JPS62270925A - Electrochromic element provided with conductive clip - Google Patents
Electrochromic element provided with conductive clipInfo
- Publication number
- JPS62270925A JPS62270925A JP61115349A JP11534986A JPS62270925A JP S62270925 A JPS62270925 A JP S62270925A JP 61115349 A JP61115349 A JP 61115349A JP 11534986 A JP11534986 A JP 11534986A JP S62270925 A JPS62270925 A JP S62270925A
- Authority
- JP
- Japan
- Prior art keywords
- clip
- ecd
- electrode
- layer
- taking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000605 extraction Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 239000005394 sealing glass Substances 0.000 claims description 8
- 229910000906 Bronze Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000010974 bronze Substances 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 26
- 238000004040 coloring Methods 0.000 abstract description 15
- 239000012634 fragment Substances 0.000 abstract description 10
- 230000002441 reversible effect Effects 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 abstract description 4
- 229910000457 iridium oxide Inorganic materials 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 230000004043 responsiveness Effects 0.000 abstract description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 abstract description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 abstract description 3
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001887 tin oxide Inorganic materials 0.000 abstract description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 abstract description 2
- 238000010791 quenching Methods 0.000 abstract 1
- 230000000171 quenching effect Effects 0.000 abstract 1
- 206010063836 Atrioventricular septal defect Diseases 0.000 description 41
- 238000001211 electron capture detection Methods 0.000 description 41
- 150000002500 ions Chemical class 0.000 description 15
- 239000003566 sealing material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004042 decolorization Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- -1 hydroxy ions Chemical class 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】 3、発明の詳細な説明 〔産業上の利用分野〕 本発明は、エレクトロクロミ、り素子の改良に関する。[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to improvements in electrochromic elements.
以下、エレクトロクロミックをrEcjと略称し、EC
素子をrEcDJと略称する。Hereinafter, electrochromic will be abbreviated as rEcj and EC
The element is abbreviated as rEcDJ.
電圧を印加すると可逆的に電解酸化または還元反応が起
こり可逆的r:着色する現象をエレクトロクロミズムと
言う。このような現象を示すエレクトロクロミック(以
下、ECと略称する)物質を用いて、電圧操作により着
消色するEC素子(以下、ECDと略す)を作り、この
ECDを光量制御素子(例えば、防眩ミラー)や7セグ
メントを利用した数字表示素子に利用しようとする試み
は、20年以上前から行われている。例えば、ガラス基
板の上に透明電極膜(陰掻)、三酸化タングステンal
l!、二酸化ケイ素のような絶縁膜、電極膜(陽極)を
順次積層してなるECD (特公昭52−46098参
照)が全固体型ECDとして知られている。このECD
に電圧を印加すると三酸化タングステン(WO3)薄膜
が青色に着色する。When a voltage is applied, a reversible electrolytic oxidation or reduction reaction occurs, resulting in reversible coloring. This phenomenon is called electrochromism. Using an electrochromic (hereinafter abbreviated as EC) material that exhibits such a phenomenon, we create an EC element (hereinafter abbreviated as ECD) that changes color and decolors by voltage manipulation, and use this ECD as a light amount control element (for example, Attempts have been made for more than 20 years to use this technology in numeric display devices using 7-segment mirrors and 7-segment display devices. For example, on a glass substrate, a transparent electrode film (scratching), tungsten trioxide (Al)
l! An ECD (see Japanese Patent Publication No. 52-46098) in which an insulating film such as silicon dioxide and an electrode film (anode) are sequentially laminated is known as an all-solid-state ECD. This ECD
When a voltage is applied to , the tungsten trioxide (WO3) thin film is colored blue.
その後、このECDに逆の電圧を印加すると、W O3
薄膜の青色が消えて無色になる。この着色・消色する機
構は詳しくは解明されていないが、WO1薄膜および絶
縁膜(イオン導電層)中に含まれる少量の水分がW○、
の着色・消色を支配していると理解されている。着色の
反応式は下記のように推定されている。Then, when a reverse voltage is applied to this ECD, W O3
The blue color of the thin film disappears and it becomes colorless. Although the mechanism of coloring and decoloring has not been elucidated in detail, a small amount of water contained in the WO1 thin film and insulating film (ion conductive layer) causes W○,
It is understood that it controls the coloring and decoloring of The reaction formula for coloring is estimated as follows.
陰極側:
I(□O−H’+ 0H−
WO3+nH” +ne−→H,WOt(S色透明)
(青色)陽極側:
OH−−1/2 H20+1/402 ↑+1/2e−
ところで、ECNを直接又は間接的に決む一対の電極層
は、EC層の着消色を外部に見せるために少なくとも一
方は透明でなければならない。特に透過型のECDの場
合には両方とも透明でなければへらない。透明な電極材
料としては、現在のところS n Ox % I nz
Os 、I To (S n OxとIn、O,との
混合¥!IJ)、Zn○などが知られているが、これら
の材料は比較的店明度が悪いために薄くせねばならず、
この理由及びその他の理由からECDは暴)反例えばガ
ラス)反やプラスチック板の上に形成するのが普通であ
り、このようなECDの構造の一例を第4図に示す。Cathode side: I (□O-H'+ 0H- WO3+nH" +ne-→H, WOt (S color transparent)
(Blue) Anode side: OH--1/2 H20+1/402 ↑+1/2e-
By the way, at least one of the pair of electrode layers that directly or indirectly determines the ECN must be transparent in order to show the coloring and fading of the EC layer to the outside. Particularly in the case of a transmission type ECD, both must be transparent. At present, S n Ox % I nz is used as a transparent electrode material.
