JPH079958B2 - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JPH079958B2 JPH079958B2 JP11785186A JP11785186A JPH079958B2 JP H079958 B2 JPH079958 B2 JP H079958B2 JP 11785186 A JP11785186 A JP 11785186A JP 11785186 A JP11785186 A JP 11785186A JP H079958 B2 JPH079958 B2 JP H079958B2
- Authority
- JP
- Japan
- Prior art keywords
- fan
- housing
- air
- speed
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、筐体内に発熱する電子部品を有する電子機器
を冷却するための冷却装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling an electronic device having an electronic component that generates heat inside a housing.
従来の技術 第３図及び第４図は従来の冷却装置を構成を示してい
る。第３図は装置全体の斜視図であり、21は上カバーで
あり両側面に通風孔27があいており、シャーシ23にビス
29で固定されている。22は放熱板であり、筐体上部にと
りつけられ、シャーシ23にビス30にて固定されている。
24は電源トランスであり、25はファンモータであり、筐
体の後面に取り付けられており、これにより空気を筐体
に取り入れる。26はこのファン25にて取り入れられた空
気の流れを示すものである。28はフロントパネルであ
る。第４図は第３図のファン25によって取り入れた空気
26が放熱板22のフィンの間を通りぬけ、上カバー21にも
うけた通風孔27からでるところを示したものである。2. Description of the Related Art FIGS. 3 and 4 show the structure of a conventional cooling device. FIG. 3 is a perspective view of the entire apparatus, 21 is an upper cover, ventilation holes 27 are provided on both sides, and a screw is attached to the chassis 23.
It is fixed at 29. A heat radiating plate 22 is attached to the upper part of the housing and fixed to the chassis 23 with screws 30.
Reference numeral 24 is a power transformer, and 25 is a fan motor, which is attached to the rear surface of the housing, so that air is taken into the housing. Reference numeral 26 indicates the flow of air taken in by the fan 25. 28 is a front panel. FIG. 4 shows the air taken in by the fan 25 of FIG.
The reference numeral 26 shows a portion passing through between the fins of the heat dissipation plate 22 and coming out from the ventilation hole 27 provided in the upper cover 21.
第３図、第４図の様に、筐体後面から空気を取り入れ、
トランス24を冷却すると伴み、筐体上部についている放
熱板22のフィンの間に空気を通し冷却しながら、上カバ
ー21にあいている通風孔27より筐体外へ出す。この場合
のファン25の回転数は常に一定であり、電源投入時より
高速回転していた。As shown in Figs. 3 and 4, air is taken in from the rear surface of the housing,
As the transformer 24 is cooled, air is passed between the fins of the heat radiating plate 22 attached to the upper part of the housing while being cooled, and is discharged to the outside of the housing through the ventilation holes 27 formed in the upper cover 21. In this case, the rotation speed of the fan 25 was always constant, and was rotating at a higher speed than when the power was turned on.
発明が解決しようとする問題点 しかしながら、上記従来の冷却装置では、後面にファン
がついているため、ラックマウント時には新鮮な空気を
取り入れることが出来ず、また、放熱板のフィンを通る
空気の流れが水平になっているため、熱エネルギーをも
った空気が上昇する力を利用できず、ファンの風圧だけ
で空気を外に掃き出すことになり、効率的な冷却ができ
ないという問題があった。また、ファンのスピードが常
に一定で高速回転するため、設備使用などにおいて騒音
の問題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the above-described conventional cooling device, since a fan is attached to the rear surface, fresh air cannot be taken in at the time of rack mounting, and the air flow through the fins of the heat radiating plate does not occur. Since it is horizontal, it is not possible to utilize the rising force of the air having thermal energy, and the air is swept out only by the wind pressure of the fan, which causes a problem that efficient cooling cannot be performed. Further, since the fan speed is always constant and rotates at high speed, there is a problem of noise when using the equipment.
本発明はこのような従来の問題を解決するものであり、
前面から新鮮な空気をとり入れ、効果的に放熱板を冷却
するように構成すると共にファンの動作を温度検知によ
り、高速回転と低速回転の２段階に分け、騒音の問題を
解決し得る冷却装置を提供することを目的とするもので
ある。The present invention solves such conventional problems,
A cooling device that takes in fresh air from the front and effectively cools the radiator plate, and separates the fan operation into two stages, high-speed rotation and low-speed rotation, by temperature detection, to solve the noise problem. It is intended to be provided.
