JPH0631452Y2 - An electrochromic device equipped with a long clip provided with a slit portion and an external wiring connection portion - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to improvement of an electrochromic device.

Hereinafter, electrochromic is abbreviated as “EC” and EC element is abbreviated as “ECD”.

[Conventional technology]

The phenomenon in which a reversible electrolytic oxidation or reduction reaction occurs when a voltage is applied to cause reversible coloring is called electrochromism. Attempts have been made to make an ECD that is colored and erased by voltage operation using an EC substance exhibiting such a phenomenon, and to use the ECD for a light quantity control element (for example, an antiglare mirror) or a numeral display element using 7 segments. It has been done for over 20 years. For example, an ECD (see Japanese Examined Patent Publication No. 52-46098) formed by sequentially laminating a transparent electrode film (cathode), a thin film of tungsten trioxide, an insulating film such as silicon dioxide, and an electrode film (anode) on a glass substrate is an all solid-state ECD. Known as. When a voltage is applied to this ECD, the tungsten trioxide (WO ₃ ) thin film is colored blue. After that, when a reverse voltage is applied to this ECD, the blue color of the WO ₃ thin film disappears and becomes colorless. The mechanism for coloring and erasing is not clarified in detail, but it is understood that a small amount of water contained in the WO ₃ thin film and the insulating film (ion conductive layer) controls the coloring and erasing of WO _3. ing.

By the way, at least one of the pair of electrode layers sandwiching the EC layer directly or indirectly must be transparent in order to show the color of the EC layer to the outside. Especially in the case of a transmissive ECD, both must be transparent. Currently, transparent electrode materials include SnO ₂ , In ₂ O ₃ , and ITO (S
Although a mixture of nO ₂ and In ₂ O ₃ ), ZnO, etc. are known, these materials have to be thin because they have relatively poor transparency, and for the above reason and other reasons, ECD
Is usually formed on a substrate such as a glass plate or a plastic plate. In order to supply an external power source to such an ECD, each extraction (electrode) part is required.

Conventionally, the take-out portion is formed of the same material and manufacturing method as the upper electrode and the lower electrode, and thus is formed by a vacuum thin film forming technique such as vacuum deposition, ion plating, and sputtering. (A) ITO or other oxide thin film or (b) Al
Other metal thin films were used.

However, in both cases (a) and (b), there is a problem that the work efficiency of soldering is inferior because the take-out part is very thin. When soldering directly, the external wire with low resistance and the outlet with high resistance are in contact with each other at one point, so the supply speed of the electric charge supplied to the entire electrode from the external wire through the outlet is slowed, and the responsiveness is poor. There is a problem that it is bad, or coloring and decoloring unevenness occur. Further, when subjected to a hot water immersion test, there was a problem that the external wiring was peeled off from the extraction part.

Also in the case of (b), there was a problem that the take-out portion was peeled from the substrate when subjected to the hot water immersion test. Therefore, even if these problems are solved and subjected to a hot water immersion test, peeling does not occur,
In addition, the supply speed of the electric charge supplied from the external wiring to the entire electrode through the extraction portion is not slow, and therefore, a low resistance conductive clip is provided for the purpose of supplying an ECD having good responsiveness and free from uneven coloring and decoloring. The invention of mounting and connecting external wiring thereto was made.
270925 and is known.

After that, an improved invention was made with respect to the ECD, S62 3
A patent application was filed with a date of 20th. (JP-A-63-2314)
78) Since this application has not yet been published at this time, the following is summarized. The improved invention (JP-A-63-23147)
8) is a method in which a slit portion is provided in a conductive clip as a means for solving the problem of the prior invention (Japanese Patent Laid-Open No. 62-270925), and the following effects are obtained.

The sealing material applied from above the slit portion easily enters the inside of the clip through the slit portion, so that the electrode lead-out portion is sufficiently sealed and the durability of the ECD is improved.

For the same reason, the adhesive force between the substrate and the clip is improved, and the clip becomes hard to come off.

Generally, a clip has a long tendency to be curved or wavy in the longitudinal direction. As a solution to this problem, a slit provides a low contact resistance, and the clip has a strong biting force (mounting force) on the substrate.

Even if the end surface of the substrate has a curvature, the clip can be or easily bent along the substrate, and the adhesion strength, appearance, and sealing workability are improved.

[Problems to be solved by the invention]

However, if the conductive clip is simply provided with the slit portion, when the substrate end surface has a particularly large curvature,
It was sometimes difficult to bend the clip along the end face of the board.
That is, it is difficult to attach the clip to the end surface of the substrate having a large curvature, and thus the contact between the clip and the electrode extraction portion on the substrate may be deteriorated. Further, in the above-mentioned conventional technique, it is usual that the conductive clip is attached to the EC and then the lead wire is directly soldered to the conductive clip. At this time, the soldering part is heated, but since the conductive clip is in close contact with the EC,
The temperature rise of the EC is unavoidable. Since EC is generally very weak against heat, there is a problem that peeling of a film or the like occurs due to heat during soldering. If the conductive clip is made of a material that cannot be soldered, a method of sandwiching the exposed external wiring between the conductive clip and the board, and a variation of that method is to insert it in the middle of the length of the conductive clip. It was necessary to devise a method such as forming a hole, a groove, or a slit (split), inserting the tip of the external wiring exposed through the hole or the groove, and sandwiching it between the conductive clip and the substrate. The present invention has been made in view of such conventional problems, and when the substrate end surface of the substrate on which the ECD is formed has a particularly large curvature, the work of mounting the clip on the substrate (electrode extraction portion on the substrate) Of the ECD, improving the contact between the clip and the electrode extraction part on the board, improving the workability of connecting the external wiring, and preventing the deterioration and destruction of the ECD characteristics due to heat during soldering (when connecting the external wiring). To aim.