Os, I To (mixture of S n Ox and In, O, IJ), Zn○, etc. are known, but these materials have relatively poor brightness and must be made thinner.
For this and other reasons, ECDs are usually formed on a substrate such as glass or plastic, and an example of the structure of such an ECD is shown in FIG.
第4図に於いて、(A)は上部透明電極、(B)は下部
透明電極、(E)は還元着色性EC層(例えばWO3)
、(D)はイオン導電層、(C)は可逆的電解酸化層又
は酸化着色性EC層(例えば酸化又は水酸化イリジウム
)をそれぞれ示し、基本的にはこの(A)〜(B)の積
層構造だけでECDが構成されるが、前述のとおり、こ
れらのECDは基板(S)上に形成される。In Figure 4, (A) is the upper transparent electrode, (B) is the lower transparent electrode, and (E) is the reduction coloring EC layer (for example, WO3).
, (D) represents an ion conductive layer, and (C) represents a reversible electrolytic oxidation layer or an oxidatively colored EC layer (e.g., iridium oxide or hydroxide), and is basically a stack of these (A) to (B). The structure alone constitutes the ECD, but as described above, these ECDs are formed on the substrate (S).
(R)はECDの封止材例えばエボキソ樹脂であり、(
G)は保護用の封止基板である。(R) is an ECD sealing material such as epoxy resin;
G) is a protective sealing substrate.
このようなECDの電極(A)、(B)に外部電源を供
給するために、各々、取出しく電極)部が必要であり、
ここに外部配線(LA )、(L、)が、ハンダ付けに
より接続されていた。In order to supply external power to the electrodes (A) and (B) of such an ECD, an extraction electrode section is required,
External wiring (LA), (L,) was connected here by soldering.
〔発明が解決しようとする問題点]
従来、取出し部は、上部電極及び下部電極と同種の材料
及び製法で形成され、そのため真空蒸着、イオンブレー
ティング、スパッタリングなどの真空薄膜形成技術によ
り形成された(イ)ITOその他の酸化物薄膜、又は(
ロ)Aeその他の金属薄膜が使用されていた。[Problems to be Solved by the Invention] Conventionally, the extraction portion has been formed using the same material and manufacturing method as the upper and lower electrodes, and therefore has not been formed using vacuum thin film forming techniques such as vacuum evaporation, ion blating, and sputtering. (a) ITO or other oxide thin film, or (
b) Ae and other metal thin films were used.
しかしながら、(イ)、(ロ)いずれの場合にも取出し
部が非常に薄いので、ハンダ付けの作業効率が悪いとい
う問題点があるほか、(イ)の場合には、特に電気抵(
にが比較的高いので、外部配線を直接ハンダ付けすると
、抵抗の低い外部配線と抵抗の高い取出し部とが一点に
おいて接触しているため、外部配線から取出し部を通し
て電極全体に供給される電荷の供給速度が遅くなり、応
答性が悪いとか着色・消色ムラが生しるという問題点が
あり、更に温水&ンR試験に供すると、外部配線が取出
し部から剥離するという問題点があった。However, in both cases (a) and (b), the lead-out part is very thin, so there is a problem that the soldering work efficiency is low.
Since the resistance is relatively high, if the external wiring is soldered directly, the external wiring with low resistance and the lead-out part with high resistance are in contact at one point, so the charge supplied from the external wiring to the whole electrode through the lead-out part is reduced. There were problems in that the supply speed was slow, resulting in poor response and uneven coloring and decoloring.Furthermore, there was a problem in that the external wiring peeled off from the outlet when subjected to the hot water test. .
(ロ)の場合には、温水浸潤試験に供すると、取出し部
が基板から剥離するという問題点があった。In the case of (b), there was a problem in that the take-out portion peeled off from the substrate when subjected to a hot water infiltration test.
従って、本発明の目的は、これらの問題点を解決し、温
水浸漬試験に供しても剥離を生ぜず、しかも外部配線か
ら取出し部を通じて電極全体に供給される電荷の供給速
度が遅くなく、そのため応答性がよく、着色・消色ムラ
の生じないECDを提供することを目的とする。Therefore, an object of the present invention is to solve these problems, to prevent peeling even when subjected to a hot water immersion test, and to ensure that the supply speed of charge supplied from the external wiring to the entire electrode through the lead-out portion is not slow. An object of the present invention is to provide an ECD that has good responsiveness and does not cause uneven coloring or decoloring.
このため、本発明のECDでは、取出し部に低抵抗の導
電性クリップを取り付け、これに外部配線を接続するこ
とにした。For this reason, in the ECD of the present invention, a low-resistance conductive clip is attached to the extraction portion, and external wiring is connected to this.
第5図は、本発明で使用される導電性クリップの一例を
示す斜視図であり、このクリップは第6図に示すように
断面が略「コ」の字形を有する略樋状のものである。FIG. 5 is a perspective view showing an example of a conductive clip used in the present invention, and as shown in FIG. 6, this clip is approximately gutter-shaped with a substantially U-shaped cross section. .
