall of the top of the second partition plate 9 at one side of each opening, a piston rod of the rotary air cylinder 12 extends to the lower part of the second partition plate 9, an L-shaped rod 13 is fixed at the bottom end of the piston rod of the rotary air cylinder 12, a sealing cover 14 is fixed at one end of the L-shaped rod 13, the sealing cover 14 is in sliding fit with the bottom end of the air inlet pipe 11, a baffle 15 is fixed on one side of the outer wall of the bottom end of the air inlet pipe 11, when the heat is normally radiated, the heat radiating component operates to enable outside air to enter the case through the four first dustproof nets, and then pass through the ventilation nets and the arrangement nets, the bottom heat and the peripheral heat of the stabilized voltage power supply body can be taken out from the radiating pipe, when the temperature sensor senses higher temperature, the semiconductor refrigeration chip operates to generate cold air, the rotary cylinder operates to drive the sealing cover to be separated from the air inlet pipe, and then the cold air is mixed with external air flow to take away the heat and cool the stabilized voltage power supply body, so that the stabilized voltage power supply body is fully radiated;
the bottom of the outer wall of one side of the case 1 is provided with an installation opening, the inner wall of the installation opening is fixed with a semiconductor refrigeration chip 16, the refrigeration end of the semiconductor refrigeration chip 16 is positioned inside the case 1, the bottom of the outer wall of one side of the case 1, which is positioned around the heat dissipation end of the semiconductor refrigeration chip 16, is fixed with an auxiliary heat dissipation part, the heat dissipation part comprises a heat dissipation pipe 6, the heat dissipation pipe 6 is fixed on the inner wall of the heat dissipation opening, the bottom of the inner wall of the heat dissipation pipe 6 is fixed with a cross plate, the middle part of the outer wall of the top of the cross plate is fixed with a first heat dissipation fan 7, a filter screen 8 is fixed in the gap between the cross plate and the heat dissipation pipe 6, the auxiliary heat dissipation part comprises a fixed pipe 17, the fixed pipe 17 is fixed on the bottom of the outer wall of one side of the case 1, the inner wall of the fixed pipe 17, which is far away from the case 1, is fixed with a second heat dissipation fan 18, the outer wall of the fixed pipe 17, which is close to the top of the case 1 is provided with an inlet, and the inner wall of the inlet is fixed with a ventilation pipe 19, and the inner wall of the air inlet of the ventilation pipe 19 is fixed with a second dust screen 20, the heat dissipation end of the semiconductor refrigeration chip 16 is positioned inside the fixed pipe 17, the specification of the sealing cover 14 is matched with the specification of the air inlet pipe 11, the top of one outer wall of the case 1 is provided with an opening, one side of one outer wall of the case 1 is hinged with a case door 22, the case door 22 is fixedly connected with the case 1 through a hasp lock, one outer wall of the case door 22 is fixed with a handle, the rotary cylinder 12, the semiconductor refrigeration chip 16, the first cooling fan 7 and the second cooling fan 18 are connected with a switch through wires, and the switch is connected with the microprocessor through wires.
The working principle is as follows: when the heat is normally radiated, the first heat radiation fan 7 operates to make the outside air enter the machine case 1 through the four first dust screens 10, then the outside air flow passes through the ventilation net 3 and the arrangement net 4, the bottom heat and the peripheral heat of the regulated power supply body 5 can be brought out from the radiating pipe 6, when the temperature sensor 21 senses that the temperature is higher, the semiconductor refrigeration chip 16 operates to generate cold air, the rotary cylinder 12 operates to drive the sealing cover 14 to be separated from the air inlet pipe 11, then the mixed external air current of air conditioning takes away the heat and cools down regulated power supply body 5, fully dispels the heat to the regulated power supply body, and second radiator fan 18 dispels the heat to semiconductor refrigeration chip 16, ensures semiconductor refrigeration chip 16 normal operating, and first dust screen 100, second dust screen 20, ventilation net 3 and filter screen 8 can filter external dust, avoid the dust to cause the influence to regulated power supply body 5.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (7)
1. A heat dissipation device with good heat dissipation effect for a voltage-stabilized power supply, which comprises a case (1) and a heat dissipation component, it is characterized in that the outer wall of the top of the case (1) is provided with a heat dissipation port, a heat dissipation component is fixed on the inner wall of the heat dissipation port, the middle upper part in the case (1) is fixed with a first clapboard (2), and the middle part of the outer wall of the top part of the first clapboard (2) is provided with a mounting opening, the inner wall of the mounting opening is fixed with a ventilation net (3), and the top outer walls of the first partition board (2) at the two sides of the opening are both fixed with two symmetrically distributed pillars, the top outer walls of the four pillars are fixed with the same mounting net (4), a stabilized voltage supply body (5) is fixed on the outer wall of the top of the mounting net (4), a temperature sensor (21) is fixed on the top of the inner wall of one side of the case (1), and the signal end of the temperature sensor (21) is connected with a microprocessor through a signal wire;