問題点を解決するための手段 本発明は上記目的を達成するために、前面に取り付けた
ファンにより筐体内に新鮮な空気を取り入れ、トランス
を冷却すると供に、その空気をシャーシ、カバー、放熱
板でつくった空気の通り道に導き、放熱板のフィンに沿
つて空気を上昇させながら、天面と側面上方に設けた通
風孔より掃き出すようになし、更に、筐体内で、最も温
度の高くなるトランジスタの表面に温度センサーを設け
この温度検知により、ファンのスピードをコントロール
し、トランジスタに負荷がかからず温度の低い時は、フ
ァンは低速で静かに回転し、トランジスタに大きな負荷
がかかり筐体内の温度が上昇した場合には、ファンが高
速に回転するように構成したものである。Means for Solving the Problems In order to achieve the above object, the present invention introduces fresh air into a housing by a fan mounted on the front surface and cools the transformer, and at the same time, the air is supplied to a chassis, a cover, and a radiator plate. Guide the air to the air path created by the above, and raise the air along the fins of the heat dissipation plate so that the air is blown out from the ventilation holes provided on the top and side surfaces. A temperature sensor is provided on the surface of the fan to control the speed of the fan by this temperature detection.When the transistor is not loaded and the temperature is low, the fan rotates slowly at low speed and a large load is applied to the transistor. When the temperature rises, the fan is configured to rotate at high speed.
作用 本発明は上記のような構成により次のような作用を有す
る。すなわち、ファンにより取入れた空気を筐体底面に
つくったシャーシと放熱板との隙間を通す。ここで、熱
エネルギーをもった空気が上昇する原理を利用し、放熱
板のフィンとカバーで造った空気の通り道を上昇させ放
熱板を効率良く冷却でき、その上、トランジスタの表面
に取り付けられた温度センサーにより、筐体内の温度を
検知しファンのスピードを高速から低速、低速から高速
へ自在にコントロールできるという作用を有する。Action The present invention has the following actions due to the above-mentioned configuration. That is, the air taken in by the fan is passed through the gap between the chassis formed on the bottom surface of the housing and the radiator plate. Here, by utilizing the principle that air with thermal energy rises, the passage of the air created by the fins and the cover of the heat sink can be raised to cool the heat sink efficiently, and moreover, it is mounted on the surface of the transistor. The temperature sensor detects the temperature in the housing and has the effect of freely controlling the speed of the fan from high speed to low speed and from low speed to high speed.
実施例 第１図及び第２図は本発明の一実施例の構成を示すもの
である。第１図、第２図において、１は筐体の天面及び
側面を覆う上カバーであり、両側面には通風孔７があ
り、また天面には通風孔８があいている。２は筐体の側
板を兼ている放熱板であり、筐体内側の面にはトランジ
スタ11とその温度検知をするセンサ12が取りついてい
る。また放熱板２はシャーシ３にビス10でシャーシ３の
底面から浮かされて固定されている。（詳細第２図）４
は電源トランスであり、筐体前面のフロントパネル９の
中央に取りつけられているのがファン５である。このフ
ァン５により、筐体内に吸いこまれ、そして筐体外へ出
される空気の流れを示したのが空気の流れ６である。Embodiment FIG. 1 and FIG. 2 show the construction of an embodiment of the present invention. In FIGS. 1 and 2, reference numeral 1 denotes an upper cover that covers the top surface and side surfaces of the housing, and has ventilation holes 7 on both side surfaces and a ventilation hole 8 on the top surface. Reference numeral 2 denotes a heat radiating plate which also serves as a side plate of the housing, and a transistor 11 and a sensor 12 for detecting the temperature thereof are attached to the inner surface of the housing. Further, the heat dissipation plate 2 is fixed to the chassis 3 by means of screws 10 so as to be floated from the bottom surface of the chassis 3. (Details Figure 2) 4
Is a power transformer, and the fan 5 is attached to the center of the front panel 9 on the front surface of the housing. The air flow 6 shows the flow of air sucked into the housing by the fan 5 and discharged to the outside of the housing.