このクリップは、取出し部と接触する断片H+と、基板
を押さえる断片H2と、両者を接続する連結板部H3と
からなる。そして断片旧と断片H2で、周辺部表面に取
出し部が形成された基板周辺部を挟み込む。従って、挟
み込んだ後、クリップが基板から外れないように、断片
H,と断片H2がしっかりと基1反にかみついているこ
と力(好ましい。そのため、クリップは、第6図に示す
ように断片H,と断片H2との間が入口付近は狭く、連
結板部H3に近づくにつれ広くなる形状を有し、かつバ
ネ性を有する金属でできていることが好ましい。金属は
ハンダ付けも良好に実施できるので好ましい。好ましい
ハネ性を有する金属としては、リン青銅が挙げられるが
、その外ハガネなども使用される。金属クリップは、少
なくとも取出し部との接触面に、比較的軟らかい金属例
えばスズ、インジウム、ハンダ、それらの混合物、その
他の導電性材料で被覆されていてもよい。そのようなり
リップは、取出し部との接触が最高となろう。This clip consists of a piece H+ that contacts the take-out part, a piece H2 that presses the board, and a connecting plate part H3 that connects the two pieces. Then, the periphery of the substrate, in which the extraction portion is formed on the surface of the periphery, is sandwiched between the old fragment and the fragment H2. Therefore, to prevent the clip from coming off the board after being pinched, it is preferable that the pieces H and H2 firmly grip the base 1, as shown in FIG. , and the fragment H2 is narrow near the entrance and widens as it approaches the connecting plate H3, and is preferably made of a metal having spring properties.Metals can also be soldered well. Therefore, it is preferable. Phosphor bronze is a preferable metal having elasticity, but steel and the like may also be used.The metal clip is made of a relatively soft metal such as tin, indium, It may be coated with solder, mixtures thereof, or other conductive materials, such that the lip will have the best contact with the outlet.
なぜならば、一般には金属表面は顕微鏡で見た場合微妙
な凹凸があり、単に圧接しただけでは取出し部との良好
な接触が最高とはならないからである。またリン青銅の
クリップにスズめっきすると、耐蝕性が向上する利点も
ある。This is because metal surfaces generally have subtle irregularities when viewed under a microscope, and mere pressure contact does not provide the best possible contact with the extraction portion. Furthermore, tin plating on phosphor bronze clips has the advantage of improving corrosion resistance.
クリップは、長さに制限はないので、帯状の取出し部に
合わせて必要な長さのものを用いる。そうすれば、取出
し部とクリップとの接触面積は、非常に大きなものとな
り、両者の間の電気抵抗は少なくなり、またクリップは
低抵抗材料で作られるので、外部配線と一点で接続させ
られても、外部配線から取出し部を通じて電極への電荷
の供給はスムーズであり、応答性がよくなり、かつ着色
・消色ムラがなくなる。There is no limit to the length of the clip, so use one that has the length necessary to match the strip-shaped extraction section. In this way, the contact area between the extraction part and the clip will be very large, the electrical resistance between the two will be reduced, and since the clip is made of a low-resistance material, it will not be possible to connect it to the external wiring at a single point. Also, the supply of charge from the external wiring to the electrode through the lead-out part is smooth, the responsiveness is improved, and there is no uneven coloring or decoloring.
またクリップは、取出し部を基板に対し常に押さえつけ
ているので、仮に温水浸漬試験に供しても改出し部が基
板から剥がれる危険もない。ただ、クリップを取りつけ
るときに、取出し部を彼用する恐れがあるので、取出し
部はそれ自身強靭なIT○その他の酸化物系電極材料で
できていることが好ましい。もっとも、取り付は作業に
細心の注意を払えば、破1員の恐れは解消される。Furthermore, since the clip always presses the extraction part against the substrate, there is no risk that the modified part will peel off from the substrate even if it is subjected to a hot water immersion test. However, when attaching the clip, there is a risk that the take-out part may be used accidentally, so it is preferable that the take-out part itself is made of a strong IT○ or other oxide-based electrode material. However, if you pay close attention to the installation process, the fear of damage to the parts can be eliminated.
クリップの全体の形状は、先にほぼV状と述べたが、E
CDの形状に合わせて、長さ方向に湾曲していてもよい
。例えばECDが矩形の基)反を持っていても鋸板が全
体に円柱の円周面に沿ってR(アール)を持っている場
合や、基板が矩形ではなく円を2木の平行な直線で切り
落としたきに得られる第7図に示すごとく形状や第8図
に示すごときテレビ画面の形状を持っている場合には、
クリップはそのような基板の周辺部の形状に適合する形
状を持つこともある。As mentioned earlier, the overall shape of the clip is approximately V-shaped, but E
It may be curved in the length direction to match the shape of the CD. For example, even if the ECD has a rectangular base, the saw board has an R along the circumferential surface of the cylinder as a whole, or the board is not a rectangle but a circle with two parallel straight lines. If it has the shape shown in Figure 7, which is obtained by cutting it off, or the shape of a television screen, as shown in Figure 8,
The clip may have a shape that matches the shape of the periphery of such a substrate.
ECDが全固体’111mタイプの場合には、基板を除
< ECDそれ自身の厚さは、非常に薄<(例えば、O
,01mm以下)、それに対してクリップは千オ料の関
係から、一般に0.05〜2IIImと厚いので、巳C
Dに取りつけた場合、第9図に示すように、ECDに比
べ、クリップの断片H,は厚くなり、従ってECDの表
示部と断片H,との境に段差が生じる。そこで、この段
差を利用して封市用ガラスの位置決めを行なうと、位置
決め作業が楽に正確にできる。If the ECD is an all-solid-state 111m type, the thickness of the ECD itself, excluding the substrate, is very thin (e.g., O
, 01mm or less), whereas clips are generally thick, 0.05 to 2IIIm, due to the cost of 1,000 mm.