[Means for solving problems]

For the above-mentioned purpose, in the ECD of the present invention, a fragment H1 that comes into contact with the extraction part and a fragment H2 that presses the substrate of the ECD are provided in the extraction parts of the upper electrode and the lower electrode that form the ECD.
There is no contact between the connecting plate portion H3 that connects the two pieces, the wide slit portions S1 and S2 that are symmetrically provided between the pieces of the former piece H1 and between the pieces of the latter piece H2, and the substrate. A long conductive clip composed of the external wiring connection portion A and was attached.

[Action]

FIG. 1 shows wide slit portions S1 and S2 according to the present invention.
FIG. 3 is a side view showing an example of a long conductive clip provided with an external wiring connection portion A.

In a long clip, a piece H1 that comes into contact with the take-out part
The slits S1 between and the slits S2 between the pieces H2 holding the substrate are symmetrically opposed to each other, and since the slits S1 and S2 are wide, even when the substrate end surface has a particularly large curvature, The clip can be easily attached to the substrate (electrode extraction portion on the substrate), and moreover, uniform and good contact can be obtained. Therefore, the workability of mounting the clip on the substrate and the contactability with the electrode extraction portion on the substrate are improved.

Further, since the clip is provided with the external wiring connection portion A that does not contact the substrate, the connection between the external wiring and the external wiring connection portion A is facilitated and the workability is improved.

Further, when the external wiring is connected by soldering, since the external wiring connecting portion A is not in contact with the substrate, the temperature rise of the ECD on the substrate due to heat is caused by the external wiring connecting portion being in contact with the substrate. Much less compared to the case. Therefore, it is possible to prevent the characteristics of the ECD from being deteriorated or destroyed.

〔Example〕

 Next, an embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 3, a glass substrate (1) having a lens shape having an end face having a particularly large curvature is formed on the front surface of the glass substrate (1) by a vacuum deposition method or an ion plating method.
TO layer (2), IrO ₂ / SnO ₂ layer (3), Ta ₂ O
₅ layers (4), WO ₃ layers (5) and upper ITO layer (6) were formed in order. The film thickness of each layer is 200, 15 in the order of processing.
It was set to 0, 500, 500 and 200 nm.

Conductive clip (7) of the shape shown in FIG. 1 prepared in advance
The conductive clip was attached to each of the electrode layers of the lower ITO layer (2) and the upper ITO layer (6), and the conductive clip pressed the electrode layer.

As shown in FIG. 1, the conductive clip has wide slit portions S1 and S2, and a fragment H that contacts the take-out portion.
Since the slits S1 between the slits 1 and the slits S2 between the pieces H2 that press the substrate are symmetrically opposed to each other, even when the substrate end face has a particularly large curvature, the slits S1 and Substrate (electrode extraction part on the substrate)
It was easy to put on.

Further, the clip is provided with an external wiring connecting portion A which does not come into contact with the substrate, and an external wiring is soldered to the ECD of the present example to manufacture the external wiring connecting portion A, but the external wiring connecting portion A comes into contact with the substrate. Since it was not done, the connection of the external wiring was easy.

A plan view of this ECD is shown in FIG.

When a voltage was applied to the ECD from a driving power source and the transmittance was measured, the transmittance was 70% to 20% in a range of ± 1.35V.
% Has changed. Further, it was confirmed that the coloring was uniform, the contact between the clip and the electrode lead-out portion was uniform and good, and the ECD characteristics were not deteriorated by soldering.

[Effect of device]

ADVANTAGE OF THE INVENTION According to this invention, when the board | substrate end surface of the board | substrate which formed ECD has especially large curvature, the mounting workability of the clip to a board | substrate (electrode extraction part on a board) is improved, the clip and the electrode extraction part on a board | substrate. It is possible to obtain various effects such as improvement of contactability with the external wiring, improvement of workability of connection of external wiring, and prevention of deterioration or destruction of characteristics of ECD due to heat during soldering (connection of external wiring).

[Brief description of drawings]

FIG. 1 is a side view of a clip provided with a slit portion and an external wiring connection portion according to the present invention. FIG. 2 is a sectional view of an EC device according to an embodiment of the present invention. FIG. 3 is a plan view of an EC device according to an embodiment of the present invention. [Main part of the description of the codes] 1 ...... substrate, 2 ...... lower electrode 3 ...... _IrO 2 / SnO ₂ layer 4 ...... _Ta 2 _{O 5} layer, 5 ...... Wo _3-layer 6 ...... upper electrode 7 ...... Clip with slit and external wiring connection

Claims (1)

[Scope of utility model registration request] 1. An electrochromic device comprising at least an upper electrode, an electrochromic layer and a lower electrode, which is provided on a substrate having an end face portion having a large curvature. A piece that comes into contact with the piece, a piece that presses the substrate, a connecting plate part that connects both pieces, and a wide slit part that is symmetrically provided between each piece of the former piece and between each piece of the latter piece. An electrochromic device comprising a long conductive clip including an external wiring connecting portion that is not in contact with the substrate.