このように、上記実施例によれば、ファン５によって筐
体内におくりこまれた空気６が、またトランス４を冷却
した後、第２図に示すように、筐体底面を通り、上カバ
ー１と放熱板２のフィンの谷部でつくったトンネル内を
上昇しながら、トランジスタ11で熱せられた放熱板２を
冷却しながら、上カバー１にもうけた通風孔７、８より
筐体外へ出る。As described above, according to the above-described embodiment, the air 6 taken into the housing by the fan 5 cools the transformer 4 again, and then passes through the bottom surface of the housing to pass through the upper cover 1 as shown in FIG. While rising in the tunnel formed by the fins of the heat sink 2 and cooling the heat sink 2 heated by the transistor 11, the heat is emitted from the ventilation holes 7 and 8 provided in the upper cover 1 to the outside of the housing.
また、トランジスタ11の表面に温度センサ12を取りつけ
ることにより、筐体内の温度を検知し、これによりファ
ン５のスピードをコントロールする。Further, by mounting the temperature sensor 12 on the surface of the transistor 11, the temperature inside the housing is detected, and thereby the speed of the fan 5 is controlled.
発明の効果 本発明は上記実施例より明らかなように、電子部品を冷
却するための放熱板を空気の通り道に置く構造を取り、
ファンモーターで取入れた空気で効率良く冷やすことに
より、放熱板のコストダウンと電子部品の信頼性向上に
つながるという利点を有する。As is apparent from the above embodiment, the present invention has a structure in which a heat dissipation plate for cooling electronic components is placed in the air passage,
Efficient cooling with the air taken in by the fan motor has the advantages of reducing the cost of the heat sink and improving the reliability of electronic components.
また、ファンを温度により低速、高速の２段階にするこ
とにより、その使用状況にあった回転をさせ、設備使用
等における騒音の問題を解決できる。In addition, by setting the fan in two stages of low speed and high speed depending on the temperature, it is possible to rotate the fan in accordance with its use condition, and solve the problem of noise when using equipment.
第１図は本発明の一実施例における冷却装置の一部切欠
斜視図、第２図は第１図におけるＡ部断面図、第３図は
従来の冷却装置の一部切欠斜視図、第４図は第３図にお
けるＢ部断面図である。 １…上カバー、２…放熱板、３…シャーシ、５…ファ
ン、７、８…通風孔、９…フロントパネル、12…温度セ
ンサ。1 is a partially cutaway perspective view of a cooling device according to an embodiment of the present invention, FIG. 2 is a sectional view of part A in FIG. 1, and FIG. 3 is a partially cutaway perspective view of a conventional cooling device. The drawing is a sectional view of a B part in FIG. 1 ... Top cover, 2 ... Heat sink, 3 ... Chassis, 5 ... Fan, 7, 8 ... Ventilation hole, 9 ... Front panel, 12 ... Temperature sensor.
Claims (1)
ァンと、天面及び側面に通気孔を有する上カバーと、前
記カバーの側面において底面から浮かされ、かつフィン
を前記上カバー側に向けて固定された放熱板と、前記フ
ァンのスピードを前記筐体内の温度に応じて制御する温
度センサとからなる冷却装置。1. A fan provided on a front panel on a front surface of a housing, an upper cover having ventilation holes on a top surface and side surfaces, a side surface of the cover which is floated from a bottom surface, and has fins directed toward the upper cover side. A cooling device comprising a fixed heat dissipation plate and a temperature sensor for controlling the speed of the fan according to the temperature inside the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785186A JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785186A JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62274644A JPS62274644A (en) | 1987-11-28 |
| JPH079958B2 true JPH079958B2 (en) | 1995-02-01 |
Family
ID=14721853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11785186A Expired - Lifetime JPH079958B2 (en) | 1986-05-22 | 1986-05-22 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079958B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2896154B2 (en) * | 1989-03-10 | 1999-05-31 | 富士通株式会社 | Forced air cooling method and forced air cooling device |
| CN113946170B (en) * | 2021-10-14 | 2022-11-04 | 云南电网有限责任公司电力科学研究院 | Self-adaptive control method and system of transformer cooling device |
-
1986
- 1986-05-22 JP JP11785186A patent/JPH079958B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62274644A (en) | 1987-11-28 |
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