When attached to D, as shown in FIG. 9, the clip segment H is thicker than the ECD, and therefore a step is created at the border between the display section of the ECD and the segment H. Therefore, if this level difference is used to position the sealing glass, the positioning work can be done easily and accurately.
この位置決め作業を更に楽に正確にするために、第1O
図に示すようにクリップの断片H+ の先端を垂直に立
てて当接片H4を設けてもよい。クリノプが長さ方向に
湾曲している場合には、予め当接片H4のところどころ
に楔状のスリット(割り)を入れておくとと湾曲させ易
い。また、当接片H4は断片H1の先端の縁全体に立て
なくとも部分的でもよい。In order to make this positioning work easier and more accurate,
As shown in the figure, the abutting piece H4 may be provided by standing the tip of the clip fragment H+ vertically. When the clinop is curved in the length direction, it is easier to curve the abutment piece H4 by making wedge-shaped slits (splits) here and there in advance. Furthermore, the abutment piece H4 does not need to be erected on the entire edge of the tip of the fragment H1, and may be partially erected.
第9−に示すように、封止用ガラスの末端がクリップに
当接しており、その間に隙間が存在しないと、取出し部
がApのような腐食されやすい金属でできているときに
も、取出し部は腐食され難い。仮に隙間が存在すると、
取出し部をエボキン樹脂のごとき封止材で封止してあっ
ても封止材を突き抜けてやって来る水分の影響で取出し
部は腐食され易い。しかし、封止材を封止用ガラス及び
クリップが覆って外界との接触を断つと、取出し部は腐
食され珪い。従って、電極をA7!のような腐食されや
すい金属で形成する場合にも、取出し部又はその周辺部
だけをわざわざ腐食に強いITOその他の酸化物系材料
に変える必要がなくなり、ECDの製造コストを低下さ
せる。As shown in No. 9-, if the end of the sealing glass is in contact with the clip and there is no gap between them, the ejecting part will not be able to be removed even when the ejecting part is made of a metal that is easily corroded such as Ap. The parts are not easily corroded. If a gap exists,
Even if the take-out part is sealed with a sealant such as Evokin resin, the take-out part is susceptible to corrosion due to the influence of moisture that penetrates through the sealant. However, when the sealing material is covered with the sealing glass and the clip to cut off contact with the outside world, the ejection portion corrodes and becomes silica. Therefore, the electrode A7! Even when the ECD is made of a metal that is easily corroded, such as ECD, there is no need to change only the extraction part or the surrounding area to ITO or other oxide-based material that is resistant to corrosion, which reduces the manufacturing cost of the ECD.
本発明の特徴である導電性クリップは、エレクトロクロ
ミンク素子の周辺部の遮蔽材又は装飾材を兼用していて
もよい。特に基板側からECDを見ることになる防眩ミ
ラー(反射光量が電気的にコントロールもの)の場合に
は、なるべく表示部の面積を大きくして周辺部を細くす
ることが美観上好ましいので、兼用することは有利であ
る。The conductive clip, which is a feature of the present invention, may also serve as a shielding material or a decorative material for the periphery of the electrochromic element. In particular, in the case of an anti-glare mirror (one in which the amount of reflected light is electrically controlled) where the ECD is viewed from the board side, it is desirable for aesthetics to make the area of the display part as large as possible and the peripheral part thin, so it can be used for both purposes. It is advantageous to do so.
クリップをECDに取りつける時期は、封止前でも後で
もよいが、封止前に取り付け、封止用ガラスに封止材を
塗布したものをECDと張り合わせ、その上で封止材を
硬化させると、封止材が取出し部と断片H,との間の目
に見えない微小な隙間を通じて進入し、基板端面とクリ
ップとの間の比較的大きな隙間を埋める(第111i!
J参照)。そうすると、封止後にクリップを取りつけた
ため封止材が隙間を埋めないときに比べ、外部の水分の
取出し部への進入が封止材のために困難になるので、取
出し部が腐食されにくくなる。また、隙間に進入した封
止材が基板とクリップを接着することになるのでクリッ
プが基板から外れにくくなる利点も得られる。The clip can be attached to the ECD before or after the sealing, but if it is attached before sealing, the sealing material is applied to the sealing glass and the ECD is pasted, and then the sealing material is cured. , the sealing material enters through the invisible minute gap between the take-out part and the fragment H, and fills the relatively large gap between the substrate end surface and the clip (No. 111i!).
(see J). In this case, compared to when the clip is attached after sealing and the sealing material does not fill the gap, the sealing material makes it difficult for external moisture to enter the extraction portion, making the extraction portion less susceptible to corrosion. Further, since the sealing material that has entered the gap adheres the substrate and the clip, there is an advantage that the clip is difficult to detach from the substrate.
クリップがハンダ付は可能な材料でできている場合には
、外部配線をクリップに接続するとき、ハンダ付けすれ
ばよいが、クリップが金属でできている場合には、ハン
ダ付けに変えて圧着又は圧1帝によりt長続してもよい
。If the clip is made of a material that can be soldered, soldering is sufficient when connecting external wiring to the clip, but if the clip is made of metal, crimp or crimping may be used instead of soldering. It may last for a long time due to pressure 1.