a second partition plate (9) is fixed at the middle lower part in the case (1), two symmetrically distributed ventilation openings are formed in the outer walls of two sides of the case (1) between the first partition plate (2) and the second partition plate (9), a first dustproof net (10) is fixed on the inner wall of the ventilation opening, a through opening is formed in the middle of the outer wall of the top of the second partition plate (9), an air inlet pipe (11) is fixed on the inner wall of the through opening, a rotary cylinder (12) is fixed on the outer wall of the top of the second partition plate (9) on one side of the through opening, and the piston rod of the rotary cylinder (12) extends to the lower part of the second clapboard (9), an L-shaped rod (13) is fixed at the bottom end of a piston rod of the rotary cylinder (12), a sealing cover (14) is fixed at one end of the L-shaped rod (13), the sealing cover (14) is in sliding fit with the bottom end of the air inlet pipe (11), and a baffle plate (15) is fixed on one side of the outer wall of the bottom end of the air inlet pipe (11);
the refrigerator is characterized in that a mounting opening is formed in the bottom of the outer wall of one side of the cabinet (1), a semiconductor refrigeration chip (16) is fixed to the inner wall of the mounting opening, the refrigeration end of the semiconductor refrigeration chip (16) is located inside the cabinet (1), and an auxiliary heat dissipation part is fixed to the bottom of the outer wall of one side, located around the heat dissipation end of the semiconductor refrigeration chip (16), of the cabinet (1).
2. The heat dissipation device with good heat dissipation effect for voltage-stabilized power supply according to claim 1, wherein the heat dissipation component comprises a heat dissipation pipe (6), the heat dissipation pipe (6) is fixed on the inner wall of the heat dissipation port, a cross plate is fixed at the bottom of the inner wall of the heat dissipation pipe (6), a first heat dissipation fan (7) is fixed in the middle of the outer wall of the top of the cross plate, and a filter screen (8) is fixed in the gap between the cross plate and the heat dissipation pipe (6).
3. The heat dissipation device with the good heat dissipation effect for the regulated power supply according to claim 1, wherein the auxiliary heat dissipation component comprises a fixed pipe (17), the fixed pipe (17) is fixed to the bottom of an outer wall of one side of the cabinet (1), a second heat dissipation fan (18) is fixed to an inner wall, away from the cabinet (1), of the fixed pipe (17), an inlet is formed in an outer wall, close to the top of the cabinet (1), of the fixed pipe (17), a ventilation pipe (19) is fixed to an inner wall of the inlet, and a second dust screen (20) is fixed to an inner wall of an air inlet of the ventilation pipe (19).
4. The stabilized voltage power supply heat dissipation device with good heat dissipation effect according to claim 1, wherein the heat dissipation end of the semiconductor refrigeration chip (16) is located inside the fixing tube (17), and the specification of the sealing cover (14) is matched with the specification of the air inlet tube (11).
5. The heat dissipation device with a good heat dissipation effect for a regulated power supply according to claim 1, wherein an opening is formed in the top of one outer wall of the case (1), and a case door (22) is hinged to one side of one outer wall of the case (1).
6. The heat dissipation device with good heat dissipation effect for the regulated power supply according to claim 5, wherein the box door (22) is fixedly connected with the cabinet (1) through a snap lock, and a handle is fixed on the outer wall of one side of the box door (22).
7. The heat dissipation device with good heat dissipation effect for the regulated power supply according to claim 1, wherein the rotary cylinder (12), the semiconductor refrigeration chip (16), the first heat dissipation fan (7) and the second heat dissipation fan (18) are all connected with a switch through wires, and the switch is connected with the microprocessor through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122137911.7U CN215989689U (en) | 2021-09-06 | 2021-09-06 | Heat dissipation device with good heat dissipation effect for voltage-stabilized power supply |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122137911.7U CN215989689U (en) | 2021-09-06 | 2021-09-06 | Heat dissipation device with good heat dissipation effect for voltage-stabilized power supply |
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| Publication Number | Publication Date |
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| CN215989689U true CN215989689U (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122137911.7U Active CN215989689U (en) | 2021-09-06 | 2021-09-06 | Heat dissipation device with good heat dissipation effect for voltage-stabilized power supply |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938732A (en) * | 2022-12-29 | 2023-04-07 | 扬州永鼎电气科技有限公司 | High-heat-dissipation transformer with inner air guide pipe structure and working method thereof |
-
2021
- 2021-09-06 CN CN202122137911.7U patent/CN215989689U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115938732A (en) * | 2022-12-29 | 2023-04-07 | 扬州永鼎电气科技有限公司 | High-heat-dissipation transformer with inner air guide pipe structure and working method thereof |
| CN115938732B (en) * | 2022-12-29 | 2023-11-03 | 扬州永鼎电气科技有限公司 | High-heat-dissipation type transformer with inner air guide pipe structure and working method thereof |
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