圧着又は圧締の方法としては、金属製のクリップを使用
した場合には、例えば+11単にクリップ末端(特に断
片H3)と基板との間に剥き出しにした外部配線を挟み
込む方法、その変形例としてクリップの長さ方向の途中
に穴又は溝又はスリット(割り)を開け、この穴又は溝
を通じて剥き出しにした外部配線の先端を差入れて、ク
リップ(特に断片H1)と法(反との間に挟み込む方法
、その変形例としてクリップの長さ方向の途中に2カ所
の穴又は溝又はスリット(割り)を開け、第1の穴又は
溝又はスリット(割り)から剥き出しにした外部配線の
先端を差入れて第2の穴又は溝又はスリット (割り)
から差し出し、シ1き出しにした外部配線をクリップ(
特に断片H1)と基板との間に挟み込む方法、(2)長
めのクリップを用い、ECDからはみ出したクリップに
、剥き出しにした外部配線の先端を差入れた後、クリッ
プを押しつふず方法、(3)クリップの長さ方向の途中
又は末端に第12図に示すように例えば断面がほぼ逆「
J」の字形の圧着片Hsを設け、これの間に剥き出しに
した外部配線(L、)の先端を圧着する方法などが挙げ
られる。向、圧着片H6は、断片H,の一部を折り曲げ
て作成してもよい。As a method of crimping or clamping, when a metal clip is used, for example, +11 a method of simply sandwiching the exposed external wiring between the end of the clip (particularly fragment H3) and the board; a modification thereof is a method of using a clip. A method of making a hole, groove, or slit in the middle of the length direction, inserting the exposed end of the external wiring through this hole or groove, and inserting it between the clip (particularly fragment H1) and the wire. As a modified example, two holes, grooves, or slits (splits) are made in the middle of the length direction of the clip, and the tip of the exposed external wiring is inserted through the first hole, groove, or slit (splits). 2 hole or groove or slit (split)
Clip the exposed external wiring (
(2) Using a long clip, inserting the exposed end of the external wiring into the clip protruding from the ECD, and then pushing the clip in. 3) At the middle or end of the length of the clip, for example, as shown in FIG.
Examples include a method in which a crimping piece Hs shaped like a letter "J" is provided, and the tip of the exposed external wiring (L) is crimped between the crimping pieces Hs. Alternatively, the crimp piece H6 may be created by bending a part of the piece H.
外部配線のクリップへの接続時期は、接続がハンダ付け
の場合、ECDに取りつける前に行なうことが好ましい
。そうすれば、ECDがハンダ付けの熱を受けず、熱に
よるt負傷の危険がなくなる。When the external wiring is connected to the clip by soldering, it is preferable to connect the external wiring to the clip before attaching it to the ECD. This way, the ECD will not be exposed to the heat of soldering and there will be no risk of injury due to heat.
外部配線とクリップとの接続部は、物理的、化学的に弱
いので、封止することが好ましい。この封止は、ECD
の封止と同時に行なうと、別の封止工程が不要になるの
で特に好ましい。Since the connection between the external wiring and the clip is physically and chemically weak, it is preferable to seal it. This seal is an ECD
It is particularly preferable to carry out the sealing process simultaneously with the sealing process, since a separate sealing process is not required.
一方、本発明に於けるECDの積層構造は、持にどれと
限定されるものではないが、固体型ECDの構造として
は、例えば■電極層/EC層/イオン導電層/電極層の
ような4層構造、■電極層/還元着色型EC層/イオン
導電層/可逆的電解酸化層ないし酸化着色型ECC層重
電極層ような5層構造があげられる。On the other hand, although the laminated structure of the ECD in the present invention is not particularly limited, examples of the structure of the solid-state ECD include (i) electrode layer/EC layer/ion conductive layer/electrode layer; Examples include a four-layer structure, and a five-layer structure such as (2) electrode layer/reduction colored EC layer/ion conductive layer/reversible electrolytic oxidation layer or oxidation colored ECC layer multi-electrode layer.
透明電極の材料としては、例えばS n O2、In、
O,、I’r○などが使用される。このような電極層は
、一般には真空蒸着、イオンブレーティング、スパッタ
リングなどの真空薄膜形成技術で形成される。(還元着
色性)EC5としては一般にWOl、MoO2などが使
用される。Examples of the material for the transparent electrode include SnO2, In,
O,, I'r○, etc. are used. Such an electrode layer is generally formed by vacuum thin film forming techniques such as vacuum evaporation, ion blasting, and sputtering. (Reduction coloring property) WOl, MoO2, etc. are generally used as EC5.
イオン導電層としては、例えば酸化ケイ素、酸化タンタ
ル、酸化チタン、酸化アルミニウム、酸化ニオブ、酸化
ジルコニウム、酸化ハフニウム、酸化ランタン、フッ化
マグネシウムなどが使用される。これらの物質Tjil
’Jは製造方決により電子に対して絶縁体であるが、プ
ロトン(H゛)およびヒドロキシイオン(OH−)に対
しては良導体となる。EC層の着色消色反応にはカチオ
ンが必要とされ、H゛イオンLi゛イオンをEC層その
他に含有させる必要がある。H゛イオン初めからイオン
である必要はなり、電圧が印加されたときにH°イオン
が生しればよく、従ってH゛イオン代わりに水を含有さ
せてもよい。この水は非常に少なくて十分であり、しば
しば、大気中から自然に侵入する水分でも着消色する。As the ion conductive layer, for example, silicon oxide, tantalum oxide, titanium oxide, aluminum oxide, niobium oxide, zirconium oxide, hafnium oxide, lanthanum oxide, magnesium fluoride, etc. are used. These substances Tjil
'J is an insulator with respect to electrons due to the manufacturing method, but is a good conductor with respect to protons (H') and hydroxy ions (OH-). Cations are required for the coloring and decoloring reaction of the EC layer, and it is necessary to contain H'ions and Li'ions in the EC layer and other parts. It is no longer necessary that the H' ions are ions from the beginning; it is sufficient that H° ions are generated when a voltage is applied. Therefore, water may be contained instead of the H' ions. Very little of this water is sufficient, and often even moisture that naturally enters from the atmosphere will discolor.
EC層とイオン導電層とは、どちらを上にしても下にし
てもよい。さらにEC層に対して間にイオン導電層を挟
んで可逆的電解酸化層(ないし酸化着色型EC層)又は
触媒層を配設してもよい。The EC layer and the ion conductive layer may be placed either side up or down. Furthermore, a reversible electrolytic oxidation layer (or oxidation-colored EC layer) or a catalyst layer may be provided with an ion-conductive layer interposed between the EC layer and the EC layer.
このような層としては、例えば酸化ないし水酸化イリジ
ウム、同じくニッケル、同しくクロム、同じくバナジウ
ム、同じくルテニウム、同じくロジウムなどがあげられ
る。これらの物質は、イオン導電層又は透明電極中に分
散されていても良いし、それらを分散していてもよい。Such layers include, for example, iridium oxide or hydroxide, nickel, chromium, vanadium, ruthenium, rhodium, and the like. These substances may be dispersed in the ion conductive layer or the transparent electrode, or may be dispersed therein.
不透明な電極層は、反射層と兼用していてもよく、例え
ば金、銀、アルミニウム、クロム、スズ、亜鉛、ニッケ
ル、ルテニウム、ロジウム、ステンレスなどの金属が使
用される。The opaque electrode layer may also serve as a reflective layer, and for example, metals such as gold, silver, aluminum, chromium, tin, zinc, nickel, ruthenium, rhodium, and stainless steel are used.
以下、第1〜3図を引用して本発明を実施例により詳細
に説明する。Hereinafter, the present invention will be explained in detail with reference to Examples with reference to FIGS. 1 to 3.
矩形のガラス基板(S)の表面全体にITO電極層を形
成し、次にフォトエツチングまたはレーザーカッティン
グにより上部電極(A)用の取出し部(F)と、下部電
極(B)との間に溝を形成した。取出し部(F)とそれ
より隔離した矩形の下部電極(B)とそれに連続して続
く下部電極の取出し部(Bl)を形成した(第2〜3図
参照)。An ITO electrode layer is formed on the entire surface of a rectangular glass substrate (S), and then a groove is formed between the extraction part (F) for the upper electrode (A) and the lower electrode (B) by photoetching or laser cutting. was formed. A lead-out part (F), a rectangular lower electrode (B) isolated from the lead-out part (F), and a lead-out part (Bl) of the lower electrode continuously following the lead-out part (B) were formed (see FIGS. 2 and 3).
尚、+ 1’ Oをマスク蒸着することにより直接にこ
れらのパターンを形成してもよい。Note that these patterns may be directly formed by mask vapor deposition of +1'O.
次に酸化イリジウムと酸化スズとの混合物からなる可逆
的電解酸化層(C)、酸化タンタル層(D)及び酸化タ
ングステン層(E)を順に形成した。次に上部電i (
A)としてAl1を装着し、この時Affiは既に基板
(S)上に形成された取出し部(F)と一端が接触する
ように形成した。Next, a reversible electrolytic oxidation layer (C) made of a mixture of iridium oxide and tin oxide, a tantalum oxide layer (D), and a tungsten oxide layer (E) were formed in this order. Next, the upper electric current i (
As A), Al1 was mounted, and at this time Affi was formed so that one end was in contact with the take-out part (F) already formed on the substrate (S).
予めリン青銅製の導′七性クリップ(H)を2本用意し
、これにそれぞれ外部配線(L、)又は(Lll)をハ
ンダ付は又は逆電性接着剤にて接続した。Two conductive clips (H) made of phosphor bronze were prepared in advance, and external wiring (L, ) or (Lll) was connected to each with solder or reverse conductive adhesive.
このクリップ(H)を基板の短辺側にそれぞれ装着し、
これによりクリップの断片H,が取出し部(F)、(B
1)を圧着するようにした。Attach this clip (H) to each short side of the board,
As a result, the clip fragment H, is removed from the extraction section (F) and (B).
1) was crimped.
尚、この4電性クリツプ(トI)の形状及び寸法は、封
止用ガラス板(G)の位置決めとECD周辺の非表示部
のマスキングができるように設定しである。The shape and dimensions of this four-electrode clip (I) are set so that the sealing glass plate (G) can be positioned and the non-display area around the ECD can be masked.
最後にエポキシ樹脂封止材(R)を多めに塗布した封止
用ガラス板(G)をECDの上に重、4合わせ、対向す
る2本のクリ、プの間にガラス板(G)を納めた。2本
のクリップの間隔とガラス1反(C)の長さをほぼ一敗
させであるので、クリップの間にガラス板(G)を納め
ることでガラス板(G)の位置決めは、容易にかつ素早
くできた。Finally, lay the sealing glass plate (G) coated with a large amount of epoxy resin sealant (R) on top of the ECD, and place the glass plate (G) between the two opposing holes. I paid it. Since the distance between the two clips and the length of one glass (C) are approximately the same, positioning of the glass plate (G) can be easily and easily achieved by placing the glass plate (G) between the clips. It was done quickly.
封止材(R)が硬化するまで放置すると、余分の封止材
(R)が取出し部、クリップの一部、外部配線接続部を
覆い、かつ基+7i(S)とり’J ノブとの隙間を埋
め、それらを封止した。これによりクリップは基板に確
固として接着され、外すことはできなかった。If the sealing material (R) is left until it hardens, the excess sealing material (R) will cover the extraction part, part of the clip, and the external wiring connection part, and will cover the gap between the base +7i (S) and the knob. and sealed them. This made the clip firmly adhered to the board and could not be removed.
こうして、本実施例のECDを作製した。このECDの
垂直断面を第1図に示す。この図は、一部をデホルメし
てあり、正確な寸法比を有しない。In this way, the ECD of this example was produced. A vertical section of this ECD is shown in FIG. This figure is partially deformed and does not have accurate dimensional ratios.
このECDに駆動電源(Su)から着色電圧(+1.3
5V)を印加すると、左板(S)側から入射させた波長
633 nmの光(L)に対し、反射率が15%に減少
しく10秒後)、この反射率は電圧印加を止めても、し
ばらく保たれた。今度は消色電圧(−1,35V)を印
加すると、同じく反射率は65%に回復した(10秒後
)。Coloring voltage (+1.3
When a voltage of 5V) is applied, the reflectance decreases to 15% for light (L) with a wavelength of 633 nm incident from the left plate (S) side (after 10 seconds), and this reflectance remains unchanged even after the voltage application is stopped. , was held for a while. When a decoloring voltage (-1.35 V) was applied this time, the reflectance recovered to 65% (after 10 seconds).
従って、本実施例のECDは、自動車その他の防眩ミラ
ーとして有用で、後ろから接近する自動車の強いライト
がミラーに当たったとき、電圧を印加して反射率を落と
せば、ドライバーは眩しくなくなる。Therefore, the ECD of this embodiment is useful as an anti-glare mirror for automobiles and other vehicles, and when a strong light from a car approaching from behind hits the mirror, the driver will not be dazzled by applying a voltage to reduce the reflectance.
向、この実施例では、上部電極、下部電極とも取出し部
は基板の短辺側にそれぞれ1カ所設けたが、端末部にも
取出し部を設け、両方から電荷を供給してもよい。この
場合には、一方の電極の取出し部を基板の両短辺側に設
け、他方の電極の取出し部を基板の両長辺側に設け、ク
リップは基板の4辺全部に設けることになる。In this embodiment, the upper electrode and the lower electrode each have one extraction portion on the short side of the substrate, but an extraction portion may also be provided at the terminal portion, and charges may be supplied from both. In this case, the extraction portions of one electrode are provided on both short sides of the substrate, the extraction portions of the other electrode are provided on both long sides of the substrate, and the clips are provided on all four sides of the substrate.
以上の通り、本発明によれば、ECDの電極の取出し部
に予め導電性クリップを取り付け、これを介して外部配
線を接続するので、[11E CDの応答性が良好にな
り、着色・消色ムラを生ぜす、(2)外部配線の接続作
業性が良好になり、(3)温水浸漬試験に供しても基板
から取出し部が剥離したり外部配線との接続部が剥離す
ることもなくなり、ECDの(8転性が向上する。As described above, according to the present invention, since a conductive clip is attached in advance to the electrode extraction part of the ECD and external wiring is connected through this, the responsiveness of the [11E CD] is improved, and coloring/decolorization is achieved. (2) The connection workability of external wiring is improved, and (3) the lead-out part from the board does not peel off from the board or the connection part with external wiring does not peel off even when subjected to a hot water immersion test. ECD's (octavertability improves.
第1図は、本発明の実施例1にかかるECDの概略垂直
断面図である。
第2図は、前記実施例1にかかる電極の形成された基板
(S)の概略平面図である。
第3図は、第2図の矢視断面図である。
第4図は、従来のECDの概略垂直断面図である。
第5図は、導電性クリップの一例を示す斜視図である。
第6図は、第5回の導電性クリップの断面図である。
第7図は、基板の一例を示す平面図である。
第8図は、基板の一例を示す平面図である。
第90は、第111ffiよりも実際に近い寸法比で表
した本発明0ECDの一例を示す概略断面図である。
第1O図は、他の例のl性クリップの断面図である。
第11図は、基板と4電性クリツプとの隙間に封止材が
進入した様子を示す説明図である。
第12図は、更に別の例のl性クリップの断面図である
。
(主要部分の符号の説明)
S −−−・−一−l&十反
A −−−−一 上部電極
B −・−−−−−一−−下部電極
B+ ””−””’−下部電極の取出し部E −・−一
−−−−−・ 還元着色性EC層又はW○3層F −
m−−−・−上部電極の取出し部H−一−−−−−−−
− 導電性クリップC−−−−−−一 封止用ガラス板
R−・・−一−−〜−封止材FIG. 1 is a schematic vertical sectional view of an ECD according to Example 1 of the present invention. FIG. 2 is a schematic plan view of the substrate (S) on which the electrodes according to the first embodiment are formed. FIG. 3 is a sectional view taken along the arrow in FIG. 2. FIG. 4 is a schematic vertical cross-sectional view of a conventional ECD. FIG. 5 is a perspective view showing an example of a conductive clip. FIG. 6 is a cross-sectional view of the fifth conductive clip. FIG. 7 is a plan view showing an example of the substrate. FIG. 8 is a plan view showing an example of the substrate. No. 90 is a schematic cross-sectional view showing an example of the 0ECD of the present invention expressed in a dimension ratio closer to the actual size than No. 111ffi. FIG. 1O is a sectional view of another example of the l-type clip. FIG. 11 is an explanatory diagram showing how the sealing material has entered the gap between the substrate and the tetraelectric clip. FIG. 12 is a sectional view of yet another example of the l-type clip. (Explanation of symbols of main parts) S ----・-1-l & Tentan A -----1 Upper electrode B -・-----1 - Lower electrode B+ ""-""'- Lower electrode Take-out part E -・-1----- Reduction coloring EC layer or W○3 layer F -
m-----Top electrode extraction part H-1---------
- Conductive clip C-----1 Sealing glass plate R-...-1-- Sealing material
Claims (1)
下部電極からなるエレクトロクロミック素子において、 前記上部電極及び下部電極の取出し部にそ れぞれ導電性クリップを取り付け、これを介して外部配
線を接続することを特徴とするエレクトロクロミック素
子。 2 前記導電性クリップが、コの字形の断面を有する略
樋状の金属からなることを特徴とする特許請求の範囲第
1項記載のエレクトロクロミック素子。 3 前記金属がバネ性を有する金属からなることを特徴
とする特許請求の範囲第2項記載のエレクトロクロミッ
ク素子。 4 前記金属がリン青銅であることを特徴とする特許請
求の範囲第3項記載のエレクトロクロミック素子。 5 前記取出し部に取り付けた導電性クリップによって
封止用ガラス板の位置決めを行なうことを特徴とする特
許請求の範囲第1項記載のエレクトロクロミック素子。 6 前記導電性クリップが、エレクトロクロミック素子
の周辺部の遮蔽材を兼用していることを特徴とする特許
請求の範囲第1項記載のエレクトロクロミック素子。 7 前記導電性クリップがエレクトロクロミック素子の
周辺部の装飾材を兼用していることを特徴とする特許請
求の範囲第1項記載のエレクトロクロミック素子。[Claims] 1. In an electrochromic element comprising at least an upper electrode, an electrochromic layer, and a lower electrode, conductive clips are attached to the lead-out portions of the upper electrode and the lower electrode, respectively, and external wiring is connected through these. An electrochromic element characterized by: 2. The electrochromic device according to claim 1, wherein the conductive clip is made of a substantially gutter-shaped metal having a U-shaped cross section. 3. The electrochromic device according to claim 2, wherein the metal is made of a metal having spring properties. 4. The electrochromic device according to claim 3, wherein the metal is phosphor bronze. 5. The electrochromic device according to claim 1, wherein the sealing glass plate is positioned by a conductive clip attached to the extraction portion. 6. The electrochromic device according to claim 1, wherein the conductive clip also serves as a shielding material for the periphery of the electrochromic device. 7. The electrochromic device according to claim 1, wherein the conductive clip also serves as a decorative material for the periphery of the electrochromic device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61115349A JPH083593B2 (en) | 1986-05-20 | 1986-05-20 | Electrochromic device with metal clip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61115349A JPH083593B2 (en) | 1986-05-20 | 1986-05-20 | Electrochromic device with metal clip |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62270925A true JPS62270925A (en) | 1987-11-25 |
JPH083593B2 JPH083593B2 (en) | 1996-01-17 |
Family
ID=14660322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61115349A Expired - Lifetime JPH083593B2 (en) | 1986-05-20 | 1986-05-20 | Electrochromic device with metal clip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH083593B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19737978A1 (en) * | 1997-08-30 | 1999-03-11 | Bayer Ag | Electrochromic mirror |
US6950221B1 (en) * | 2000-05-22 | 2005-09-27 | Murakami Corporation | Electrode structure of EC mirror |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068520U (en) * | 1983-10-17 | 1985-05-15 | 日立マクセル株式会社 | electrochromic display element |
-
1986
- 1986-05-20 JP JP61115349A patent/JPH083593B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068520U (en) * | 1983-10-17 | 1985-05-15 | 日立マクセル株式会社 | electrochromic display element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19737978A1 (en) * | 1997-08-30 | 1999-03-11 | Bayer Ag | Electrochromic mirror |
DE19737978C2 (en) * | 1997-08-30 | 1999-09-16 | Bayer Ag | Electrochromic mirror |
US6280041B1 (en) | 1997-08-30 | 2001-08-28 | Bayer Aktiengesellschaft | Electrochrome mirror |
US6950221B1 (en) * | 2000-05-22 | 2005-09-27 | Murakami Corporation | Electrode structure of EC mirror |
Also Published As
Publication number | Publication date |
---|---|
JPH083593B2 (en) | 1996-01-17 |
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EXPY | Cancellation because of completion of term |